Artificial Intelligence
The Advanced Packaging Market was valued at USD 24.93 billion in 2020, and it is expected to reach a value of USD 38.62 billion by 2026, at a CAGR of 7.8% over the forecast period (2021 – 2026)
New York, April 19, 2021 (GLOBE NEWSWIRE) — Reportlinker.com announces the release of the report “Advanced Packaging Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” – https://www.reportlinker.com/p06039472/?utm_source=GNW
– Advanced packaging technology has evolved to minimize the cost involved and enhance the overall throughput and performance of ICs. Further, With the augmented adoption of semiconductor ICs in automobiles, the demand for advanced packaging has increased considerably in recent years.
– As people are shifting toward connected devices, an increase in the Internet of Things (IoT) will lead to the growth of semiconductor packaging. The growth in the demand for consumer wearable goods, smartphones, and home appliances will have a positive impact on this industry. With IoT being a significant driver, security is a primary concern for the user. The semiconductor manufacturers have to work to develop more secure chips continually.
– At the start of 2020, TSMC was investing heavily in 5nm fabrication. TSMC’s 7nm process is in its peak, receiving vast numbers of orders from AMD for its Ryzen 3000-series CPUs and Navi graphics cards and other customers include Apple and Huawei. On the 5nm front, TSMC is working with EUV lithography, similar to what Samsung is accomplishing, and the company is expecting 10% of 2020’s year’s revenue to come from its 5nm EUV lines. After the 3nm process will take over, and TSMC expects mass production to start in 2022.
– Moreover, AI is driving the development of 3D TSV and heterogeneous integration technologies. The 3D integration is offering unequaled performances suiting exactly the pressing needs of AI applications. TSMC’s CoWoS advanced packaging technology combines memory chips and logic computing in a 3-D way for high computing products targeting artificial intelligence, cloud computing, data center, and supercomputer applications. This 3-D integration gives way for power-efficient high-speed computing while reducing heat and CO2 emissions.
– With the recent outbreak of COVID 19, the advanced packaging market will witness a decline in growth due to restrictions on the movement of goods and severe disruptions in the semiconductor supply chain. Moreover, the major semiconductor vendors are working with reduced capacity owing to the spread of COVID-19 virus across the world. For instance, Foxconn iPhone production operations located about 300 miles from Wuhan in Zhengzhou operated with 10-20 % capacity due to workforce issues forced by the lockdown of cities.
Key Market Trends
Fan-out Wafer Level Packaging Expected to Witness Significant Growth Rate
– Fan-out wafer-level packaging (FOWLP) has emerged as a promising technology to meet the ever-increasing demands of consumer electronic products. The significant advantages of this type of packaging are specific features such as substrate-less package, lower thermal resistance, and higher performance due to shorter interconnects combined with direct IC connection by thin-film metallization instead of the standard wire bonds or flip-chip bumps and more moderate parasitic effects.
– Fan-out wafer-level packaging (FOWLP) is the latest packaging trend in the field of microelectronics. With various technological developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers, and other package-on-package approaches, larger substrate formats are targeted with the help of FOWLP. Hence, it is well suited for the packaging of a highly miniaturized energy harvester system consisting of a piezo-based harvester, a power management unit, and a supercapacitor for energy storage.
– The fan-out wafer-level packaging (FOWLP) technology is being perceived as an alternative to 2.5D packaging. Fan-out is capable of multiple dies, as compared to fan-in wafer-level chip-scale package (WLCSP) technology, that handles a single die. Fan-out technology gained popularity in 2016 when Apple integrated its 16 nm A10 application processor with the mobile DRAM in a single package inside the iPhone 7. Apple used TSMC’s Integrated Fan-out (InFO) packaging technology, which the company had been developing since 2014.
– Moreover, TSMC is increasing its InFO-PoP packaging capacity for processing A13 processor chips that power the new iPhone SE devices. Several packaging organizations are moving closer to the production of panel-level fan-out packaging. This next-generation technology is expected to reduce the cost of today’s fan-out packages. Nepes, Samsung, ASE are among the major players that have already installed the equipment in their panel-level fan-out lines with production scheduled in 2019.
Asia-Pacific is Expected to Witness Significant Growth Rate
– Asia-Pacific is expected to grow at a significant rate. It has been a major revenue-generating region during the forecast period, primarily due to the growing population and the customer-side demand. Major semiconductor manufacturing companies present were present from a significant amount of time in the region are fueling the need for advanced semiconductor packaging. By prioritizing enhancements in end-to-end yield, semiconductor companies based in the Asia-Pacific region are managing cost pressures and efficiently sustaining higher profitability. The path forward involves a shift in mindsets, as well as the deployment of advanced packaging solutions.
