Artificial Intelligence
WISeKey and ARAGO to Present AIoT: When Artificial Intelligence Meets the Internet of Things
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WISeKey and ARAGO to Present AIoT: When Artificial Intelligence Meets the Internet of Things
WISeKey and ARAGO to host a Virtual Fireside Chat between their two founders Carlos Moreira and Chris Boss on AIoT “the Integration of AI with Cybersecurity and IoT”
Geneva – August 17, 2020 – WISeKey International Holding Ltd (“WISeKey”, SIX: WIHN / Nasdaq: WKEY), a leading cybersecurity and IoT company and ARAGO a leading AI company to discuss AIoT during a Fireside Chat with their respective founders on August 19, 2020 at 3:00 PM CET (to register go to https://www.wisekey.com/wisekey-webinar/).
During the Fireside Chat both experts will discuss the exciting benefits to be had from AIoT resulting from the groundbreaking combination of their industry leading products: ARAGO’s AI based Knowledge Automation and Data platform and WISeKey’s Cybersecurity and IoT technologies. AIoT Integrates semiconductors, smart sensors, IoT systems, Artificial Intelligence and a data lake to deliver to customers a unique offering to power innovation and digital transformation. Using WISeKey’s cybersecurity technology and IoT network, data will be collected in HIRO where it can be processed and through automation acted upon in real time in a highly secure environment.
AIoT is the brain that will power the nervous system of the network of IoT objects operating in the WISeKey Ecosystem, which currently connects over 1.6 billion IoT devices secured with WISeKey’s VaultIC. With the introduction of 5G, the ecoSystem will continue to grow at a much faster rate as 5G will enable the connection of every object, person, and machine. AIoT will embed AI into the core infrastructure components of the ecoSystem including Root of Trust, semiconductors, and edge computing. Specialized APIs are then used to provide interoperability between components at the device, software and platform level to optimize system and network operations. Data processed through AIoT is then collected and made accessible to extract value and enhance market intelligence and knowledge for customers. AIoT also enables secure automation of actions and business decisions based on real time data and enables IoT to work independently with minimal human support, unlike the current state of the market which requires that all actions be coded in advance based on pre-defined scenarios. With the use of AI algorithms and predictive maintenance implemented through AIoT, IoT devices will have the capability to dynamically determine actions to take decisions and self-program based on analytics and customer defined knowledge, resulting in lower operating and maintenance costs for providers.
The Fireside Chat will cover areas such as:
About ARAGO
ARAGO GmbH, Eschersheimer Landstraße 526, 60433 Frankfurt am Main (AG Frankfurt, HRB 100909) is a German technology private company which aim is to provide the benefits of Artificial Intelligence to enterprise customers globally through Knowledge Automation. Founded in Frankfurt am Main 1995 the company uses modern technologies such as inference and machine learning in order to automatically operate any business process.
About WISeKey:
WISeKey (NASDAQ: WKEY; SIX Swiss Exchange: WIHN) is a leading global cybersecurity company currently deploying large scale digital identity ecosystems for people and objects using Blockchain, AI and IoT respecting the Human as the Fulcrum of the Internet. WISeKey microprocessors secure the pervasive computing shaping today’s Internet of Everything. WISeKey IoT has an install base of over 1.5 billion microchips in virtually all IoT sectors (connected cars, smart cities, drones, agricultural sensors, anti-counterfeiting, smart lighting, servers, computers, mobile phones, crypto tokens etc.). WISeKey is uniquely positioned to be at the edge of IoT as our semiconductors produce a huge amount of Big Data that, when analyzed with Artificial Intelligence (AI), can help industrial applications to predict the failure of their equipment before it happens. Our technology is Trusted by the OISTE/WISeKey’s Swiss based cryptographic Root of Trust (“RoT”) provides secure authentication and identification, in both physical and virtual environments, for the Internet of Things, Blockchain and Artificial Intelligence. The WISeKey RoT serves as a common trust anchor to ensure the integrity of online transactions among objects and between objects and people. For more information, visit www.wisekey.com.
