Artificial Intelligence
Insights on the High Performance Computing Global Market to 2026 – Featuring Amazon Web Services, Atos and Advanced Micro Devices Among Others
Dublin, Jan. 21, 2021 (GLOBE NEWSWIRE) — The “High Performance Computing Market by Component, Infrastructure, Services, Price Band, HPC Applications, Deployment Types, Industry Verticals, and Regions 2021 – 2026” report has been added to ResearchAndMarkets.com’s offering.
The High Performance Computing market includes computation solutions provided either by supercomputers or via parallel processing techniques such as leveraging clusters of computers to aggregate computing power. HPC is well-suited for applications that require high performance data computation and analysis such as high frequency trading, autonomous vehicles, genomics-based personalized medicine, computer-aided design, deep learning, and more. Specific examples include computational fluid dynamics, simulation, modeling, and seismic tomography.
This report evaluates the HPC market including companies, solutions, use cases, and applications. Analysis includes HPC by organizational size, software and system type, server type, and price band, and industry verticals. The report also assesses the market for integration of various artificial intelligence technologies in HPC. It also evaluates the exascale-level HPC market including analysis by component, hardware type, service type, and industry vertical.
Select Report Findings:
- The AI-powered HPC market will reach $22B globally by 2026, driven largely by simulations, engineering and design solutions.
- There is a very long tail opportunity in HPC that will be realized through use of AI tools. HPCaaS will reach scale only through greater supercomputer accessibility.
- Bio-sciences is the fastest growing HPC sector followed by government, manufacturing, finance and energy.
- Up to 52% of revenue will be directly attributable to the cloud-based business model via HPCaaS, which makes High-Performance Computing solutions available to a much wider range of industry verticals and companies, thereby providing computational services to solve a much broader array of problems.
- There is a strong relationship between future sixth generation (6G) solutions and HPC. More specifically, the 6G technology market will enable certain advanced capabilities such as wireless sensing and detection that will entail the use of enormous amounts of data.
- High Performance Computing (HPC) may be provided via a supercomputer or via parallel processing techniques such as leveraging clusters of computers to aggregate computing power. HPC is well-suited for applications that require high performance data computation such as certain financial services, simulations, and various R&D initiatives.
The market is currently dominated on the demand side by large corporations, universities, and government institutions by way of capabilities that are often used to solve very specific problems for large institutions. Examples include financial services organizations, government R&D facilities, universities research, etc.
However, the cloud-computing based “as a Service” model allows HPC market offerings to be extended via HPC-as-a-Service (HPCaaS) to a much wider range of industry verticals and companies, thereby providing computational services to solve a much broader array of problems. Industry use cases are increasingly emerging that benefit from HPC-level computing, many of which benefit from split processing between localized devices/platforms and HPCaaS.
In fact, HPCaaS is poised to become much more commonly available, partially due to new on-demand supercomputer service offerings, and in part as a result of emerging AI-based tools for engineers. Accordingly, up to 52% of revenue will be directly attributable to the cloud-based business model via HPCaaS, which makes High-Performance Computing solutions available to a much wider range of industry verticals and companies, thereby providing computational services to solve a much broader array of problems.
In a 2020 study, we conducted interviews with major players in the market as well as smaller, lesser known companies that are believed to be influential in terms of innovative solutions that are likely to drive adoption and usage of both cluster-based HPC and supercomputing. In an effort to identify growth opportunities for the HPC market, we investigated market gaps including unserved and underserved markets and submarkets. The research and advisory firm uncovered a market situation in which HPC currently suffers from an accessibility problem as well as inefficiencies and supercomputer skill gaps.
Stated differently, the market for HPC as a Service (e.g. access to high-performance computing services) currently suffers from problems related to the utilization, scheduling, and set-up time to run jobs on a supercomputer. We identified start-ups and small companies working to solve these problems.
One of the challenge areas identified is low utilization but (ironically) also high wait times for most supercomputers. Scheduling can be a challenge in terms of workload time estimation. About 23% of jobs are computationally heavy and 37% of jobs cannot be defined very well in terms of how long jobs will take (within a 3-minute window at best). In many instances, users request substantive resources and don’t actually use computing time.
