The patent describes a system that predicts and matches the best 3D, MP shape for an integrated circuit manufacturing process
SAN DIEGO, Jan. 25, 2023 (GLOBE NEWSWIRE) — GBT Technologies Inc. (OTC PINK: GTCH ) (“GBT” or the “Company”), filed a nonprovisional patent application for a predictive, three-dimensional, multi-planar shapes, systems and methods for semiconductor design and manufacturing. The technology underlying the patent application seeks to alleviate the disadvantages and problems associated with known semiconductor and IC fabrication systems and methods by providing a predictive design and manufacturing technology to determine the best 3D, multi-planar shape for an integrated circuit according to a desired process dimensions and characteristics. The patent application describes a technology to run simulations that try multiple shapes and, through artificial intelligence algorithms, seeks to analyze and determine the optimal shape for a selected 3D, MP manufacturing process. The patent application includes a Deep Learning algorithm to study an IC manufacturing node geometrical and electrical characteristics complex data, creating 3D, multi-dimensional shapes. The shapes are analyzed using a set of Convolutional Neural Networks that create 3D objects and graphs the data in an effort to reach a conclusion about the best 3D, MP3 shape. The system generates manufacturing process datasets, performing object classification, generates a family of possible shapes representations, simulates all of them, and matches the optimal 3D, multi-planar shape according to best ranking. The technology determines the best 3D, MP shape that matches a selected IC design and manufacturing process, taking into account geometrical design rules, electrical specifications, reliability constraints and DFM (Design for Manufacturing) guidelines. The described technology aims to work in conjunction with GBT’s 3D, MP IP that is patented, in order to achieve the optimal silicon yield, highest performance, low power consumption, and optimal Electro-Thermal dissipation. GBT plans to expand its 3D, MP semiconductor architecture IP, with the goal of filing additional patent applications in this domain in the next year.
“This patent application seeks to protect another IP in our 3D, MP semiconductor architecture patents family and we plan to further expand this architecture and its derivative technologies during 2023. We believe such a system is essential when designing and manufacturing an integrated circuit in GBT’s 3D, MP architecture and enables the most efficient economical 3D, MP shape selection based on the fabrication apparatus, manufacturing node characteristics, ensuring superior performance. We truly believe that our 3D, Multi-Planar integrated circuit architecture is the future of advanced ICs as it is designed to offer the capability to design and manufacture huge microchips, within smaller silicon spaces, with high performance, low power consumption and die temperature,” stated Danny Rittman, the Company’s CTO.
There is no guarantee that the Company will be successful in researching, developing or implementing this system. In order to successfully implement this concept, the Company will need to raise adequate capital to support its research and, if successfully researched, developed and granted regulatory approval, the Company would need to enter into a strategic relationship with a third party that has experience in manufacturing, selling and distributing this product. There is no guarantee that the Company will be successful in any or all of these critical steps.
GBT Technologies, Inc. (OTC PINK: GTCH) (“GBT”) (http://gbtti.com) is a development stage company which considers itself a native of Internet of Things (IoT), Artificial Intelligence (AI) and Enabled Mobile Technology Platforms used to increase IC performance. GBT has assembled a team with extensive technology expertise and is building an intellectual property portfolio consisting of many patents. GBT’s mission, to license the technology and IP to synergetic partners in the areas of hardware and software. Once commercialized, it is GBT’s goal to have a suite of products including smart microchips, AI, encryption, Blockchain, IC design, mobile security applications, database management protocols, with tracking and supporting cloud software (without the need for GPS). GBT envisions this system as a creation of a global mesh network using advanced nodes and super performing new generation IC technology. The core of the system will be its advanced microchip technology; technology that can be installed in any mobile or fixed device worldwide. GBT’s vision is to produce this system as a low cost, secure, private-mesh-network between all enabled devices. Thus, providing shared processing, advanced mobile database management and sharing while using these enhanced mobile features as an alternative to traditional carrier services.
Certain statements contained in this press release may constitute “forward-looking statements”. Forward-looking statements provide current expectations of future events based on certain assumptions and include any statement that does not directly relate to any historical or current fact. Actual results may differ materially from those indicated by such forward-looking statements because of various important factors as disclosed in our filings with the Securities and Exchange Commission located at their website (http://www.sec.gov). In addition to these factors, actual future performance, outcomes, and results may differ materially because of more general factors including (without limitation) general industry and market conditions and growth rates, economic conditions, governmental and public policy changes, the Company’s ability to raise capital on acceptable terms, if at all, the Company’s successful development of its products and the integration into its existing products and the commercial acceptance of the Company’s products. The forward-looking statements included in this press release represent the Company’s views as of the date of this press release and these views could change. However, while the Company may elect to update these forward-looking statements at some point in the future, the Company specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing the Company’s views as of any date subsequent to the date of the press release.