Press and investor contacts:
Disclaimer:
This communication expressly or implicitly contains certain forward-looking statements concerning WISeKey International Holding Ltd and its business. Such statements involve certain known and unknown risks, uncertainties and other factors, which could cause the actual results, financial condition, performance or achievements of WISeKey International Holding Ltd to be materially different from any future results, performance or achievements expressed or implied by such forward-looking statements. WISeKey International Holding Ltd is providing this communication as of this date and does not undertake to update any forward-looking statements contained herein as a result of new information, future events or otherwise.
This press release does not constitute an offer to sell, or a solicitation of an offer to buy, any securities, and it does not constitute an offering prospectus within the meaning of the Swiss Financial Services Act (“FinSA”), the FInSa’s predecessor legislation or advertising within the meaning of the FinSA, or within the meaning of any other securities regulation. Investors must rely on their own evaluation of WISeKey and its securities, including the merits and risks involved. Nothing contained herein is, or shall be relied on as, a promise or representation as to the future performance of WISeKey. The securities offered will not be, and have not been, registered under the United States of America Securities Act of 1933, as amended, and may not be offered or sold in the United States of America, absent registration or an applicable exemption from the registration requirements of said Act.
WISeKey International Holding Ltd
Company Contact: Carlos Moreira
Chairman & CEO
Tel: +41 22 594 3000
[email protected]WISeKey Investor Relations (US)
Contact: Lena Cati
The Equity Group Inc.
Tel: +1 212 836-9611
[email protected]
Artificial Intelligence
Innovating Security: How FinVolution is Taking Next-Generation Technologies to Fight Deepfake-Driven Financial Crimes
![innovating-security:-how-finvolution-is-taking-next-generation-technologies-to-fight-deepfake-driven-financial-crimes](https://roboticulized.com/wp-content/uploads/2024/07/150901-innovating-security-how-finvolution-is-taking-next-generation-technologies-to-fight-deepfake-driven-financial-crimes.png)
SHANGHAI, July 2, 2024 /PRNewswire/ — Deepfake technology, an artificial intelligence tool capable of generating convincingly fake audio and video, is increasingly being used to perpetrate financial crimes worldwide, raising serious concerns about sophisticated fraud.
In a notable incident reported by CNN earlier this year, a finance worker was tricked into transferring $25 million during a video call with an individual posing as the company’s chief financial officer (CFO), who was actually a deepfake. Such an incident has intensified fears about the vulnerability of financial systems to advanced fraud techniques.
Furthermore, global fintech platforms are confronting a rising wave of AI-driven criminal activities. FinVolution, a leading fintech company, has reported an increase in AI-generated attacks on its platforms, and has significantly invested in deepfake detection technologies to combat this threat.
Growing concerns
The increasing prevalence of deepfake technology in financial crimes has been underscored by a report from Sumsub, an identity verification provider. Its latest annual report revealed that identity fraud cases involving deepfakes have increased tenfold from 2022 to 2023. The situation in the Philippines is particularly concerning, with a staggering 4500% increase in attempted fraud schemes utilizing deepfake technology.
In China, identity fraud involving voice manipulation has outpaced facial deepfakes, with FinVolution intercepting over 1,000 such incidents in just a few months last year. Meanwhile, Southeast Asia is experiencing a surge in AI visual deception techniques, such as facial swaps, which pose new challenges to the security of digital financial services.
Lei Chen, vice president of FinVolution and head of its big data and AI division, emphasized the urgency of the situation. “Globally, the technology to detect fake voices is not keeping pace with the technology used to create them. We are pushing for advancements in AI that can detect these fakes, aiming to align these defenses with the capabilities of large-scale model applications,” Chen said. “Such efforts are vital for effectively safeguarding the security of public information and individual rights.”
Addressing the challenges
In an effort to combat these threats, FinVolution Group has heavily invested in developing voiceprint recognition anti-fraud solutions tailored for financial scenarios.
The company has taken a proactive approach by introducing their proprietary voiceprint recognition algorithmic model, which has been commercially utilized two years before external open-source models. The model has gained recognition within a mere four seconds across millions of transactions. Moreover, it supports multiple languages, including Indonesian, Chinese, Spanish, and more, and holds a particularly strong position in Indonesian and Spanish markets.
