Artificial Intelligence
The global market for Photonic Integrated Circuit (PIC) is projected to reach US$3.1 billion by 2025
New York, Nov. 03, 2020 (GLOBE NEWSWIRE) — Reportlinker.com announces the release of the report “Global Photonic Integrated Circuit (PIC) Industry” – https://www.reportlinker.com/p03646045/?utm_source=GNW
The growing opportunity in optical communications therefore bodes well for the growth of PICs. Optical communication, also known as optical telecommunication, is growing in popularity driven by factors such as demand for faster internet broadband speeds, ubiquity of data communications networks, and growing use of bandwidth intensive applications such as provision of high speed internet (HSI) and triple play bundled services that includes voice, data, and video streaming. Investments in optical network infrastructures are therefore witnessing robust gains. In addition to telecommunication service providers and MNOs, even companies are rapidly shifting to fibre-optic enabled enterprise networks to handle ever-increasing big data loads and leverage benefits of technologies like IoT, cloud and artificial intelligence. While migration from copper wires to optical fibre access networks begins to mature, there is currently a strong undercurrent of change in the optical networking industry. The industry is witnessing a shift from Passive Optical Networks (PON) technology to Active Optical Network (AON). PON technology utilizes optical splitters to separate light signals of different wavelengths as they are transmitted through the network. AON, on the other hand, utilizes electrical switching equipment like routers, switch aggregator, amplifiers and repeaters, for signal distribution, management and delivery.
Increased deployment of agile optical networks (AON) by network service providers is expected to open up new opportunities for the use of PICs in enabling dynamic scaling of network infrastructures in response to fluctuating data traffic. Few of the factors that will help widen the application and adoption of PICs include breakthroughs in the development of application specific photonic integrated circuits (ASPICs) for new generation optoelectronic devices; innovations in fabrication technologies of ASPICs; surging investments in advanced telecom infrastructure; progressive improvements in photonic integration with conventional technology processes; emphasis on optical signal processing in fiber optic networks; high tide in Wi-Fi equipment installations; and emerging era of quantum computing, among others.
Integration of silicon photonics devices with traditional electronics will unleash new opportunities in on-chip and on-board communication; chip-to-chip interconnections; optical sensing and biophotonics. As we inch closer to exascale computing, optical interconnections will offer an alternative to the otherwise dense network of copper interconnections that will be needed. Photonic Integrated Circuit (PIC) integrates multiple photonic functions and hence is more suitable for exascale processing. While electronic integrated circuits are dense, they can never match the speed offered by PICs. PICs have higher bandwidth; higher levels of immunity to electromagnetic interference; and are compatible with current CMOS fabrication technologies. A PIC comprises of optical devices such as modulators, optical amplifiers, lasers and multiplexers. Asia-Pacific including China is a major market led by developing telecom and electronics industries and rapid shift of the global semiconductor manufacturing base to Southeast Asian countries.
Read the full report: https://www.reportlinker.com/p03646045/?utm_source=GNW
I. INTRODUCTION, METHODOLOGY & REPORT SCOPE
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
An Introduction to Photonic Integrated Circuit (PIC)
Materials Used in Making PIC
Integration Models for PIC
Applications
Photonic Integrated Circuit (PIC): Current Market Scenario and
Outlook
Indium Phosphide: Largest & Fastest Growing Material Type
Silicon Substrates Remain in Contention
Hybrid Integration: The Widely Used PIC Fabrication Method
Monolithic Integration Emerges as Fastest Growing Fabrication
Approach
COMPETITIVE LANDSCAPE
Photonic Integrated Circuit (PIC): Fragmented Marketplace
Photonic Integrated Circuit (PIC) Competitor Market Share
Scenario Worldwide (in %): 2020
Recent Market Activity
Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Optical Communications: Largest Application Market for PIC
Key Trends Influencing the Uptake of PICs in Optical
Communication Space
Soaring Deployments of 100G & Ultra-100G OTNs
Growing Uptake of FTTx Networks
Growing Bandwidth Needs Bring Fiber Optic Networks to the Fore,
Steering PIC Demand
Global IP Traffic Volume in Exabytes for the Years 2019 and 2022
Global IP Traffic Scenario (2019): Percentage Breakdown of Data
Usage by Consumer Segment
A Note on Factors Influencing IP Traffic Growth & Bandwidth Needs
Sharp Increase in Number of Internet Subscribers
Breakdown of Number of Internet Users Worldwide, by Region
(in Millions): H1 2019
High Penetration of IP-enabled Devices
Smartphone Adoption Worldwide by Region (in %): 2018 & 2025
Number of Smartphone Users Worldwide (in Billion): 2016-2022
Global Wireless Communication Market (2018 & 2020): Percentage
Breakdown of Traffic Volume by Mobile Device Type
Faster Broadband Speeds
Proliferation of Bandwidth-Intensive Applications
Breakdown of Global IP Traffic by Application Type (in %): 2019 &
2022
Infrastructure Verticals Where Telecom Investments Continue to
Remain High
Long-Haul Networks
Metropolitan Area Networks (MANs)
Access Networks
Optical Signal Processing Emerges as Fastest Growing
Application Segment
