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Fan-Out Wafer Level Packaging Market is anticipated to reach beyond US$ 9.4 billion by 2033, says Persistence Market Research

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New York, Feb. 22, 2023 (GLOBE NEWSWIRE) — According to the latest analysis by Persistence Market Research, the global Fan-Out Wafer Level Packaging Market is expected to increase from a valuation of US$ 2.0 billion in 2023 to US$ 9.4 billion by 2033. Total sales of fan-out wafer level packaging are anticipated to rise at an incredible CAGR of 16.9% throughout the forecast period (2023 to 2033). 

Based on type, demand remains particularly high for core fan-out packages globally and the trend is expected to continue during the assessment period. PMR estimates the core fan-out package segment to expand at 16.8% CAGR between 2022 and 2023.  

Rising demand for advanced and cost-saving packaging technologies along with high penetration of digitalization and miniaturization are providing impetus to the global fan-out wafer level packaging industry. 

As technology is developing rapidly, there is an intense need to make electronic devices more compact and portable. The fan-out wafer level packaging technology is the one in which numerous components are placed on the same substrate and the module is made smaller and energy efficient.  

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In consumer electronic devices such as smartwatches and smartphones, this fan-out wafer level packaging technique is used. In internet of things, artificial intelligence, and in automotive industry- features such as advanced driving assistance systems are created using the fan-out wafer level packaging technique of electronics components. 

Rising demand for a variety of electronic devices worldwide and growing trend of miniaturization are expected to propel fan-out wafer level packaging demand during the forecast period. 

Similarly, growing awareness about the benefits of fan-out wafer level packaging over standard wafer level packaging will create lucrative growth opportunities for fan-out wafer level packaging manufacturers/companies. 

Key Takeaways from Fan-Out Wafer Level Packaging Market Report: 

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The global fan-out wafer level packaging market is forecast to expand at 16.9% CAGR through 2033. 

  • Global sales of fan-out wafer level packaging are likely to generate revenues worth US$ 9.4 billion by 2033. 
  • Based on type, core-fan out package segment is anticipated to rise at 16.8% CAGR between 2023 and 2033. 
  • By application, analog and hybrid integrated circuits segment is projected to expand at 16.7% CAGR over the next ten years. 
  • The USA fan-out wafer level packaging market is forecast to reach a valuation of US$ 1.5 billion by 2033. 
  • Fan-out wafer level packaging demand across Japan is poised to surge at 17.2% CAGR between 2023 and 2033. 
  • China’s fan-out wafer level packaging market is expected to progress at 18.5% CAGR between 2023 and 2033, reaching a valuation of US$ 2.4 billion by 2033. 

“With miniaturization penetrating its roots deep inside the thriving electronic industry, demand for fan-out wafer level packaging is set to rise at an incredible pace over the next ten years,” says a lead Persistence Market Research analyst. 

Get Full Access of this Report@ https://www.persistencemarketresearch.com/checkout/33340

Who is Winning? 

Renesas Electronics, Taiwan Semiconductor Manufacturing Company, ASE Technology Holding Co., Infineon Technologies, Amkor Technology, Nepes, NXP Semiconductors NV, JCET Group, Samsung Electro-Mechanics, Powertech Technology Inc, and TSMC Corporation are the key fan-out wafer level packaging manufacturers. 

Recent Developments by Key Players:  

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  • In October 2021, Cadence, the United States-based company released the first ECAD platform that will be used for 3D systems design. The cadence 3D-IC platform is expected to be used to build 3D stacked designs. This platform supports multiple packaging configurations such as fan-out wafer level packaging, wafer on-chip packaging, and 3D stacking. 
  • In August 2019, Deca Technologies, a leading provider of wafer level solutions announced that its fan-out wafer level packaging technology has been taken into use by Qualcomm for power management ICs in LG and Samsung phones. 