In addition to the scheduling challenge, we also identified a company focused on solving additional problems such as computational planning and engineering. We spoke with the principal of a little-known company called Microsurgeonbot, Inc. (doing business as MSB.ai), which is developing a tool for setting up computing jobs for supercomputers.
The company is working to solve major obstacles in accessibility and usability for HPC resources. The company focuses on solving a very important problem in HPC: Supercomputer job set-up and skills gap. Their solution known as “Guru” is poised to make supercomputing much more accessible, especially to engineers in small to medium-sized businesses that do not have the same resources or expertise as large corporate entities.
Target Audience:
- ICT service providers
- Governments and NGOs
- ICT infrastructure providers
- Data and computing companies
Key Topics Covered:
1 Executive Summary
2 Introduction
2.1 Next Generation Computing
2.2 High Performance Computing
2.2.1 HPC Technology
2.2.2 Exascale Computation
2.2.3 High Performance Technical Computing
2.2.4 Market Segmentation Considerations
2.2.5 Regulatory Framework
2.2.6 Value Chain Analysis
2.2.7 AI to Drive HPC Performance and Adoption
3 High Performance Computing Market Dynamics
3.1 HPC Market Drivers
3.2 HPC Market Challenges
4 High Performance Computing Market Analysis and Forecasts
4.1 Global High Performance Computing Market 2021 – 2026
4.1.1 Total High Performance Computing Market
4.1.2 High Performance Computing Market by Component
4.1.3 High Performance Computing Market by Deployment Type
4.1.4 High Performance Computing Market by Organization Size
4.1.5 High Performance Computing Market by Server Price Band
4.1.6 High Performance Computing Market by Application Type
4.1.7 High Performance Computing Deployment Options: Supercomputer vs. Clustering
4.1.8 High Performance Computing as a Service (HPCaaS)
4.1.9 AI Powered High Performance Computing Market
4.2 Regional High Performance Computing Market 2021 – 2026
4.2.1 High Performance Computing Market by Region
4.2.2 North America High Performance Computing Market by Component, Deployment, Organization, Server Price Band, Application, Industry Vertical, and Country
4.2.3 Europe High Performance Computing Market by Component, Deployment, Organization, Server Price Band, Application, Industry Vertical, and Country
4.2.4 APAC High Performance Computing Market by Component, Deployment, Organization, Server Price Band, Application, Industry Vertical, and Country
4.2.5 MEA High Performance Computing Market by Component, Deployment, Organization, Server Price Band, Application, Industry Vertical, and Country
4.2.6 Latin America High Performance Computing Market by Component, Deployment, Organization, Server Price Band, Application, Industry Vertical, and Country