Biophotonics: A Niche Market Segment for PIC
Global Biophotonics Market (2019): Percentage Breakdown of
Revenues by Geographic Region
Expanding Application Base for Biophotonics Generates Parallel
Opportunities for PIC
Increased Focus on Optical In-Vitro Diagnostics Augurs Well
Northbound Trajectory in Fiber Optic Sensors Vertical Gives
Impetus to Market Expansion
Global Fiber Optic Sensors Market (2019 & 2024): Breakdown of
Sales in US$ Million by Geographic Region
Expanding Role of DCI in Data Centers Creates Potential Market
Opportunities
Major Data Center Trends Influencing DCI Implementations
Rapid Growth in Data Center Traffic
Data Center New Floor Space Capacity Additions (in ?000 Sq. ft.)
Worldwide for the Years 2013, 2015, 2017, and 2019
Sharp Expansion in Cloud Data Center
Global Data Center Traffic Scenario (2018, 2020 & 2022):
Percentage Breakdown of Data Center Traffic by Equipment Type
Global Cloud Data Center Market (2018 & 2022): Percentage
Breakdown of Data Center Traffic by Cloud Type
Transition towards Data Center Consolidation
Growing Role of Virtualization
High Tide in Wi-Fi Equipment Installations Bodes Well
Smart Cities Concept to Underpin Sales Growth in the Coming Years
World Smart City Investments (in US$ Billion) for the Years
2018 through 2025
Breakdown of World Smart City Investments (in %) by Country/
Region for the Year 2019
Smart Homes to Drive Demand for PICs
Global Smart Homes Market (In US$ Billion) for the Years 2019,
2021, 2023 & 2025
Upcoming Quantum Computing Model to Infuse New Growth
Opportunities
Economic Unviability of Electronic IC in OEO Conversion Puts
Focus on Photonic IC
Photonic IC vs. Electronic IC: A Brief Comparative Analysis
Reduced Number of Optical Packages & Decreased Need for Fiber
Coupling Enhance the Image of PIC
Technology Innovations: Key to High Growth and Consistent Demand
Next Generation Silicon Photonics & Polymer Based Photonic ICs
Enhance Speed, Bandwidth and Scalability
Collaborative Initiatives Foster Development of Innovative
Products
4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region – USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa Markets – Independent Analysis of Annual Sales in
US$ Million for Years 2020 through 2027
Table 2: World 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Geographic Region – Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets for
Years 2020 & 2027
Table 3: World Current & Future Analysis for Hybrid Integration
by Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 4: World 7-Year Perspective for Hybrid Integration by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 5: World Current & Future Analysis for Monolithic
Integration by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 6: World 7-Year Perspective for Monolithic Integration by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 7: World Current & Future Analysis for Module Integration
by Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 8: World 7-Year Perspective for Module Integration by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 9: World Current & Future Analysis for Indium Phosphide
(InP) by Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 10: World 7-Year Perspective for Indium Phosphide (InP)
by Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 11: World Current & Future Analysis for
Silicon-on-Insulator (SOI) by Geographic Region – USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa Markets – Independent Analysis of Annual Sales in
US$ Million for Years 2020 through 2027
Table 12: World 7-Year Perspective for Silicon-on-Insulator
(SOI) by Geographic Region – Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2020 & 2027
Table 13: World Current & Future Analysis for Gallium Arsenide
(GaAs) by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 14: World 7-Year Perspective for Gallium Arsenide (GaAs)
by Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 15: World Current & Future Analysis for Silicon (Si) by
Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 16: World 7-Year Perspective for Silicon (Si) by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 17: World Current & Future Analysis for Other Raw
Materials by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 18: World 7-Year Perspective for Other Raw Materials by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 19: World Current & Future Analysis for Optical
Communications by Geographic Region – USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets – Independent Analysis of Annual Sales in US$
Million for Years 2020 through 2027
Table 20: World 7-Year Perspective for Optical Communications
by Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 21: World Current & Future Analysis for Optical Signal
Processing by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 22: World 7-Year Perspective for Optical Signal
Processing by Geographic Region – Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2020 & 2027
Table 23: World Current & Future Analysis for Other
Applications by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 24: World 7-Year Perspective for Other Applications by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
III. MARKET ANALYSIS
GEOGRAPHIC MARKET ANALYSIS
UNITED STATES
The United States: Largest Market for PIC Solutions
Telecom Industry?s Focus on High-Speed Fiber Networks Builds
Momentum
Fiber Optic Deployments Register Steady Growth
Fiber Optics Industry Benefits from Telecom Regulatory Act, 1996
Percentage (%) of Population Covered by Fiber Networks in
Select States
Novel Use Case of Biophotonics in Medical Devices Augurs Well
Mainstream Image of Fiber Optic Sensors to Underpin Market