– Further, China is one of the largest growing economies present with a large population, and according to statistics from China’s semiconductor association, the import of IC was witnessing an increase in the demand for the consecutive years from 2014. The Chinese government has deployed a multi-pronged strategy, which led to the support of domestic IC industry development to achieve the goal of becoming the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the demand for advanced packaging.
– Japanese companies are expected to continue to have high-end materials, given past and on-going R&D efforts and know-how, providing them leverage to become top suppliers. For instance, Renesas, a Japanese semiconductor manufacturer, leads semiconductor R&D spending in Japan with USD 1.1 billion, followed closely by Sony Semiconductor Solutions USD 1 billion.
– With the outbreak of COVID-19, countries such as China and Japan, enforcing strict lockdown policies, production, and movement of critical raw materials used for the advanced packaging market is highly scarce in the global market. Due to the shortage of laborers, many packages and testing plants in countries such as China have reduced or even stopped operations, which have created a bottleneck for chip companies that rely on such back-end packages and testing capacity. However, the semiconductor operations remained uninterrupted in South Korea, and chip exports grew by 9.4% in February 2020.
Competitive Landscape
The Advanced Packaging Market is witnessing dominance by ten to fifteen significant players like Intel Corporation, Samsung Electronics Co. Ltd. The market is significantly driven by end-user revenue because of the demand for the latest technology and high-speed gadgets. Sustainable competitive advantage is being attained by the companies through innovations in this market, owing to the growing need for differentiated products for various applications. The constant evolution of technological developments in smartphones, tablets, wireless communications, etc., will have a positive impact on this industry.
– April 2020 – TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. TSMC has announced that it has kick-started research and development for the 2nm process in 2019 itself. The semiconductor manufacturing company is yet to deliver Apple’s next-gen 5nm mobile chip slated to release in the last quarter of this year. The earliest the company expects it to be ready for the masses is 2025.
– July 2019 – Intel added new technology to advanced packaging with three new technologies co-EMIB, ODI, and MDIO for building chips out of smaller silicon die and boosting the bandwidth between them in a package.
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Artificial Intelligence
Global Insurance Provider Selects 3CLogic to Streamline AI and Contact Center Capabilities with ServiceNow
Multinational Insurance Broker to deploy 3CLogic’s solution with ServiceNow’s Financial Service Operations (FSO) platform to streamline customer experiences.
ROCKVILLE, Md., April 25, 2024 /PRNewswire/ — 3CLogic, the leading Conversational AI and Contact Center solution for ServiceNow®, today announced its selection by a global insurance provider to replace its existing contact center infrastructure as part of a larger CX transformation effort. The strategic decision is designed to complement the organization’s use of ServiviceNow’s Financial Services Operations (FSO) offering leveraged across a number of its existing product lines including Customer Warranty Claims, Roadside Assistance, and Home Warranties.
Serving millions of customers worldwide with innovative insurance and protective products, the organization required a solution that would enhance its recent investment in the ServiceNow platform as it works to transform its end-to-end customer service operations. The deployment will incorporate several of 3CLogic’s AI-powered capabilities purpose-built for ServiceNow, including Conversational AI, Speech Analytics, and AI Performance & Coaching, along with integrated call transcriptions, convenient 2-way SMS, and ServiceNow-centralized contact center reporting.
“We continue to see enterprises eager to complement their existing investment in digital platforms, such as ServiceNow, with contact center features purpose-built to extend the workflows and features they already have and use,” explains Matt Durkin, VP of Global Sales at 3CLogic. “It’s no secret that organizations are already juggling too many systems, often with overlapping capabilities, which impacts ROI and operational efficiency. We’re proud to offer an alternative approach that helps simplify the technology stack while optimizing the overall operational costs and outcomes.”
Recently named to Constellation Research’s 2024 Shortlist for Digital Customer Service and Support, 3CLogic has seen global adoption of its solution by leading enterprises in healthcare, manufacturing, travel, retail, higher education, finance, non-profits, and Managed Service Providers across five continents. As a ServiceNow-certified Technology and Build partner with offerings available for ServiceNow’s IT Service Management, Customer Workflows, HR Service Delivery, and Source-to-Pay solutions, the company will be unveiling its latest set of capabilities at ServiceNow’s annual Knowledge 2024 event this May in Las Vegas.
For more information, please contact [email protected].