Get More Valuable Insights into Fan-Out Wafer Level Packaging Market 

Persistence Market Research, in its new offering, presents an unbiased analysis of the fan-out wafer level packaging market, presenting historical market data (2018 to 2022) and forecast statistics for the period of 2023 to 2033. 

You Can Customize this Report As per Your Requirement Click Here@ https://www.persistencemarketresearch.com/request-customization/33340

The study reveals extensive growth in fan-out wafer level packaging based

  • on type (high density fan-out package and core fan-out package),
  • on application (CMOS image sensor, wireless connection, logic and memory integrated circuits, MEMS and sensors, analog and hybrid integrated circuits, and others)
  • on across several regions. 

About the Semiconductor and Electronics Division at Persistence Market Research 

Persistence Market Research’s highly experienced semiconductor and electronics team aids companies from all over the world with their specific business intelligence needs through professional research, actionable insights, and strategic recommendations. With a library of over a thousand research and 1 million+ data points, the team has spent over a decade analyzing the technology business across 50+ countries. From start to end, the company provides unrivaled research and consulting services. Please get in touch with us to see how we can help. 

About Persistence Market Research

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Business intelligence is the foundation of every business model employed by Persistence Market Research. Multi-dimensional sources are being put to work, which include big data, customer experience analytics, and real-time data collection. Thus, working on “micros” by Persistence Market Research helps companies overcome their “macro” business challenges. 
Persistence Market Research is always way ahead of its time. In other words, it tables market solutions by stepping into the companies’/clients’ shoes much before they themselves have a sneak pick into the market. The pro-active approach followed by experts at Persistence Market Research helps companies/clients lay their hands on techno-commercial insights beforehand, so that the subsequent course of action could be simplified on their part. 

Contact 

Rajendra Singh  
Persistence Market Research  
U.S. Sales Office: 
305 Broadway, 7th Floor 
New York City, NY 10007 
+1-646-568-7751 
United States 
USA – Canada Toll-Free: 800-961-0353 
Email: [email protected] 

GlobeNewswire is one of the world's largest newswire distribution networks, specializing in the delivery of corporate press releases financial disclosures and multimedia content to the media, investment community, individual investors and the general public.

Artificial Intelligence

Aero Design Labs receives U.S. and EASA approval for updated Boeing 737-800 drag reduction kit

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FORT WORTH, Texas, Sept. 30, 2024 /PRNewswire/ — Aero Design Labs (ADL) today announced it has received a Supplementary Type Certificate (STC) from the Federal Aviation Administration (FAA) and European Union Aviation Safety Agency (EASA) approval for its enhanced Boeing 737-800 drag reduction kit 2.0.

“We are delighted to introduce our next generation of the drag reduction kit, which we are referring to as ‘ADL Kit 2.0′,” said Jeff Martin, ADL President and CEO. “The ADL team has once again demonstrated its expertise and commitment to aviation carbon reduction through its continued improvement process. ADL’s next generation Kit 2.0 is an evolution from our original designs, meeting the stringent requirements based on valuable feedback from our launch partners. With our new EASA approval, we can now offer our carbon reduction kits to new EU airline customers.”
The ADL Kit 2.0 captures new benefits, and significantly reduces the installation time, delivering reduced out-of-service time for the conversion while generating meaningful fuel savings and reduced carbon emissions across the popular Boeing 737-800 variant. Based on feedback from airline partners, it is anticipated that a kit can be installed overnight, minimizing critical out-of-service time for the airlines.
“Having served as an airline operational executive, I understand the need for airlines to reduce their carbon footprint, save fuel and minimize aircraft out-of-service time for the modification,” said David Campbell, ADL Chief Operating Officer. “ADL Kit 2.0 offers better economics and a shorter payback period, assisting airlines with fuel savings and carbon reduction including their IATA CORSIA carbon reduction pledges.”
“On behalf of the team at ADL, we thank ALOFT AeroArchitects, NORDAM, AAR Corp, and the many airline partners who have assisted us on this journey”, concluded Jeff Martin. “Their feedback and contributions to our engineering efforts and joint commitments to reducing aviation carbon emissions are invaluable.”
About Aero Design Labs L.L.C.
Founded in 2015, Aero Design Labs (ADL) leads the way in the research, development and installation of drag reduction systems for airline fleets globally. ADL modifications to airlines’ existing fleets can result in fuel savings, extend fleet longevity and the potential for billions of pounds of CO2 to be prevented from entering the atmosphere. 
Media inquiries: Richard Bartrem [email protected]
Sales inquiries: David Campbell [email protected]
Logo – https://mma.prnewswire.com/media/2519564/Aero_Design_Labs_Logo_Logo.jpg 

