Artificial Intelligence
Advanced Packaging Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)
New York, Oct. 27, 2021 (GLOBE NEWSWIRE) — Reportlinker.com announces the release of the report “Advanced Packaging Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” – https://www.reportlinker.com/p06039472/?utm_source=GNW
Key Highlights
Advanced packaging technology has evolved to minimize the cost involved and enhance the overall throughput and performance of ICs. Further, With the augmented adoption of semiconductor ICs in automobiles, the demand for advanced packaging has increased considerably in recent years.
The innovation in the packaging technology is also related to an increase in the functional density of large system-on-chip solutions. As a result, the focus on heterogeneous integrations and wafer-level packages have prompted the chip industry to develop a new set of solutions, collectively known as advanced packaging.
Another significant trend affecting the advanced packaging market is the increase in the size of silicon from 100 mm to 300 mm. The shift to longer diameter wafers has reduced the cost of manufacturing by 20-25%, which is expected to drive this capital into advanced packaging solutions.
Growing miniaturization of devices, increasing MEMS adoption is also helping the embedded die packaging market gain renewed demand. Though the technology is not new in the market, it has been diversified to niche applications due to high cost and low yield but has immense potential for development in the future. Advancements in Bluetooth and RF modules and the rise of WiFi-6 could further fuel investments in the technology.
However, according to the Semiconductor Industry Association, strict controls and conditions position semiconductor production facilities to be more resistant to the impact of COVID-19 as a typical cleanroom have a maximum of only ten particles per cubic meter in a size range of 0.1 micrometers and the average size of the COVID-19 microbe is 0.125 micrometers. Moreover, most semiconductor operations in various countries, such as South Korea, continued uninterrupted, and chip exports grew by 9.4% in February 2020.
Key Market Trends
Fan-out Wafer Level Packaging Expected to Witness Significant Growth Rate
The redistribution technology was primarily developed out of necessity to enable fan-in area array packaging (bumping) to take hold when a few chips were being designed for the area array. In the intervening years, this technology has been instrumental in developing multiple newer packaging technologies such as wafer-level packaging (WLP), fan-out packaging, and TSV-based interposers and chip stacks.
Fan-out wafer-level packaging (FOWLP) has emerged as a promising technology to meet the ever-increasing demands of consumer electronic products. The significant advantages of this type of packaging are specific features such as substrate-less package, lower thermal resistance, and higher performance due to shorter interconnects combined with direct IC connection by thin-film metallization instead of the standard wire bonds or flip-chip bumps and more moderate parasitic effects.
Fan-out wafer-level packaging (FOWLP) is the latest packaging trend in the field of microelectronics. With various technological developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers, and other package-on-package approaches, larger substrate formats are targeted with the help of FOWLP. Hence, it is well suited for packaging a highly miniaturized energy harvester system consisting of a piezo-based harvester, a power management unit, and a supercapacitor for energy storage.
The vendors in the market are also innovating their processes to expand their technology. For instance, in November 2020, Samsung presented a paper titled “Advanced RDL Interposer Packaging Technology for Heterogeneous Integration.” The company stated that it had developed an RDL Interposer package as a 2.5D package platform that was based on RDL-first fan-out wafer level package (FOWLP).
There has been a never-ending drive for improved performance in electronic devices for multiple applications such as mobile, consumer, automotive, or industrial applications. Fan-Out Wafer-Level Packaging (FOWLP) was primarily developed to enable higher performance and functionality, with increased reliability and higher levels of integration in a small form factor; all of this was done while targeting significant cost reductions as compared to the exiting packing technologies.
All advanced IC packages, including the fan-out wafer-level packages (FOWLP), can only be made profitably and reliably by making use of special electronic solutions, such as conductors and insulators, to form the best electrical connections.
Asia Pacific is Expected to Witness Significant Growth Rate
By region, the Asia Pacific region is accounted for the largest market share of 64.01% in 2020 and is also expected to witness the highest CAGR, amounting to 8.21%, over the forecast period. The Asia Pacific holds a prominent share of the market due to a significant number of semiconductor manufacturing operations happening in the region. The pure-play manufacturers operating in the region are increasing their production capacity to cater to the growing demand from fabless vendors. China is also trying to consolidate its substrate manufacturing market.?
