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TWS Bluetooth Headset Chip Market 2022-2028 with COVID-19 impact on Industry: Growth Global Industry Size, Top manufacturers, Analysis, Share, Trends, Market Demand, Growth, Opportunities and Forecast with Top Growth Companies

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PUNE, Oct. 31, 2022 (GLOBE NEWSWIRE) — “TWS Bluetooth Headset Chip Market” | No. of pages: 116| research report focus on overall information that can help to take decisions on current market situation. TWS Bluetooth Headset Chip market report provides a detailed analysis of global market size, regional and country-level market size, segmentation market growth, market share, competitive Landscape, sales analysis, impact of domestic and global market players, value chain optimization, trade regulations, recent developments, opportunities analysis, strategic market growth analysis, product launches, area marketplace expanding, and technological innovations.

TWS Bluetooth Headset Chip Market Report Contains: –

  • Complete overview of the global TWS Bluetooth Headset Chip Market
  • Top Country data and analysis for United States, Canada, Mexico, Germany, France, United Kingdom, Russia, Italy, China, Japan, Korea, India, Southeast Asia, Australia, Brazil and Saudi Arabia, etc. It also throws light on the progress of key regional TWS Bluetooth Headset Chip markets such as North America, Europe, Asia-Pacific, South America and Middle East and Africa
  • Description and analysis of TWS Bluetooth Headset Chip market potential by type, Deep Dive, disruption, application capacity, end use industry
  • impact evaluation of most important drivers and restraints, and dynamics of the global TWS Bluetooth Headset Chip market and current trends in the enterprise
  • Detailed profiles of the Top major players in the industry, including. Qualcomm,MediaTek,PixArt,Apple,Bestechnic,Airoha Technology Corp,HUAWEI,SAMSUNG,Zhuhai Jieli Technology,Realtek,Actions technology,Shenzhen Bluetrum Technology,Smartlink Technology,Cypress Semiconductor Corporation,Broadcom Corporation

Get a Sample Copy of the Report at – https://proficientmarketinsights.com/enquiry/request-sample/21403710

TWS Bluetooth Headset Chip Market Segmentation: –

researcher’s latest report provides a deep insight into the global TWS Bluetooth Headset Chip market covering all its essential aspects. This ranges from a macro overview of the market to micro details of the market size, competitive landscape, development trend, niche market, key market drivers and challenges, SWOT analysis, Porter’s five forces analysis, value chain analysis, etc.

According to our Researcher latest study, due to COVID-19 pandemic, the global TWS Bluetooth Headset Chip market size is estimated to be worth US$ million in 2021 and is forecast to a readjusted size of USD million by 2028 with a CAGR of % during forecast period 2022-2028. In Ear Bluetooth Headset accounting for % of the TWS Bluetooth Headset Chip global market in 2021, is projected to value USD million by 2028, growing at a % CAGR in next six years. While Classic Bluetooth Chip segment is altered to a % CAGR between 2022 and 2028.

Inquire or Share Your Questions If Any Before the Purchasing This Report – https://proficientmarketinsights.com/enquiry/pre-order-enquiry/21403710

Global key manufacturers of TWS Bluetooth Headset Chip include Qualcomm, MediaTek, PixArt, Apple, and Bestechnic, etc. In terms of revenue, the global top four players hold a share over % in 2021.

TWS Bluetooth Headset Chip Market segments help decision-makers direct the product, sales, and marketing strategies, and can power your product development cycles by informing how you make product offerings for different segments.

Market segment by Type, covers

  • Classic Bluetooth Chip
  • BLE Chip

Market segment by Application can be divided into

  • In Ear Bluetooth Headset
  • Headset Bluetooth Headset
  • Others

Market segment by Region/Country including: –

  • North America (United States, Canada, and Mexico)
  • Europe (Germany, UK, France, Italy, Russia and Spain, etc.)
  • Asia-Pacific (China, Japan, Korea, India, Australia, Southeast Asia, etc.)
  • South America (Brazil, Argentina, Colombia, etc.)
  • Middle East & Africa (South Africa, UAE, Saudi Arabia, etc.)