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Artificial Intelligence

DocPro Limited Announces the Launch of DocLegal.ai

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Affordable AI-Powered Legal Solutions
HONG KONG, Sept. 30, 2024 /PRNewswire/ — DocPro Limited, a leading innovator in legal technology, has launched DocLegal.ai, a new platform designed to provide AI-powered legal assistance at an unbeatable price—less than the price of your daily coffee.

DocLegal.ai is a platform that consolidates legal document creation, editing, and review into a single interface. The platform offers the following features:
Custom Document Creation: Users can describe their scenario and receive a tailored legal document.Document Review and Editing: The AI assistant can edit, review, summarize documents, suggest clauses, and highlight potential risks.The platform is designed to provide affordable legal services to small businesses and individuals. It also aims to streamline workflows and automate routine tasks for legal professionals, enabling them to focus on high-value activities.
DocPro Limited has leveraged its experience with DocPro.com, which serves over 50,000 users globally, to develop DocLegal.ai. The company is a graduate of the Cyberport Incubation Program and is currently part of the HKSTP Incubation Program and Google for Startups Cloud Program.
As part of its soft launch, DocLegal.ai is offering exclusive access to the first 500 users for only $2.50  per document. Interested parties can Visit the DocLegal.ai website to sign up.
About DocPro Limited
Founded in 2020, DocPro Limited is a leader in the legal tech space, committed to enhancing the delivery of legal services through innovative AI-powered solutions. With platforms like DocPro.com and DocLegal.ai, DocPro empowers users to create and manage legal documents with unparalleled efficiency and precision. For more information, visit DocLegal.ai.
DocLegal.ai is poised to become an indispensable tool for anyone seeking reliable, efficient, and affordable legal documentation, reinforcing DocPro’s position as a pioneer in legal technology.
Media Enquiries: 
Kim [email protected]

View original content:https://www.prnewswire.co.uk/news-releases/docpro-limited-announces-the-launch-of-doclegalai-302260129.html

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Amagi and Phenix Partner to Bring Next-Gen Low Latency and Seamless Ad Insertion for the Ultimate Viewer Experience

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Bitmovin Complements the Partnership With Its New Player Web X, Guaranteeing Seamless, Crystal-Clear Video Playback
NEW YORK, Sept. 30, 2024 /PRNewswire/ — Amagi, a global leader in cloud-based SaaS technology for broadcast and connected TV (CTV), today announced a partnership with Phenix Real Time Solutions to deliver next-generation FAST (free ad-supported streaming TV) and live events with the lowest latency available in the streaming marketplace. Amagi and Phenix will provide a complete turnkey solution for content owners to achieve real-time streaming with subsecond latency and server-side ad insertion (SSAI). By combining automation, scheduling, real-time streaming, and ad monetization, streaming customers can now deliver a “see it here first” experience, eliminate spoilers from social media, and provide a best-in-class viewing experience for their audiences.