Manufacturers in the Asia-Pacific region focus on increasing their customer base in North America due to increasing demand from data centers and AI. For example, Ibiden is working toward boosting its sales from Semicon players, such as Intel, while scaling down the Flip Chip business that serves domestic smartphone markets and plans to increase the capacity in its Japanese plant by 50% by the end of 2020 by focusing on silicon bridges which connect memory semiconductors with CPUs and GPUs.?Further, China is one of the largest growing economies present with a large population, and according to statistics from China’s semiconductor association, the import of IC was witnessing an increase in the demand for the consecutive years from 2014. The Chinese government has deployed a multi-pronged strategy, which led to the support of domestic IC industry development to become the global leader in all primary IC industrial supply chain segments by 2030. This growth in the semiconductor IC industry in the region is anticipated to stimulate the demand for advanced packaging.
Japan holds a significant position in the semiconductor industry as it is home to some of the major IC chipset manufacturers and electronics industry. Moreover, in May 2020, a new report suggested that the country is planning on attracting semiconductor manufacturers, such as Taiwan Semiconductor Manufacturing Company (TSMC) and Intel. The government is expected to start an investigation to look into future prospects to bring the major chipmakers to the country.
Players in the region involve themselves with organic growth initiatives, which are leveraging market growth. For instance, in November 2020, Taiwan Semiconductor Manufacturing Co. announced that it was working with Google and other US tech giants to develop a new way of making semiconductors more powerful. According to the company, TSMC is taking chip packaging vertically and horizontally using a new 3D technology that it dubs SoIC. It makes it possible to stack and link several different types of chips, such as processors, memory, and sensors, into one package.
With the rapid growth in the advanced packaging market, domestic packaging material suppliers are expanding with the industry and starting to serve leading international packaging houses. The consumption of semiconductors is rapidly increasing in China, compared to other countries, owing to the continuing transfer of global, diverse electronic equipment to China, where the product is necessary. Also, the country is home to three of the top five largest smartphone companies globally, posing tremendous opportunities for semiconductor adoption and advanced packaging.
Competitive Landscape
The Advanced Packaging Market is witnessing dominance by ten to fifteen significant players like Intel Corporation, Samsung Electronics Co. Ltd. The market is significantly driven by end-user revenue because of the demand for the latest technology and high-speed gadgets. The companies have a sustainable competitive advantage through innovations in this market, owing to the growing need for differentiated products for various applications. The constant evolution of technological developments in smartphones, tablets, wireless communications, etc., will positively impact this industry.
May 2020 – Synapse Electronique, a Canadian equipment electronics manufacturer and EMS provider, integrated two Universal Instruments Fuzion Platform production lines in its Shawinigan, Quebec facility. Each line includes a Fuzion2-60 and FuzionXC2-37 Platform, providing the performance to meet Synapse’s long-term OEM throughput requirements and the flexibility to support stringent contract-manufacturing demands.
Aug 2020 – Samsung Electronics announced the availability of its silicon-proven 3D IC packaging technology, eXtended-Cube (X-Cube), for most advanced process nodes. X-Cube enables significant leaps in speed and power efficiency to help address the rigorous performance demands of advanced applications, including 5G, artificial intelligence, high-performance computing, mobiles, and wearables.
Feb 2021 – Siemens Digital Industries Software announced that its collaboration with Advanced Semiconductor Engineering, Inc. (ASE) generated two new enablement solutions engineered to help mutual customers create and evaluate multiple complex integrated circuit (IC) package assemblies and interconnect scenarios in a data-robust graphical environment prior to and during physical design implementation.
Additional Benefits:
The market estimate (ME) sheet in Excel format
3 months of analyst support
Read the full report: https://www.reportlinker.com/p06039472/?utm_source=GNW
About Reportlinker
ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need – instantly, in one place.
__________________________
Artificial Intelligence
Clinical Trials Matching Software Market Projected to Reach $832.56 million by 2030 – Exclusive Report by 360iResearch
PUNE, India, April 18, 2024 /PRNewswire/ — The report titled “Clinical Trials Matching Software Market by Functionality (Analytics & Reporting, Compliance Tracking, Data Management), Deployment (Cloud & Web Based, On-Premise), End-Use – Global Forecast 2024-2030” is now available on 360iResearch.com’s offering, presents an analysis indicating that the market projected to grow from a size of $342.20 million in 2023 to reach $832.56 million by 2030, at a CAGR of 13.54% over the forecast period.