4.2.7 High Performance Computing Market by Top Ten Country
4.3 Exascale Computing Market 2021 – 2026
4.3.1 Exascale Computing Driven HPC Market by Component
4.3.2 Exascale Computing Driven HPC Market by Hardware Type
4.3.3 Exascale Computing Driven HPC Market by Service Type
4.3.4 Exascale Computing Driven HPC Market by Industry Vertical
4.3.1 Exascale Computing as a Service
5 High Performance Computing Company Analysis
5.1 HPC Vendor Ecosystem
5.2 Leading HPC Companies
5.2.1 Amazon Web Services Inc.
5.2.2 Atos SE
5.2.3 Advanced Micro Devices Inc.
5.2.4 Cisco Systems
5.2.5 DELL Technologies Inc.
5.2.6 Fujitsu Ltd
5.2.7 Hewlett Packard Enterprise
5.2.8 IBM Corporation
5.2.9 Intel Corporation
5.2.10 Microsoft Corporation
5.2.11 NEC Corporation
5.2.12 Nvidia
5.2.13 Rackspace Inc.
6 High Performance Computing Market Use Cases
6.1 Fraud Detection in the Financial Industry
6.2 Healthcare and Clinical Research
6.3 Manufacturing
6.4 Energy Exploration and Extraction
6.5 Scientific Research
6.6 Electronic Design Automation
6.7 Government
6.8 Computer Aided Engineering
6.9 Education and Research
6.10 Earth Science
7 Conclusions and Recommendations
8 Appendix: Future of Computing
8.1 Quantum Computing
8.1.1 Quantum Computing Technology
8.1.2 Quantum Computing Considerations
8.1.3 Market Challenges and Opportunities
8.1.4 Recent Developments
8.1.5 Quantum Computing Value Chain
8.1.6 Quantum Computing Applications
8.1.7 Competitive Landscape
8.1.8 Government Investment in Quantum Computing
8.1.9 Quantum Computing Stakeholders by Country
8.1.10 Other Future Computing Technologies
8.1.11 Market Drivers for Future Computing Technologies
8.2 Future Computing Market Challenges
8.2.1 Data Security Concerns in Virtualized and Distributed Cloud
8.2.2 Funding Constrains R&D Activities
8.2.3 Lack of Skilled Professionals across the Sector
8.2.4 Absence of Uniformity among NGC Branches including Data Format
For more information about this report visit https://www.researchandmarkets.com/r/1frr52
CONTACT: ResearchAndMarkets.com Laura Wood, Senior Press Manager [email protected] For E.S.T Office Hours Call 1-917-300-0470 For U.S./CAN Toll Free Call 1-800-526-8630 For GMT Office Hours Call +353-1-416-8900
Artificial Intelligence
Rockwell Automation and its PartnerNetwork™ Ecosystem Present Artificial Intelligence, Autonomous Operations, 5G and Cybersecurity in Driving Digital Transformation at Hannover Messe 2024
In collaboration with partners including Cisco, Ericsson, Microsoft, ODVA, the OPC Foundation and NVIDIA, Rockwell will showcase the latest technologies shaping the future of industrial operations
DUSSELDORF, Germany, April 18, 2024 /PRNewswire/ — Rockwell Automation, Inc. (NYSE: ROK), the world’s largest company dedicated to industrial automation and digital transformation, will showcase its innovative, industry-leading technology and services with its partners, including Microsoft and Cisco, at the Hannover Messe 2024 trade fair, April 22-26, in Hannover, Germany.
Rockwell will collaborate with its PartnerNetwork™ ecosystem and demonstrate solutions that address a variety of challenges for industrial companies, including modernizing operations, achieving sustainability goals and accelerating digital transformation.
“Our partnerships embody a shared vision of building and delivering the best solutions to drive digital transformation in industry and enable intelligent factories,” said Malte Dieckelmann, vice president, enterprise software sales, Europe, Middle East and Africa, Rockwell Automation. “We do this by simplifying how manufacturers design, operate and maintain their operations and empower their people in a secure, connected enterprise.”
In collaboration with Cisco, Ericsson, Microsoft, ODVA, the OPC Foundation and NVIDIA, Rockwell will present technology and services that help solve complex challenges with solutions for the entire value chain of a digital transformation journey.
Artificial intelligence (AI), autonomous operations, 5G and cybersecurity are among key technologies that help manufacturers accelerate their digital transformation. According to Rockwell’s recently published 9th annual “State of Smart Manufacturing Report,” industrial companies around the world cite artificial intelligence as their top priority for new investment over the next 12 months.
At the Microsoft booth, visitors will see the latest technology integrations between the two companies, including how AI is transforming manufacturing through a customer-inspired digital twin of a quality inspection process using artificial intelligence, highlighted by a real-world simulation of product sorting and autonomous material handling.
Following a recently announced collaboration with NVIDIA, Rockwell will share how it is integrating NVIDIA Omniverse Cloud application programming interfaces (APIs) into Emulate3D by Rockwell Automation, bringing users data interoperability, live collaboration and physically based visualization for designing, building and operating industrial-scale digital twins of production systems.
At the Cisco booth, Rockwell will present how the two companies enable a secure connected industrial environment leveraging Rockwell’s Converged Plantwide EthernetTM reference architecture (CPwE) with its co-developed industrial ethernet switching, as well as cybersecurity solutions such as Cisco® Cyber Vision, which enables network segmentation, asset discovery and security monitoring.
Rockwell will highlight its collaboration with Ericsson by demonstrating Plex Asset Performance Management (APM) – enabled by industrial private 5G connectivity – driving real-time decision-making and managing new assets such as autonomous mobile robots (AMRs). Private 5G allows manufacturers to be more agile, flexible and sustainable while adding more devices and intelligence to their networks.
Rockwell is also partnering with ODVA, a standards development organization, to demonstrate the benefits of EtherNet/IP, CIP Security™ and 5G. Reliable wireless industrial automation appliances using EtherNet/IP and CIP Safety in private 5G networks will be shown. Also on display will be recent wireless device additions to Rockwell’s EtherNet/IP product portfolio.