Expansion
Market Analytics
Table 25: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Technique – Hybrid Integration, Monolithic
Integration and Module Integration – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 26: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 27: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Raw Material – Indium Phosphide (InP),
Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon
(Si) and Other Raw Materials – Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027
Table 28: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 29: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Application – Optical Communications, Optical
Signal Processing and Other Applications – Independent Analysis
of Annual Sales in US$ Million for the Years 2020 through 2027
Table 30: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
CANADA
Uptrend in the Telecom Sector Encourages PIC Market
Growing Use of Fiber Optic Sensors Revs Up PIC Demand
Market Analytics
Table 31: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 32: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 33: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 34: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 35: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 36: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
JAPAN
Being a Major Fiber Optics Consumer, Japan Continues to Extend
Opportunities
Market Analytics
Table 37: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 38: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 39: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 40: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 41: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 42: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
CHINA
China Emerges as the Fastest Growing Regional Market
Uptrend in Fiber Optic Deployments Enthuses PIC Market in China
Increased Adoption of Fiber Optic Sensors Infuses Market Momentum
Sensors Manufacturing Scenario in China
Market Analytics
Table 43: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 44: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 45: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 46: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 47: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 48: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
EUROPE
Stable Expansion in Fiber Optic Networks Bodes Well for PIC
Market in Europe
Healthy Home Entertainment Sector Spurs Demand for Fiber Optic
Networks
Household Penetration of FTTH & FTTB (in %) in Select European
Countries: 2019
Market Analytics
Table 49: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region – France,
Germany, Italy, UK, Spain, Russia and Rest of Europe Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 50: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Geographic Region – Percentage Breakdown of
Value Sales for France, Germany, Italy, UK, Spain, Russia and
Rest of Europe Markets for Years 2020 & 2027
Table 51: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 52: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 53: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 54: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 55: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 56: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
FRANCE
Table 57: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 58: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 59: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 60: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 61: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 62: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
GERMANY
Table 63: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 64: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 65: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 66: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 67: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 68: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
ITALY
Table 69: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 70: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 71: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 72: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 73: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 74: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
UNITED KINGDOM
Robust Expansion on the Cards amid Soaring Investments on Fiber
Optic Networks
Market Analytics
Table 75: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Technique – Hybrid Integration, Monolithic
Integration and Module Integration – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 76: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Technique – Percentage Breakdown of Value Sales for
Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 77: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Raw Material – Indium Phosphide (InP),
Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon
(Si) and Other Raw Materials – Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027
Table 78: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Raw Material – Percentage Breakdown of Value Sales for
Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium
Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the
Years 2020 & 2027
Table 79: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Application – Optical Communications, Optical
Signal Processing and Other Applications – Independent Analysis
of Annual Sales in US$ Million for the Years 2020 through 2027
Table 80: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Application – Percentage Breakdown of Value Sales for