About 3CLogic3CLogic transforms customer and employee experiences with its leading Cloud Contact Center and AI solutions purpose-built to enhance today’s leading CRM and Customer Service Management platforms. Globally available and leveraged by the world’s leading brands, its offerings empower enterprise organizations with innovative features such as intelligent self-service, generative and Conversational AI, agent automation & coaching, and AI-powered sentiment analytics – all designed to lower operational costs, maximize ROI, and optimize each interaction across IT Service Desks, Customer Support, Sales or HR Services teams. For more information, please visit www.3clogic.com.
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View original content:https://www.prnewswire.co.uk/news-releases/global-insurance-provider-selects-3clogic-to-streamline-ai-and-contact-center-capabilities-with-servicenow-302127739.html
Leading Breast AI Company, creator of industry-leading Transpara®, promotes from within for new CEO
NIJMEGEN, Netherlands, April 25, 2024 /PRNewswire/ — ScreenPoint Medical, today announced a significant transition in its leadership as Mark Koeniguer, the current CEO, steps down from his position. Mark served as CEO since 2022 and was instrumental in ScreenPoint’s commercial growth and success over the past 2 years.
The company’s Board of Directors has appointed Pieter Kroese as the new Chief Executive Officer effective April 25, 2024. Pieter takes the role after serving as COO of ScreenPoint for over five years. During that time, he has managed the transition of the company from an early startup to a thriving enterprise with hundreds of customers using ScreenPoint’s flagship Transpara software to support millions of scans a year.
“I am thrilled to lead ScreenPoint into its next phase of growth and innovation,” said Mr. Kroese. “I am deeply committed to building upon the strong foundation we have and continuing to work closely with our talented team to drive continued success. We are already expanding screening capacity and capability through proven reader support – we look forward to increasing our ability to support providers and women moving forward.”
Sir Michael Brady, Chairman of the Board at ScreenPoint Medical and a co-founder of the company, expressed enthusiasm about Pieter’s appointment, stating, “Pieter’s remarkable leadership qualities, coupled with his depth of knowledge of our product and industry, make him the perfect choice to lead ScreenPoint into the future. His strategic mindset and commitment to excellence align perfectly with our company mission of early breast cancer detection. Pieter has been an integral part of our growth to date and will provide seamless leadership through this transition into our next chapter for our customers, partners, and team.”
Author of “No Longer Radical” and over a hundred peer-reviewed publications on breast imaging, Dr. Rachel Brem is a Transpara user and ScreenPoint Board Member. Dr. Brem welcomed Mr. Kroese with the following: “Pieter has been an integral part of the ScreenPoint team for years. I am confident that his leadership will continue to deliver product excellence: earlier detection with outstanding reading workflow and improved patient outcomes. We continue to see these results from clinical sites all over the world, including many here in the United States. No other Breast AI solution has demonstrated the same results as Transpara, and I am confident that the team will continue to push on these frontiers under Pieter’s leadership.”
The entire team at ScreenPoint extends its gratitude to Mark Koeniguer and wishes him every success in the future, while warmly welcoming Pieter Kroese into his new role as CEO.
About ScreenPoint Medical
ScreenPoint Medical translates cutting edge machine learning research into technology accessible by radiologists to improve screening workflow, decision confidence and breast cancer risk assessment. Transpara is trusted by radiologists globally because it has been developed by experts in machine learning and image analysis and updated with user feedback from world-renowned breast imagers.
See all the proof at: https://screenpoint-medical.com/evidence.
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WESTFORD, Mass., April 25, 2024 /PRNewswire/ — The growing need for automation, technological developments, and long-term cost reductions are driving a robust expansion in the worldwide robotics market. SkyQuest projects that Global Robotics Market size is poised to grow from USD 41.50 Billion in 2023 to USD 126.96 Billion by 2031, at a CAGR of 15% during the forecast period (2024-2031).
Download a detailed overview:
https://www.skyquestt.com/report/robotics-market
Browse in-depth TOC on the “Robotics Market”
Pages – 202Tables – 64Figures – 75Robotics Market Overview:
Report Coverage
Details
Market Revenue in 2023
$41.50 billion
Estimated Value by 2031
$126.96 billion
Growth Rate
Poised to grow at a CAGR of 15%
Forecast Period
2024–2031
Forecast Units
Value (USD Billion)
Report Coverage
Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
Segments Covered
Application, End Users, and Region
Geographies Covered
North America, Europe, Asia Pacific, and the Rest of the world
Report Highlights
Collaborative Robotics
Key Market Opportunities
Prompting Several Industries to Adopt Automation Technologies
Key Market Drivers
Increasing Demand for Automation
Surge of Automation is Supporting Growth of Robotics Industry
The industrial sector is generating high revenues for the global robotics market owing to extensive automation in manufacturing, which increases productivity and lowers overall production costs. Assembly line, painting, and welding robots have become essential, thereby propelling substantial market expansion in the automotive, electronics, and heavy duty sectors. Due to the increased usage of robots for non-manufacturing functions such as customer service, shipping, and healthcare, the services sector is expanding quickly. This rapid growth is being driven by technological improvements and the push for automation in services.