Key Players in the TWS Bluetooth Headset Chip Market: –

  • Qualcomm
  • MediaTek
  • PixArt
  • Apple
  • Bestechnic
  • Airoha Technology Corp
  • HUAWEI
  • SAMSUNG
  • Zhuhai Jieli Technology
  • Realtek
  • Actions technology
  • Shenzhen Bluetrum Technology
  • Smartlink Technology
  • Cypress Semiconductor Corporation
  • Broadcom Corporation

Get a Sample Copy of the Report at – https://proficientmarketinsights.com/enquiry/request-sample/21403710

Key Benefits of TWS Bluetooth Headset Chip Market Research Report:

  • Types, applications, regions, and key players covered in the study
  • Industry drivers, restraints, and opportunities covered in the study
  • Recent industry trends and developments
  • Competitive landscape & strategies of key players
  • Historical, current, and projected market size, in terms of value
  • In-depth analysis of the Artificial Intelligence AI Chips Market
  • Sales, price, revenue, market share, and growth rate are covered in the report sales channels, distributors, traders, dealers, etc. are covered in the report

Detailed TOC of Global TWS Bluetooth Headset Chip Market 2022 by Manufacturers, Regions, Type and Application, Forecast to 2028

1 Market Overview

    1.1 TWS Bluetooth Headset Chip Introduction

    1.2 Market Analysis by Type

        1.2.1 Overview: Global TWS Bluetooth Headset Chip Revenue by Type: 2017 Versus 2021 Versus 2028

        1.2.2 Classic Bluetooth Chip

        1.2.3 BLE Chip

    1.3 Market Analysis by Application

        1.3.1 Overview: Global TWS Bluetooth Headset Chip Revenue by Application: 2017 Versus 2021 Versus 2028

        1.3.2 In Ear Bluetooth Headset

        1.3.3 Headset Bluetooth Headset

        1.3.4 Others

    1.4 Global TWS Bluetooth Headset Chip Market Size & Forecast

        1.4.1 Global TWS Bluetooth Headset Chip Sales in Value (2017 & 2021 & 2028)

        1.4.2 Global TWS Bluetooth Headset Chip Sales in Volume (2017-2028)

        1.4.3 Global TWS Bluetooth Headset Chip Price (2017-2028)

    1.5 Global TWS Bluetooth Headset Chip Production Capacity Analysis

        1.5.1 Global TWS Bluetooth Headset Chip Total Production Capacity (2017-2028)

        1.5.2 Global TWS Bluetooth Headset Chip Production Capacity by Geographic Region

    1.6 Market Drivers, Restraints and Trends

        1.6.1 TWS Bluetooth Headset Chip Market Drivers

        1.6.2 TWS Bluetooth Headset Chip Market Restraints

        1.6.3 TWS Bluetooth Headset Chip Trends Analysis

Explore Full Report With Detailed TOC Here: https://proficientmarketinsights.com/TOC/21403710#TOC

1.To study and analyze the global TWS Bluetooth Headset Chip consumption (value) by key regions/countries, product type and application

2.To understand the structure of TWS Bluetooth Headset Chip market by identifying its various sub segments.

3.Focuses on the key global TWS Bluetooth Headset Chip manufacturers, to define, describe and analyze the value, market share, market competition landscape, Porter’s five forces analysis, SWOT analysis and development plans in next few years.

4.To analyze the TWS Bluetooth Headset Chip with respect to individual growth trends, future prospects, and their contribution to the total market.

5.To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).

6.To project the consumption of TWS Bluetooth Headset Chip submarkets, with respect to key regions (along with their respective key countries).

7.To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

8.To strategically profile the key players and comprehensively analyze their growth strategies.

Key Reasons to Purchase

To gain insightful analyses of the market and have comprehensive understanding of the global TWS Bluetooth Headset Chip market and its commercial landscape.

Assess the production processes, major issues, and solutions to mitigate the development risk.

To understand the most affecting driving and restraining forces in the TWS Bluetooth Headset Chip market and its impact in the global market.

Learn about the TWS Bluetooth Headset Chip market strategies that are being adopted by leading respective organizations.

To understand the future outlook and prospects for the TWS Bluetooth Headset Chip market.

Besides the standard structure reports, we also provide custom research according to specific requirements

Purchase this Report (Price 3480 USD for a Single-User License) – https://proficientmarketinsights.com/purchase/21403710

The content of the study subjects, includes a total of 15 chapters:

Chapter 1, to describe TWS Bluetooth Headset Chip product scope, market overview, market opportunities, market driving force and market risks.

Chapter 2, to profile the top manufacturers of TWS Bluetooth Headset Chip, with price, sales, revenue and global market share of TWS Bluetooth Headset Chip from 2019 to 2022.