Optical Communications, Optical Signal Processing and Other
Applications for the Years 2020 & 2027
SPAIN
Table 81: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 82: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 83: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 84: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 85: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 86: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
RUSSIA
Table 87: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 88: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 89: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 90: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 91: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 92: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
REST OF EUROPE
Table 93: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 94: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Technique – Percentage Breakdown of
Value Sales for Hybrid Integration, Monolithic Integration and
Module Integration for the Years 2020 & 2027
Table 95: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 96: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Raw Material – Percentage Breakdown
of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator
(SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw
Materials for the Years 2020 & 2027
Table 97: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 98: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Application – Percentage Breakdown
of Value Sales for Optical Communications, Optical Signal
Processing and Other Applications for the Years 2020 & 2027
ASIA-PACIFIC
Healthy Trajectory in Telecommunications Sector Augurs Well
Pan Asian Continental Terrestrial Fiber Optic Network
A Note on Submarine Cables in Asia
Market Analytics
Table 99: Asia-Pacific Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region – Australia,
India, South Korea and Rest of Asia-Pacific Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 100: Asia-Pacific 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Geographic Region – Percentage
Breakdown of Value Sales for Australia, India, South Korea and
Rest of Asia-Pacific Markets for Years 2020 & 2027
Table 101: Asia-Pacific Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 102: Asia-Pacific 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Technique – Percentage Breakdown of
Value Sales for Hybrid Integration, Monolithic Integration and
Module Integration for the Years 2020 & 2027
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Artificial Intelligence
More than $9 Million Awarded to High School Scientists and Engineers at the Regeneron International Science and Engineering Fair 2024
Grace Sun, 16, receives $75,000 Top Award for a new kind of organic electrochemical transistor at the world’s largest pre-college science, technology, engineering and math (STEM) competition.
TARRYTOWN, N.Y. and WASHINGTON, May 17, 2024 /PRNewswire/ — Regeneron Pharmaceuticals, Inc. (NASDAQ: REGN) and Society for Science (the Society) announced that Grace Sun, 16, of Lexington, Kentucky, won the $75,000 top award, the George D. Yancopoulos Innovator Award, named in honor of the pioneering drug researcher and Regeneron co-Founder, Board co-Chair, President and Chief Scientific Officer, in the 2024 Regeneron International Science and Engineering Fair (Regeneron ISEF), the world’s largest pre-college science and engineering competition. Other top prizes went to projects in second-order cone programming, microplastics filtration and multi-sensory therapy for dementia.
The top winners were honored during two award ceremonies: the Special Awards on May 16 and the Grand Awards Ceremony on the morning of May 17. In total, over $9 million USD was awarded to the finalists based on their projects’ creativity, innovation and depth of scientific inquiry. The competition featured nearly 2,000 young scientists representing 49 U.S. states and nearly 70 countries, regions and territories across the world.
Grace Sun, 16, of Lexington, Kentucky, won first place and received the $75,000 George D. Yancopoulos Innovator Award for her research on building a better organic electrochemical transistor that she hopes will be used to develop new electronic devices that could help detect and treat serious illnesses like diabetes, epilepsy and organ failure. To overcome the problems that have previously prevented such devices from working effectively inside the body, Grace developed a new way of chemically treating their organic components, which greatly improved their laboratory performance.
Michelle Wei, 17, of San Jose, California, received one of two Regeneron Young Scientist Awards of $50,000 for her research to improve the speed and efficiency of a type of software that is useful in many fields such as machine learning, transportation and financial systems. Michelle’s new approach involved determining a quick approximate solution to the second-order cone programming problem, then splitting the initial cone into smaller cones, which enabled her new algorithm to greatly outperform previous approaches.
Krish Pai, 17, of Del Mar, California, received the second Regeneron Young Scientist Award of $50,000 for his machine-learning research to identify microbial genetic sequences that can be modified to biodegrade plastic. His new software, called Microby, scans databases of microorganisms and determines which ones can be changed genetically to biodegrade plastics. In tests, he identified two microorganisms that can be genetically modified to degrade plastic at a cost he believes would be ten times less than traditional recycling.