FinVolution is also at the forefront of combating fraud in global financial markets with its tailor-made AI anti-fraud technologies. These cutting-edge services include advanced facial and document forgery detection and voice synthesis algorithms, which are integrated into apps of leading international brands.
By leveraging facial recognition and voice verification, these AI-driven tools play a crucial role in preventing illegal impersonation and bolstering the effectiveness of risk management strategies. Notably, in Southeast Asian markets, FinVolution’s technologies stand out by accurately identifying and intercepting financial fraud activities with generative AI, achieving a detection accuracy rate of over 98%.
Advocating for industry collaboration
In another proactive move to advance AI deepfake detection development, FinVolution is leading the charge in fostering industry collaboration. This includes hosting competitions and supporting academic research. For example, the company’s latest initiative — the 9th FinVolution Global Data Science Competition — zeroes in on deepfake speech detection and challenges global participants to leverage deep learning and AI adversarial techniques.
This competition targets the accurate identification of falsified speech generated by the latest large-scale models, with increasing difficulty levels reflecting evolving threats. Notably, this year’s competition has been featured as part of the International Joint Conference on Artificial Intelligence (IJCAI) 2024 challenges.
Looking ahead, FinVolution remains steadfast in its commitment to advancing deepfake recognition technologies, prioritizing user safety, and fostering a secure financial environment on a global scale.
About FinVolution Group
FinVolution Group (NYSE: FINV) is a leading fintech company that connects millions of consumers as well as small-sized enterprises with financial institutions.
Founded in 2007 and listed on the New York Stock Exchange in 2017, we have been at the forefront of the pan-Asian credit technology industry, pioneering innovative technologies in credit risk assessment, fraud detection, big data, and artificial intelligence. With a proven track record of robust growth in pan-Asian countries, we have established leading fintech platforms in China, Indonesia, and the Philippines.
View original content:https://www.prnewswire.co.uk/news-releases/innovating-security-how-finvolution-is-taking-next-generation-technologies-to-fight-deepfake-driven-financial-crimes-302187840.html
Artificial Intelligence
Kanazawa University research: Atomic force microscopy in 3D
![kanazawa-university-research:-atomic-force-microscopy-in-3d](https://roboticulized.com/wp-content/uploads/2024/07/150903-kanazawa-university-research-atomic-force-microscopy-in-3d.png)
KANAZAWA, Japan, July 2, 2024 /PRNewswire/ — Researchers at Nano Life Science Institute (WPI-NanoLSI), Kanazawa University report in Small Methods the 3D imaging of a suspended nanostructure. The technique used is an extension of atomic force microscopy and is a promising approach for visualizing various 3D biological systems.
Atomic force microscopy (AFM) was originally invented for visualizing surfaces with nanoscale resolution. Its basic working principle is to move an ultrathin tip over a sample’s surface. During this xy-scanning motion, the tip’s position in the direction perpendicular to the xy-plane follows the sample’s height profile, resulting in a height map of the surface. In recent years, ways to extend the method to three-dimensional (3D) imaging have been explored, with researchers from Nano Life Science Institute (WPI-NanoLSI), Kanazawa University reporting pioneering experiments on living cells. However, for 3D-AFM to evolve into a widely applicable technique for visualizing flexible molecular structures, a thorough understanding of the imaging mechanisms at play is necessary. Now, Takeshi Fukuma from Kanazawa University and colleagues have performed a detailed study of a specially designed flexible sample, providing essential insights into the theoretical basis and the interpretation of 3D-AFM experiments.
Using microfabrication tools, the scientists created a sample consisting of a carbon nanotube fiber resting on platinum pillars that in turn were positioned on a silicon substrate. A carbon nanotube is a structure that one can think of as a rolled-up, one-atom-thick carbon sheet. The freestanding portion of the nanotube was about 2 micrometers long. The whole structure was immersed in water, as many 3D biomolecular systems of interest occur in liquid environments.