Surge in Advance Robotics is Bolstering Market Growth
The use of robotics in manufacturing processes is growing, and innovation in this field is happening quickly worldwide. By increasing productivity, efficiency, and precision, advanced robotics technologies—such as AI-driven automation systems and collaborative robots, or cobots—are transforming the manufacturing sector. The dominance of manufacturing in the worldwide robotics market is fuelled by the integration of robotics into manufacturing facilities, which helps businesses remain competitive in today’s dynamic market scenario.
Rising Interest in Service Robotics is Driving Demand for Robotics in Asia Pacific
Due to the strong demand for industrial and service robots in the region, Asia Pacific now leads the global robotics industry. China, Japan, and South Korea are among the nations that have made significant investments in the robotics sector recently. The Middle East and Africa are anticipated to register the fastest-growing rate for the global robotics market. The expansion is ascribed to the region’s growing adoption of automation technology, especially in the manufacturing and logistics industries.
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https://www.skyquestt.com/speak-with-analyst/robotics-market
Drivers:
Increasing Demand for AutomationAdvancements in AI and Machine Learning TechnologiesRestraints:
High Initial InvestmentsLack of Skilled WorkforceProminent Players in Global Robotics Market:
FANUC America Corporation (US)Epson Robotics (Japan)Staubli International AG (Switzerland)YRG Inc. (US)Comau S.p.A. (Italy)Northrop Grumman Corporation (US)Honda Motor Co., Ltd. (Japan)Seiko Epson Corporation (Japan)Yamaha Motor Co., Ltd. (Japan)Adept Technology, Inc. (US)View report summary and Table of Contents (TOC):
https://www.skyquestt.com/report/robotics-market
Key Questions Answered in Global Robotics Market Report
How big is the global robotics market, and what compound annual growth rate (CAGR) is it anticipated to deliver between 2024 and 2031?Which industries are fuelling the need for automation and fostering the expansion of the robotics sector?What impact have recent technological advancements and innovations had on the direction of the robotics market?Which well-known companies in the robotics industry are also major players in the global robotics market?This report provides the following insights:
Analysis of key drivers (increasing demand for automation across industries, improved the overall efficiency, productivity of the processes, demand for automation), restraints (high initial investments, difficult for small and medium-sized enterprises to invest, robots, sensors, and other equipment required not delivered), opportunities (advancements in AI and machine learning technologies, new opportunities for the robotics market, perform complex tasks with high accuracy), and challenges (lack of skilled workforce, maintenance of these robotics systems) influencing the growth of robotics marketMarket Penetration: Comprehensive information on the product portfolios offered by the top players in the robotics marketProduct Development/Innovation: Detailed insights on the upcoming trends, R&D activities, and product launches in the robotics marketMarket Development: Comprehensive information on lucrative emerging regionsMarket Diversification: Exhaustive information about new products, growing geographies, and recent developments in the marketCompetitive Assessment: In-depth assessment of market segments, growth strategies, revenue analysis, and products of the leading market players.Related Reports:
Global Service Robotics Market
Global Soft Robotics Market
Global Warehouse Robotics Market
Global Cloud Robotics Market
Global Robotic Welding Market
About Us:
SkyQuest is an IP focused Research and Investment Bank and Accelerator of Technology and assets. We provide access to technologies, markets and finance across sectors viz. Life Sciences, CleanTech, AgriTech, NanoTech and Information & Communication Technology.
We work closely with innovators, inventors, innovation seekers, entrepreneurs, companies and investors alike in leveraging external sources of R&D. Moreover, we help them in optimizing the economic potential of their intellectual assets. Our experiences with innovation management and commercialization have expanded our reach across North America, Europe, ASEAN and Asia Pacific.
Contact:Mr. Jagraj SinghSkyquest Technology1 Apache Way,Westford,Massachusetts 01886USA (+1) 351-333-4748Email: [email protected] Our Website: https://www.skyquestt.com/
View original content:https://www.prnewswire.co.uk/news-releases/robotics-market-to-surpass-usd-126-96-billion-by-2031–skyquest-technology-302127230.html
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