Finally, Rockwell will be at the booth of OPC Foundation, an industry group that maintains standards for the secure and reliable information exchange in industrial applications. Rockwell offers scalable OPC UA solutions for machine builders and end users through Embedded Edge Compute Modules and the FactoryTalk® Optix™ software platform, supporting heterogeneous software applications and control environments.
About Rockwell AutomationRockwell Automation, Inc. (NYSE: ROK), is a global leader in industrial automation and digital transformation. We connect the imaginations of people with the potential of technology to expand what is humanly possible, making the world more productive and more sustainable. Headquartered in Milwaukee, Wisconsin, Rockwell Automation employs approximately 29,000 problem solvers dedicated to our customers in more than 100 countries. To learn more about how we are bringing Connected Enterprise to life across industrial enterprises, visit www.rockwellautomation.com.
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Artificial Intelligence
LG STRENGTHENS EUROPEAN PRESENCE WITH ITS KITCHEN SOLUTIONS SHOWCASE AT MDW 2024
Featuring Advanced AI Technologies and Sleek Design, Company’s Expanded Lineup of Built-in Appliances Brings Outstanding Convenience and Style to the Kitchen
SEOUL, South Korea, April 18, 2024 /PRNewswire/ — LG Electronics (LG) is unveiling its latest built-in kitchen appliances at Milan Design Week (MDW) 2024, taking place in Milan, Italy, from April 16-21. At the center of LG’s Milan showcase are the brand-new Signature Kitchen Suite built-in oven, free zone induction hob, and downdraft hood. Boasting innovative, premium design and highly-convenient features, the company’s refined built-in solutions bring exceptional ease-of-use and effortless elegance to the kitchen.
Signature Kitchen Suite Built-in Oven with Advanced Cooking Technologies
Debuting at MDW 2024 and designed with European consumers in mind, the Signature Kitchen Suite 60-centimeter (24-inch) built-in oven offers a variety of cutting-edge features and AI technologies to elevate the culinary experience. Equipped with Gourmet AI™️, the oven can identify what the user is cooking and automatically select the appropriate cooking mode from 130 recipes. Gourmet AI also enables ‘browning’ control for foods such as pizza and steak, actively keeping tabs on the cooking process and notifying users via the ThinQ™️ app as soon as their food is done. Thanks to video-recognition, LG’s intelligent oven can suggest the optimal settings for the dish being prepared, while real-time video monitoring and time-lapse recording make it easy to check on the progress of one’s meal using the ThinQ app.
Employing enhanced ProBake powered by inverter technology, the new oven delivers uniform heat and fast, efficient cooking with an A++ energy rating. LG’s innovative technology rotates the convection fan back and forth to ensure shorter preheating times, even heating, and crispier results when using the oven’s Air Fry mode. The company’s unique InstaView™️ technology further enhances user convenience, making it possible to see inside simply by knocking twice on the oven door.
Free Zone Induction Hob for Convenient and Flexible Cooking
The Signature Kitchen Suite’s 90-centimeter (36-inch) free zone induction hob presents next-level flexibility and ease-of-use, allowing users to place any size and type of cookware – such as Paella pans and moka pots – anywhere on its cooking surface.* The new appliance can detect and track the position of cookware, eliminating the need to manually cancel and reapply settings when moving a saucepan or skillet from one part of the cooking surface to another. What’s more, the AI technology embedded in the hob can detect the temperature of cookware and automatically lower the heat when necessary, helping to minimize spills and splatter when boiling water or preparing soups and sauces.
Expanded Built-in Lineups for Diverse Kitchen Lifestyles
LG is further bolstering its built-in product lineup with the introduction of the new Signature Kitchen Suite downdraft hood. Made to integrate seamlessly into islands and countertops, the 90-centimeter (36-inch) hood offers a sleek, sophisticated look with its chic black glass and modern frame design. It also provides powerful ventilation, effectively extracting steam and odors for a more pleasant cooking experience.