“The Global Surge in Adoption of Matching Software for Enhanced Participant Enrollment”
Clinical trials matching software stands at the forefront of revolutionizing clinical research by automating the process of identifying and enrolling eligible participants. These platforms offer a streamlined approach to match patient health profiles with trial requirements, accelerating enrollment and supporting the shift toward personalized healthcare using these advanced AI and ML technologies. Although integrating these systems poses challenges due to variations in healthcare IT infrastructure and the imperative for rigorous data security, the potential for market growth is substantial. In the Americas, a robust clinical trials ecosystem thrives; in the European Union, it has unified regulatory standards and extended to emerging regions such as the Middle East, Africa, and the APAC countries; the demand for such innovative solutions is on a steep rise. This demand is fueled by governmental support, the evolving regulatory landscape, and strategic partnerships to embed these solutions within electronic health records, underscoring a global movement toward optimizing clinical trial processes to better cater to specific patient demographics.
Download Sample Report @ https://www.360iresearch.com/library/intelligence/clinical-trials-matching-software
“The Rise of Virtual Trials and Advanced Matching Software”
The healthcare landscape is witnessing a transformative shift toward virtual clinical trials, fueled by technological advancements and the necessity for continuity during the COVID-19 pandemic. This transition supports research amid social distancing measures and introduces significant cost savings by reducing the need for physical infrastructure and in-person interactions. The efficiencies brought by electronic health records (EHR), wearable technologies, and automation streamline the entire process, from patient recruitment to data analysis. Several approaches, endorsed by regulatory bodies such as the FDA, represent a leap forward in making clinical trials more accessible and streamlined, ensuring that more patients can participate in potentially life-saving research without the geographical and logistic constraints of traditional trials.
“Enhancing Clinical Trials through Advanced Analytics, Rigorous Compliance, and Precision-Patient Matching”
Integrating advanced analytics, meticulous compliance monitoring, and precision-patient matching marks a significant advancement toward maximizing efficiency and fostering trial diversity. The software delivers insightful data on trial progress, participant demographics, and enrollment figures, empowering stakeholders to make well-informed decisions and optimize resource distribution to meet trial goals effectively by implementing cutting-edge analytics. The built-in compliance feature ensures trials are conducted in strict adherence to regulatory standards, minimizing risks associated with non-compliance. Furthermore, a robust data management system guarantees the integrity and availability of clinical trial data, which is critical for the seamless operation and real-time analysis of trials. The software includes state-of-the-art patient matching technology, which employs sophisticated algorithms and artificial intelligence to expedite recruitment by accurately identifying candidates who match specific trial requirements. This innovative approach accelerates the recruitment timeline and enhances the diversification of trial participants, paving the way for more inclusive and representative clinical research outcomes.
Request Analyst Support @ https://www.360iresearch.com/library/intelligence/clinical-trials-matching-software
“Medidata by Dassault Systèmes SE at the Forefront of Clinical Trials Matching Software Market with a Strong 11.30% Market Share”
The key players in the Clinical Trials Matching Software Market include International Business Machines Corporation, Science 37, Inc. by eMed, LLC, Medidata by Dassault Systèmes SE, AutoCruitment LLC, Deep 6 AI Inc., and others. These prominent players focus on strategies such as expansions, acquisitions, joint ventures, and developing new products to strengthen their market positions.
“Introducing ThinkMi: Revolutionizing Market Intelligence with AI-Powered Insights for the Clinical Trials Matching Software Market”
We proudly unveil ThinkMi, a cutting-edge AI product designed to transform how businesses interact with the Clinical Trials Matching Software Market. ThinkMi stands out as your premier market intelligence partner, delivering unparalleled insights with the power of artificial intelligence. Whether deciphering market trends or offering actionable intelligence, ThinkMi is engineered to provide precise, relevant answers to your most critical business questions. This revolutionary tool is more than just an information source; it’s a strategic asset that empowers your decision-making with up-to-the-minute data, ensuring you stay ahead in the fiercely competitive Clinical Trials Matching Software Market. Embrace the future of market analysis with ThinkMi, where informed decisions lead to remarkable growth.