Chapter 3, the TWS Bluetooth Headset Chip competitive situation, sales, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.

Chapter 4, the TWS Bluetooth Headset Chip breakdown data are shown at the regional level, to show the sales, revenue and growth by regions, from 2017 to 2028.

Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2017 to 2028.

Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales, revenue and market share for key countries in the world, from 2017 to 2022.and TWS Bluetooth Headset Chip market forecast, by regions, type and application, with sales and revenue, from 2023 to 2028.

Chapter 12, the key raw materials and key suppliers, and industry chain of TWS Bluetooth Headset Chip.

Chapter 13, 14, and 15, to describe TWS Bluetooth Headset Chip sales channel, distributors, customers, research findings and conclusion, appendix and data source.

About Proficient market insights:

Proficient market insights is an upscale platform to help key personnel in the business world in strategizing and taking visionary decisions based on facts and figures derived from in-depth market research. We are one of the top report resellers in the market, dedicated to bringing you an ingenious concoction of data parameters.


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Artificial Intelligence

QSAN Unveils Latest Solutions for AI Era at COMPUTEX 2024

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Introducing Next-Gen NVMe Array and All-New Container Platform
TAIPEI, April 24, 2024 /PRNewswire/ — AI is sweeping the globe, transforming industries and spurring enterprises to adopt AI in business. As companies gear up to seize this incredible opportunity of rapid business growth, upgrading their IT infrastructure is the first step. At COMPUTEX 2024, QSAN will unveil state-of-the-art solutions to assist enterprises in the AI era.

Unparalleled Performance All NVMe Flash ArrayThe next-generation XCubeFAS 5226 is now delivering extremely fast performance. It features low latency, high throughput, and robust IOPs to accelerate demanding workloads for the upcoming AI era.
Innovative Container PlatformThe KubeSwift series is an innovative appliance that empowers SMBs with CaaS (Container as a Service) capabilities. This all-in-one solution streamlines containerized application deployment, management, and scaling, providing a robust foundation for modern IT infrastructures.
High Scalability Enterprise Unified StorageAs artificial intelligence continues to advance, the value of data will grow exponentially, driving the need for expanded storage capacity. XCubeNXT is an enterprise unified storage system with PB-level scalability, high availability, and multi-functional connectivity. It aims to prepare for storing massive amounts of material generated by AI.
Register for QSAN Tech Talk
QSAN will host tech talks to provide insights into storage technology and the future. Professionals will have in-depth discussions on topics such as AI applications, storage technology trends, market analysis, and prediction. Register for tech talk for more forecasts.
Make an Appointment with a QSAN Expert Consultant
Tailor-made storage consulting will also be available at COMPUTEX 2024. For the best chance of accelerating your business, make an appointment with a QSAN expert.
QSAN at 2024 COMPUTEX Information
Event Date: June 4 ~ 7, 2024Event Time: (GMT+8) 9:30 AM ~ 05:30 PMBooth No.: M1435a (AI Computing & System Integration)Location: 4F, Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1)Address: No.1, Jingmao 2nd Rd., Nangang District, Taipei City 115, Taiwan
QSAN Showroom for Tech Talk and Expert Consultant
Event Date: June 4 ~ 7, 2024Event Time: (GMT+8) 10:00 AM ~ 05:30 PMLocation: QSAN ShowRoomAddress: No. 2, Ln. 1, Fukang St., Nangang District, Taipei City 115, Taiwan
For more information, please visit: www.QSAN.com
Media Contacts Email: [email protected] Address: 4F., No.103, RuiHu Street, NeiHu District, Taipei, Taiwan11494 Phone: +886-2-7720-2118

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Kanazawa University research: Biochemical tails tell a story

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KANAZAWA, Japan, April 24, 2024 /PRNewswire/ — Researchers at Nano Life Science Institute (WPI-NanoLSI), Kanazawa University report in Nano Letters how the use of high-speed atomic force microscopy helps to understand the crucial role played by certain biomolecules in DNA wrapping dynamics.