Fukuma and colleagues then performed 3D-AFM experiments in two different modes. In static mode, the nanotip is lowered vertically towards the sample. When the tip makes contact with the suspended nanotube fiber, the latter gets pushed aside, and bends while the probe descends further. In dynamic mode, the tip, which is attached to a cantilever, is made to oscillate at a resonance frequency while being lowered. By analyzing how the force experienced by the tip changes as a function of the tip’s depth, the researchers concluded that the friction between the tip and the fiber is much larger in static mode compared to dynamic mode. The latter is therefore the mode of choice, as less friction means that potential damage to the sample is less likely.
The scientists performed computer simulations to model what happens when the tip reaches the carbon nanotube fiber. The simulations confirmed that the suspended nanotube displaces laterally, and that a continuously vibrating tip (as in dynamical mode) results in weaker forces experienced by the sample, hindering strong adhesion of the tip to the fiber.
Fukuma and colleagues then performed experiments with a carbon nanotube fiber suspended above a regular pattern of nano-sized platinum dots deposited on a silicon substrate. The measurements were done in dynamical mode. The reconstructed 3D map of the scanned volume clearly showed the fiber and the dots below it, underlining the capability of 3D-AFM to image vertically overlapping nanostructures.
These findings show that AFM can generally be applied to visualize flexible 3D structures. Quoting the scientists: “… the advancements made in this study may potentially lead to more detailed and accurate AFM analysis of various 3D biological systems such as cells, organelles, chromosomes, and vesicles.”
Background
Atomic force microscopy
The principle behind atomic force microscopy (AFM) is to scan the surface of a sample with a very small tip. During this horizontal (xy) scan, the tip, attached to a small cantilever, follows the sample’s vertical (z) profile, which induces a force on the cantilever that can be measured. The magnitude of the force at the xy position can be related to the z value. The xyz data generated during a scan then result in a height map providing structural information about the investigated sample. The cantilever can be made to oscillate near its resonance frequency, which is referred to as dynamic mode AFM. Not letting the cantilever oscillate is known as static mode AFM. In dynamic mode, when the tip is moved around a surface, the variations in the amplitude (or the frequency) of the cantilever’s oscillation — resulting from the tip’s interaction with the sample’s surface — are recorded, as these provide a measure for the local z value.
Takeshi Fukuma and colleagues have now provided a detailed AFM analysis of a 3D reference sample with nanosized features that could be reconstructed with high precision. The experiments and accompanying simulations confirm that AFM has the potential to become a robust method for the characterization of 3D nanosized objects, including biological systems.
Reference
Mohammad Shahidul Alam, Marcos Penedo, Takashi Sumikama, Keisuke Miyazawa, Kaori Hirahara, and Takeshi Fukuma. Revealing the Mechanism Underlying 3D-AFM Imaging of Suspended Structures by Experiments and Simulations, Small methods, 2400287 (2024). First published : 21 June 2024
DOI: 10.1002/smtd.202400287
URL: https://onlinelibrary.wiley.com/doi/10.1002/smtd.202400287
Figure 1. https://nanolsi.kanazawa-u.ac.jp/wp/wp-content/uploads/Figure-1-1.jpg Imaged nanostructure consisting of a suspended carbon nanotube with platinum nanodots beneath.
© 2024 Mohammad Shahidul Alam, et al., Small Methods published by Wiley-VCH GmbH
Contact
Hiroe Yoneda Senior Specialist in Project Planning and OutreachNanoLSI Administration Office, Nano Life Science Institute (WPI-NanoLSI)Kanazawa UniversityKakuma-machi, Kanazawa 920-1192, JapanEmail: [email protected] Tel: +81 (76) 234-4555
About Nano Life Science Institute (WPI-NanoLSI), Kanazawa University
Understanding nanoscale mechanisms of life phenomena by exploring “uncharted nano-realms”
Cells are the basic units of almost all life forms. We are developing nanoprobe technologies that allow direct imaging, analysis, and manipulation of the behavior and dynamics of important macromolecules in living organisms, such as proteins and nucleic acids, at the surface and interior of cells. We aim at acquiring a fundamental understanding of the various life phenomena at the nanoscale.