Ask Question to ThinkMi @ https://app.360iresearch.com/library/intelligence/clinical-trials-matching-software
“Dive into the Clinical Trials Matching Software Market Landscape: Explore 190 Pages of Insights, 286 Tables, and 22 Figures”
PrefaceResearch MethodologyExecutive SummaryMarket OverviewMarket InsightsClinical Trials Matching Software Market, by FunctionalityClinical Trials Matching Software Market, by DeploymentClinical Trials Matching Software Market, by End-UseAmericas Clinical Trials Matching Software MarketAsia-Pacific Clinical Trials Matching Software MarketEurope, Middle East & Africa Clinical Trials Matching Software MarketCompetitive LandscapeCompetitive PortfolioInquire Before Buying @ https://www.360iresearch.com/library/intelligence/clinical-trials-matching-software
Related Reports:
Clinical Trial Support Services Market – Global Forecast 2024-2030Virtual Clinical Trials Market – Global Forecast 2024-2030Clinical Trials Management System Market – Global Forecast 2024-2030About 360iResearch
Founded in 2017, 360iResearch is a market research and business consulting company headquartered in India, with clients and focus markets spanning the globe.
We are a dynamic, nimble company that believes in carving ambitious, purposeful goals and achieving them with the backing of our greatest asset — our people.
Quick on our feet, we have our ear to the ground when it comes to market intelligence and volatility. Our market intelligence is diligent, real-time and tailored to your needs, and arms you with all the insight that empowers strategic decision-making.
Our clientele encompasses about 80% of the Fortune Global 500, and leading consulting and research companies and academic institutions that rely on our expertise in compiling data in niche markets. Our meta-insights are intelligent, impactful and infinite, and translate into actionable data that support your quest for enhanced profitability, tapping into niche markets, and exploring new revenue opportunities.
Contact 360iResearchMr. Ketan Rohom360iResearch Private Limited,Office No. 519, Nyati Empress,Opposite Phoenix Market City,Vimannagar, Pune, Maharashtra,India – 411014.Email: [email protected]: +1-530-264-8485India: +91-922-607-7550
To learn more, visit 360iresearch.com or follow us on LinkedIn, Twitter, and Facebook.
Logo – https://mma.prnewswire.com/media/2359256/360iResearch_Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/clinical-trials-matching-software-market-projected-to-reach-832-56-million-by-2030—exclusive-report-by-360iresearch-302119709.html
BOSTON, April 18, 2024 /PRNewswire/ — The RepTrak™ Company, the world’s leading reputation data and insights company, released its annual Global RepTrak 100 report. Utilizing its advanced reputation monitoring software, RepTrak gathered data from more than 243,000 survey responses across 14 major economies to rank the world’s 100 most reputable companies. They share that ranking alongside a full analysis of global corporate reputation trends and corresponding public sentiment in the 2024 report.
After two years of consecutive Reputation Score declines, this year’s Score is back up with an increase from 73.2 in 2023 to 73.8 in 2024. It’s a small increase after 2023’s full one-point drop. However, it’s an encouraging sign that companies have begun to recover from reputation falls driven by many challenges: macroeconomic issues, workplace difficulties, product problems, and corporate responsibility skepticism.
“This year’s report underscores a pivotal shift in the corporate landscape, spotlighting the remarkable adaptability and dedication of the Top 100 companies in responding to the dynamic needs of stakeholders,” states RepTrak CEO Mark Sonders. “The companies featured in our report are not just riding the wave of change; they are the ones steering it, proving that the best approach to business is one that embraces evolution and champions progress.”
RepTrak’s report explores how people thought, felt, and acted toward companies over the past year. Findings include notable increases in Conduct and Citizenship efforts, stakeholders’ rising willingness to invest, culturally resonant brand communications, and ESG Scores that soared despite skepticism around the acronym.
To read the full 2024 Global RepTrak 100 report, please visit: www.reptrak.com/globalreptrak
About RepTrak
The RepTrak™ Company is the world’s leading reputation data and insights company. We help companies by organizing and grading a variety of reputational elements, offering a real-world report card on their corporate reputation. Subscribers to the RepTrak program use our predictive insights to protect business value, improve return on investment, and increase their positive impact on society. RepTrak’s pairing of advanced metrics and dedicated reputation advisors offers clients an actionable analysis of their reputation data, aligning business objectives with stakeholder sentiment across different markets and sectors.