In plants and animals, the basic packaging units of DNA, which carry genetic information, are the so-called nucleosomes. A nucleosome consists of a segment of DNA wound around eight proteins known as histones. During gene expression (the process lying at the basis of protein production), nucleosomes are involved in various dynamical structural changes, such as nucleosome sliding, DNA unwrapping and other DNA–histone interactions. Of particular importance in these processes are the end structures, or tails, of the histones. Histone tails undergo chemical modifications, changing the histone’s functionality as needed. Detailed studies, and especially visualizations, of nucleosome dynamics are crucial for better understanding the role of histone tails. Mikihiro Shibata from Kanazawa University and colleagues have now succeeded in making video recordings of tail-less nucleosomes, showing that the absence of histone tails significantly increases a nucleosome’s dynamic activity.
The scientists used high-speed atomic force microscopy (HS-AFM), a powerful nanoimaging tool for visualizing molecular structures and their dynamics at high spatial and temporal resolution. For this, the nucleosomes needed to be put onto a substrate. Shibata and colleagues used a film of so-called pillar[5]arenes (molecules with a pentagonal tubular structure) as the substrate, forming an ideal surface as the nucleosomes are easily adsorbed to it without dynamical processes getting suppressed.
The researchers first looked at nucleosomes for which all eight histones lacked tails. Based on their HS-AFM observations, they concluded that nucleosome sliding and DNA unwrapping/rewrapping occurred more often than for normal (canonical) nucleosomes. This suggests that without tails, the histone–DNA interaction is weakened, leading to a situation in which DNA can more easily detach from the histones.
To better understand the roles of specific histone tails, Shibata and colleagues prepared nucleosomes where one type of histone was tailless. There are four different types of histones, called H2A, H2B, H3 and H4. HS-AFM experiments on the nucleosomes revealed that H2B and H3 tail-less nucleosomes showed an increased frequency of dynamics. Conversely, this means that canonical H2B and H3 histones are essential for nucleosome stability.
The scientists point out that they could not observe any actual motion of histone tails — most likely the temporal resolution of the study, 0.3 seconds, was much slower than the rate of the wrapping/unwrapping dynamics of the tails. Despite this limitation, the work of Shibata and colleagues clearly proves that the tails of H2B and H3 histones are the main contributors to nucleosome dynamics. Regarding future work, quoting the researchers, “a technique for tagging histone tail tips might enable HS-AFM to capture the movements of the histone tails themselves.”
Background
High-speed atomic force microscopy
The general principle of atomic force microscopy (AFM) is to make a very small tip scan the surface of a sample. During this horizontal (xy) scan, the tip, which is attached to a small cantilever, follows the sample’s vertical (z) profile, inducing a force on the cantilever that can be measured. The magnitude of the force at the xy position can be related to the z value; the xyz data generated during a scan then result in a height map providing structural information about the investigated sample. In high-speed-AFM (HS-AFM), the working principle is slightly more involved: the cantilever is made to oscillate near its resonance frequency. When the tip is moved around a surface, the variations in the amplitude (or the frequency) of the cantilever’s oscillation — resulting from the tip’s interaction with the sample’s surface — are recorded, as these provide a measure for the local z value. AFM does not involve lenses, so its resolution is not restricted by the so-called diffraction limit as in X-ray diffraction, for example.
HS-AFM results in a video, where the time interval between frames depends on the speed with which a single image can be generated (by xy-scanning the sample). Researchers at Nano Life Science Institute (WPI-NanoLSI), Kanazawa University have in recent years developed HS-AFM further, so that it can be applied to study biochemical molecules and biomolecular processes in real-time. Mikihiro Shibata and colleagues have now applied the method to study nucleosome dynamics in detail, and in particular the role of the molecular endings of histones — proteins that play a crucial role in DNA accessibility.
Reference
Shin Morioka, Takumi Oishi, Suguru Hatazawa, Takahiro Kakuta, Tomoki Ogoshi, Kenichi Umeda, Noriyuki Kodera, Hitoshi Kurumizaka, and Mikihiro Shibata. High-Speed Atomic Force Microscopy Reveals the Nucleosome Sliding and DNA Unwrapping/Wrapping Dynamics of Tail-less Nucleosomes, Nano Letters ,2024.
DOI: 10.1021/acs.nanolett.4c00801https://pubs.acs.org/doi/10.1021/acs.nanolett.4c00801 
https://nanolsi.kanazawa-u.ac.jp/wp/wp-content/uploads/Figure-1-12.png Figure 1.
High-speed atomic force microscopy visualization of nucleosome dynamics with canonical (top) and tail-less (bottom) histones.© 2024 American Chemical Society
ContactHiroe YonedaSenior Specialist in Project Planning and OutreachNanoLSI Administration Office, Nano Life Science Institute (WPI-NanoLSI)Kanazawa UniversityKakuma-machi, Kanazawa 920-1192, JapanEmail: [email protected]: +81 (76) 234-4555
About Nano Life Science Institute (WPI-NanoLSI), Kanazawa University
Understanding nanoscale mechanisms of life phenomena by exploring “uncharted nano-realms”
Cells are the basic units of almost all life forms. We are developing nanoprobe technologies that allow direct imaging, analysis, and manipulation of the behavior and dynamics of important macromolecules in living organisms, such as proteins and nucleic acids, at the surface and interior of cells. We aim at acquiring a fundamental understanding of the various life phenomena at the nanoscale.https://nanolsi.kanazawa-u.ac.jp/en/
About the World Premier International Research Center Initiative (WPI)
The WPI program was launched in 2007 by Japan’s Ministry of Education, Culture, Sports, Science and Technology (MEXT) to foster globally visible research centers boasting the highest standards and outstanding research environments. Numbering more than a dozen and operating at institutions throughout the country, these centers are given a high degree of autonomy, allowing them to engage in innovative modes of management and research. The program is administered by the Japan Society for the Promotion of Science (JSPS).
See the latest research news from the centers at the WPI News Portal: https://www.eurekalert.org/newsportal/WPI
Main WPI program site: www.jsps.go.jp/english/e-toplevel
About Kanazawa University
As the leading comprehensive university on the Sea of Japan coast, Kanazawa University has contributed greatly to higher education and academic research in Japan since it was founded in 1949. The University has three colleges and 17 schools offering courses in subjects that include medicine, computer engineering, and humanities.
The University is located on the coast of the Sea of Japan in Kanazawa – a city rich in history and culture. The city of Kanazawa has a highly respected intellectual profile since the time of the fiefdom (1598-1867). Kanazawa University is divided into two main campuses: Kakuma and Takaramachi for its approximately 10,200 students including 600 from overseas.http://www.kanazawa-u.ac.jp/e/
 