Additionally, LG has expanded its portfolio of built-in appliances for the European market. Along with new products, such as an 80-centimeter (30-inch) induction hob and built-in combi refrigerators and microwave ovens, the company now provides a wider range of options within its oven lineups – from more product variation to a greater choice of colors and sizes. Among the new models are the Signature Kitchen Suite 122 centimeter (48 inch)-wide French-door refrigerator and stunning appliances from the Transitional lineup, featuring slim handles and satin stainless steel exteriors with a velvety matte finish. To help customers create a curated kitchen aesthetic, the company offers an array of new finishes for its premium built-in products, with black stainless steel and stainless steel joining the previously-introduced black glass finish.
“We are thrilled to showcase our latest built-in innovations at this year’s Milan Design Week, demonstrating our commitment to leading new design trends and meeting the diverse needs of European customers,” said Lyu Jae-cheol, president of LG Electronics Home Appliance & Air Solution Company. “LG will continue to strengthen its presence in Europe through an expanded range of built-in appliances delivering style, performance and convenience in the kitchen.”
Visitors to MDW 2024 in Milan from April 16-21 can experience LG’s latest built-in lineups at the LG booth at Milan Fairgrounds.
* Cookware recognition may vary depending on the size or number of items placed on the surface.
About LG Electronics Home Appliance & Air Solution Company
The LG Home Appliance & Air Solution Company is a global leader in home appliances, air solutions as well as smart home solutions featuring LG ThinQ. The company is creating various solutions with its industry leading core technologies and is committed to making life better and sustainable for consumers and the planet by developing thoughtfully designed kitchen appliances, living appliances, HVAC and air purification solutions. Together, these products deliver enhanced convenience, superb performance, efficient operation and sustainable lifestyle solutions. For more news on LG, visit www.LGnewsroom.com.
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Artificial Intelligence
DataTracks Celebrates Completion of 19 Years
SINGAPORE, April 18, 2024 /PRNewswire/ — DataTracks, a provider of cloud-based software to automate/generate compliance reports for filing with financial/security regulators to more than 28,000 business enterprises in 26 countries, celebrates the completion of 19 years of service and innovation. Founded with a vision to make regulatory compliance “accurate, reliable, timely, and easy”, DataTracks has grown into a leading name in the industry, worldwide with cutting edge software that incorporates “artificial intelligence” aided features to reduce “time to prepare” and improve “accuracy”.
Decades of Dedication and Expertise
Over nearly two decades, DataTracks has achieved significant growth, with its software delivering more than 400,000 reports, showcasing its pivotal role in regulatory reporting. The software and service address regulations across diverse jurisdictions, including SEC in the USA, HMRC and FCA in the UK, Revenue in Ireland, CIPC in South Africa, ACRA in Singapore, MCA in India, SSM in Malaysia and ESMA, EBA, and EIOPA in Europe.
DataTracks distinguishes itself in the industry
(a) with its global footprint (preferred by business enterprises whose regulatory obligations are spread across multiple jurisdictions)
(b) with its state-of-the art software that incorporates “AI/ML” features and
(c) with its credentials for information security (including ISO 9001:2015 and ISO 27001:2013 certifications)
Addressing the employees and spouses in a town hall meeting to celebrate the event, Vinod P John, President of DataTracks said: “We are happy to start our 20th year in the industry. I have to thank the 28,000 clients who trust us and the several hundred employees who developed our software and who helped customers (and our internal team) prepare compliance reports for reaching this milestone. We’ve always believed in leveraging technology to make regulatory compliance as easy, quick, timely, and accurate as possible for our clients. Our continuous investment in AI and machine learning is a testament to this belief, and it’s what keeps us at the forefront of the industry.”
Looking ahead, DataTracks is ready to address upcoming mandates such as the DATA Act and FTA in the US as well as the MBRS/XBRL mandate by SSM in Malaysia.
About DataTracks
DataTracks is a Singapore-based globally renowned leader in providing cloud-based regulatory compliance software for self-use and “black box services” using the same software, catering to 28,000 clients across 26 countries. In 19 years DataTracks has helped its client enterprises prepare more than 400,000 compliance reports for filing with financial/security regulators in several jurisdictions. Financial analysts have rated the quality of reports generated using DataTracks as top of industry for quality; significantly above that of several of its competitors. For further information, visit www.datatracks.com.
For Business Enquiries: Email: [email protected]; Phone: Singapore: +6531582850, US: +1(646)9048324, UK: +44(0)2036088035
Media Contact: [email protected]
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