Established in 2004, The RepTrak Company owns the world’s largest reputation benchmarking database, gathering over 1 million company ratings per year used by CEOs, boards, and executives in more than 60 countries worldwide. For more information, please visit: www.reptrak.com
Logo – https://mma.prnewswire.com/media/2391550/RepTrak_Logo_Logo.jpg
Photo – https://mma.prnewswire.com/media/2391551/2024_GRT_Spreads__Instagram_Post.jpg
View original content:https://www.prnewswire.co.uk/news-releases/reptrak-announces-2024-global-reptrak-100-report-302121513.html
Artificial Intelligence
Group-IB takes part in a global operation to cripple Canadian Phishing-as-a-Service provider LabHost
SINGAPORE, April 18, 2024 /PRNewswire/ — Group-IB, a leading cybersecurity company aimed at investigating, preventing, and fight digital crime announced today that it participated in a coordinated global takedown operation against prominent Canadian Phishing-as-a-Service (PhaaS) provider LabHost, which has led to the arrest of 37 suspects across the United Kingdom and around the world by law enforcement agencies. As part of the operation, Group-IB also conducted an extensive analysis of LabHost’s criminal history and infrastructure, including insights into LabHost’s administrative platform and the services it provides to its purported user base which exceeds 2,000 subscribers worldwide, who illegally obtained around 480,000 card numbers, 64,000 pin numbers, and over 1 million passwords from victims used for websites and other online services, according to law enforcement agencies.
“By leveraging our Threat Intelligence and Digital Risk Protection, we are able to identify and monitor phishing attacks and websites like those deployed by LabHost and its subscribers around the world, enabling us to actively alert and protect our customers, and in turn, their customers as well,” said Dmitry Volkov, Chief Executive Officer of Group-IB. “Today’s takedown operation demonstrates the agility and responsiveness of our decentralized Digital Crime Resistance Centers, and how quickly we can provide immediate and local assistance wherever our customers may be.”
First uncovered in late 2021, LabHost emerged as a fully automated Phishing-as-a-Service (PhaaS) platform, streamlining the creation of phishing websites meticulously mirroring the interface and functionality of prominent banking, postal, and financial entities, aimed at intercepting, seizing, and profiting from users’ personal, credit card, and online banking credentials. Users are prompted to select from various “membership plans,” tailored to target businesses and individuals in either the United States and Canada, or globally, akin to mobile subscription models. These plans encompass “standard,” “premium,” and “world membership” tiers, priced between US$179 and US$300 monthly, with options for monthly, quarterly, or annual billing cycles.
For media inquiries, please contact [email protected]
Photo – https://mma.prnewswire.com/media/2391017/Group_IB.jpgPhoto – https://mma.prnewswire.com/media/2391018/Group_IB_2.jpgLogo – https://mma.prnewswire.com/media/1853638/4657466/Group_IB_Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/group-ib-takes-part-in-a-global-operation-to-cripple-canadian-phishing-as-a-service-provider-labhost-302121388.html
-
Artificial Intelligence7 days agoIn-Depth Analysis of Germany and France Data Center Markets: Germany Poised to Contribute Over $12.24 Billion Opportunities in the Next 6 Years – Arizton
-
Artificial Intelligence7 days agoCogX Festival Set to Debut in Los Angeles at Century Plaza on May 7th, 2024
-
Artificial Intelligence4 days agoSilent Eight secures AIA as its latest client
-
Artificial Intelligence4 days agoGlobal Networking Innovator Huawei Leads the New Era of Campus Network Technology
-
Artificial Intelligence4 days agoBroadcom Earns Frost & Sullivan’s 2024 Global Company of the Year Award for Delivering Reliable and Flexible Hybrid Cloud Management Solutions
-
Artificial Intelligence2 days agoHuawei Introduces AI Technologies to Accelerate Network Transformation Towards All Intelligence in the Net5.5G Era
-
Artificial Intelligence4 days agoAI Chips and Chat GPT – IDTechEx Explores AI and Robotics
-
Artificial Intelligence4 days agoGFT teams up with Google Cloud to launch ‘GenAI Intelligent Assistant’