 
 

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Geek+ and System Teknik deploy first PopPick solution in the Nordics for the pharmacy group Med24.dk

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DUSSELDORF, Germany, April 24, 2024 /PRNewswire/ — Geekplus, the global leader in mobile robot and smart logistics solutions, has deployed the first Shelf-to-Person PopPick project in the Nordics for one of the biggest online pharmacy wholesalers in the region, Med24.dk. System Teknik partnered on the Denmark project, which includes three PopPick stations and 30 Shelf-to-Person robots, bringing a flexible solution to a region where fixed automation still dominates.  

“With the rise of e-commerce, Med24.dk had been struggling with huge sales growth coupled with fast delivery demands from customers in Denmark, Norway, Sweden searching for pharmacy, health and beauty products. Peak season events had also caused considerable strain to their operations,” said Blond Shkodrani, channel partner manager for the Nordics at Geekplus. “Due to their overwhelming success, Med24.dk needed a modular, automated order fulfillment solution for fast, efficient order fulfillment.”
The Geekplus modular Shelf-to-Person solution optimizes warehouse operations using mobile robots to transport shelves. In a region where fixed and cubic solutions have been the trend during recent years, Shelf-to-Person handles goods of all sizes while removing the need for infrastructure investment, making it the most flexible response to order fulfillment challenges.
PopPick workstations use two retrieval arms and four presentation locations to present pickers with multiple, moveable 78-tote racks at one time, resulting in an industry-leading throughput of 450 totes per hour. PopPick can store goods of all types and sizes; the solution is not limited to small pieces and improves ergonomics for workers while picking. It also takes up less space than traditional systems, so customers can use more stations without adding facility space.
“We are very pleased to invest in flooring robots from Geekplus,” said Med24.dk CEO Nils Træholt. “We believe that this new and innovative technology can help us realize our growth ambitions, while maintaining good delivery times for the benefit of our customers.”
Morten Kirch, System Teknik’s CSO, added: “Due to Med24.dk’s growth, we are thrilled to be able to deliver a tailor-made, automated solution that matches their needs.”
Geekplus offers a suite of Goods-to-Person mobile order fulfillment solutions — the only comprehensive robotic offering controlled by a single software platform.
“Through trusted partners like System Teknik, we’re showing customers all over Europe that Geekplus truly is a one-stop shop for modular warehouse automation,” Shkodrani said.
Photo – https://mma.prnewswire.com/media/2395198/Med24_Geekplus_PopPick.jpg Logo – https://mma.prnewswire.com/media/2373458/Geekplus_logo.jpg
 
 

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