https://nanolsi.kanazawa-u.ac.jp/en/
About the World Premier International Research Center Initiative (WPI)
The WPI program was launched in 2007 by Japan’s Ministry of Education, Culture, Sports, Science and Technology (MEXT) to foster globally visible research centers boasting the highest standards and outstanding research environments. Numbering more than a dozen and operating at institutions throughout the country, these centers are given a high degree of autonomy, allowing them to engage in innovative modes of management and research. The program is administered by the Japan Society for the Promotion of Science (JSPS).
See the latest research news from the centers at the WPI News Portal: https://www.eurekalert.org/newsportal/WPI
Main WPI program site:
www.jsps.go.jp/english/e-toplevel
About Kanazawa University
As the leading comprehensive university on the Sea of Japan coast, Kanazawa University has contributed greatly to higher education and academic research in Japan since it was founded in 1949. The University has three colleges and 17 schools offering courses in subjects that include medicine, computer engineering, and humanities.
The University is located on the coast of the Sea of Japan in Kanazawa – a city rich in history and culture. The city of Kanazawa has a highly respected intellectual profile since the time of the fiefdom (1598-1867). Kanazawa University is divided into two main campuses: Kakuma and Takaramachi for its approximately 10,200 students including 600 from overseas.
http://www.kanazawa-u.ac.jp/e/
View original content:https://www.prnewswire.co.uk/news-releases/kanazawa-university-research-atomic-force-microscopy-in-3d-302187814.html
Artificial Intelligence
YES Panel-Level Through Glass Via (TGV) Etch Tool Placed in Production
![yes-panel-level-through-glass-via-(tgv)-etch-tool-placed-in-production](https://roboticulized.com/wp-content/uploads/2024/07/150905-yes-panel-level-through-glass-via-tgv-etch-tool-placed-in-production.jpg)
FREMONT, Calif., July 2, 2024 /PRNewswire/ — YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that Its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models. The TersOnus TGV system provides superior quality and total cost of ownership for manufacturing of panel-level products. YES has developed the equipment and process technologies required for high aspect ratio through glass vias for a variety of glass types, as well as for manufacturing a diversity of glass via configurations—such as hourglass, straight, and tapered vias—by leveraging different chemistries. Furthermore, these sub-50 µm vias can be created with various aspect ratios while meeting customers specifications. The TersOnus TGV system is being used for production of advanced 2.5D and 3D packages by the world’s leading semiconductor manufacturers.
“To accommodate performance requirements of new emerging applications, semiconductor solutions are moving to a chiplet based architecture that has higher interface bandwidth, larger memory and more heat dissipation. It also requires larger substrate sizes at the same time,” said Michael Daly, SVP of Wet BU at YES. “These large substrate sizes are not economically possible with traditional organics materials. The semiconductor industry is moving to Glass based substrates for these leading-edge applications. Our Wet process tools for creating TGVs for glass panels are fully automated and can handle multiple panels simultaneously. In addition, our tools offer integrated in-line metrology for process control and maintaining consistent etch performance,” Daly added.
“YES has maintained its leadership position in the advanced packaging market segment by enabling customer roadmaps through the delivery of superior products with low cost-of-ownership and high reliability. The TersOnus TGV delivers on this commitment by providing excellent etch rates and aspect ratios for the most challenging through glass vias all the while reducing manufacturing cycle times. The TersOnus TGV is just one of many products that YES has introduced and will be introducing to the burgeoning glass panel market to support AI advancement,” Rezwan Lateef, President of YES concluded.
About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.
Media Contact
Alex ChowSVP Business Development & Mktg / Asia PresidentYES (Yield Engineering Systems, Inc.)+886-926136155 [email protected]
Logo – https://mma.prnewswire.com/media/2357724/YES_TM_logo_RGBv2_Logo.jpg
View original content:https://www.prnewswire.co.uk/news-releases/yes-panel-level-through-glass-via-tgv-etch-tool-placed-in-production-302187572.html
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