Bitmovin adds a unique element to the mix by ensuring effortless, smooth playback on any browser, regardless of the device. Bitmovin’s open-source plugin system makes integration easy and provides the tools to maintain high-quality playback. The latest update also includes compatibility with Phenix Real-Time SSAI, combining flawless playback with real-time ad insertion.
The direct integration with Phenix now enables Amagi to output content from its Amagi CLOUDPORT automated scheduling and playout system into Phenix’s globally distributed real-time streaming network of over 34 points of presence for real-time delivery to viewers with subsecond latency. Further integration between Amagi’s Ad Tech platform and Phenix’s real-time SSAI capabilities facilitates dynamic and personalized ads while maintaining real-time playback and full compatibility with Bitmovin.
Bill Wishon, Phenix’s Chief Product Officer, stated, “Amagi has established itself as the foremost authority on FAST channel delivery. As a cloud-first company, Amagi has built itself into a pioneer in cloud technology for broadcasting and OTT. We are thrilled to join forces with them in delivering these innovative solutions.”
“Working with Phenix, the leader in real-time, scalable streaming delivery, allows Amagi to offer clients a full solution, including the industry’s first server-side ad insertion in real time. We can’t wait to see how customers deploy these workflows for next-generation OTT streaming,” said Richard Perkett, Chief Product Officer at Amagi.
Amagi provides a complete suite of channel creation, distribution, and monetization solutions. The company’s clients include some of the world’s biggest names, including A+E Networks UK, ABS-CBN, Astro, Cox Media Group, DAZN, Globo, Lionsgate Studio, NBCUniversal, Tastemade, and VIZIO.
Representatives from all the companies will be attending Amagi’s LA FAST 2024 conference on Oct. 1. More information is available at www.amagi.com/events/la-fast.
About Amagi
Amagi is a next-generation media technology company that provides cloud broadcast and targeted advertising solutions to broadcast TV and streaming TV platforms. Amagi enables content owners to launch, distribute, and monetize live linear channels on Free Ad-supported Streaming TV and video services platforms. Amagi also offers 24×7 cloud-managed services bringing simplicity, advanced automation, and transparency to the entire broadcast operations. Overall, Amagi supports 800+ content brands, 800+ playout chains, and over 5,000+ channel deliveries on its platform in over 150 countries. Amagi has a presence in New York, Los Angeles, Toronto, Mexico City, London, Paris, Sydney, Seoul, and Singapore, broadcast operations in New Delhi, and innovation centers in Bengaluru, Zagreb, and Łódź.
About Phenix
As the leader in delivering interactive video at scale, Phenix powers innovative digital experiences that drive acquisition, engagement and retention for some of the world’s biggest brands. Its patented technology is essential for delivering content in real-time that engages audiences with interactive experiences and generates revenue for sportsbooks, sports and gaming properties as well as broadcasters with real-time video streaming to global audiences at broadcast scale. Trusted with streaming video for world-class events like The Oscars, Cheltenham Festival and the Super Bowl, Phenix brings proven experience delivering video to mass audiences for the world’s largest events.
Phenix is headquartered in Chicago, Illinois, with offices in California and Europe. More information is available on the Phenix website or follow them on Twitter and LinkedIn.
About Bitmovin
Bitmovin is the leading provider of video infrastructure for global digital media companies and service providers. The company has been at the forefront of industry innovation and all major developments in the digital video streaming industry. 
Bitmovin built the world’s first commercial adaptive streaming player and deployed the first software-defined encoding service that runs on any cloud platform. Its cloud-native technology offers the most flexible and scalable media encoding, playback, and analytics solutions available with unparalleled device reach, ease of integration, and world-class customer support.
Bitmovin customers benefit from optimized operations, reduced time-to-market, and the best viewer experience possible. Bitmovin is headquartered in Denver, Colorado, and has major offices in Vienna, Klagenfurt, Austria as well as London and Berlin. The company has over 400 customers across the globe, including ClassPass, BBC, fuboTV, Hulu, and Discovery.
More information is available at www.bitmovin.com
Photo: https://mma.prnewswire.com/media/2519499/Amagi_and_Phenix_partner.jpg
 

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