“Congratulations to the Regeneron International Science and Engineering Fair 2024 winners,” said Maya Ajmera, President and CEO, Society for Science and Executive Publisher, Science News. “I’m truly inspired by the ingenuity and determination shown by these remarkable students. Coming from around the world with diverse backgrounds and academic disciplines, these students have shown that it is possible to come together in unity to tackle some of the toughest challenges facing our world today, and I could not be prouder.”
Regeneron ISEF provides a global stage for the world’s best and brightest young scientists and engineers. Through this competition, Regeneron and the Society are fostering the next generation of STEM leaders who are pioneering solutions to improve our world. Since 2020, Regeneron has provided STEM experiences to approximately 2.4 million students, on track to meet its goal of 2.5 million by 2025.
“The talent, intelligence and potential of this year’s Regeneron ISEF finalists is truly inspiring, and I congratulate each on their remarkable achievements,” said George D. Yancopoulos, M.D., Ph.D., co-Founder, Board co-Chair, President and Chief Scientific Officer of Regeneron. “Science competitions like ISEF were pivotal in shaping my own career and fueling my passion to fight back against disease. I look forward to seeing these students continue to push the boundaries of science and technology to create positive and sustainable change for all humanity.”
Other top honors from the competition include:
Justin Huang and Victoria Ou, both 17, of Woodlands, Texas, received the Gordon E. Moore Award for Positive Outcomes for Future Generations of $50,000 for their new prototype filtration system that uses ultrasonic waves to remove microscopic plastic particles from water. In lab tests, the acoustic force from the high-frequency sound waves removed between 84% and 94% of the suspended microplastic particles in a single pass. The students are now working to scale up and fine-tune their experimental system.
Ingrid Wai Hin Chan, 17, of Hong Kong, China received the Craig R. Barrett Award for Innovation of $10,000 for her research on using a multi-sensory therapy for dementia patients. Her mixed therapy app would allow patients to practice physical and cognitive skills through a personalized, immersive environment using virtual reality headsets. Ingrid conducted an eight-week study with six people living with dementia and found that the cognitive function of patients who used her prototype improved in several areas. She believes her app could serve as a viable option for dementia patients with limited access to in-person professional therapy.
Tanishka Balaji Aglave, 15, of Valrico, Florida, received the H. Robert Horvitz Prize for Fundamental Research of $10,000 for her investigation into a natural alternative treatment against citrus greening, a disease that threatens citrus farming in many parts of the world and is currently only treated with antibiotics. Tanishka injected the trunks of infected trees with an extract from the curry leaf tree, and found through tests that this potential method could effectively and sustainably manage citrus greening disease.
Maddux Alexander Springer, 18, of Honolulu, Hawaii, received the Peggy Scripps Award for Science Communication of $10,000 for his research into fibropapillomatosis (FP), a disease that is the primary cause of death in green sea turtles. Some turtles he studied in Kaneohe Bay, Hawaii, were stricken with a disease that causes internal and external tumors that inhibit their everyday lives. After analyzing the turtles’ diet of green algae, Maddux concluded that this disease, wastewater, invasive algae and the amino acid arginine all pose a grave risk to these endangered sea creatures.
Ria Kamat, 17, of Hackensack, New Jersey; Anna Oliva, 17, of Houston, TX; and Shuhan Luo, 18, of Worcester, MA, received the Dudley R. Herschbach SIYSS Award, which provides finalists an all-expense paid trip to attend the Stockholm International Youth Science Seminar during Nobel Week in Stockholm, Sweden.
Jack Shannon, 18, of Clane, Kildare, Ireland, and Nikhil Vemuri, 17, of Cary, North Carolina, received the EU Contest for Young Scientists Award. Their projects will represent Regeneron ISEF at the EU Contest for Young Scientists to be held this September in Katowice, Poland.
For more information about the top winners and access to visual assets visit: https://www.societyforscience.org/isef-2024-media-kit.
The full list of Special Award ISEF 2024 Finalists can be found at https://www.societyforscience.org/press-release/regeneron-isef-2024-special-awards-winners.
In addition to the Top Award winners, more than 450 finalists received awards and prizes for their innovative research, including “First Award” winners, who each received a $5,000 prize.
The following lists the First Award winners for each of the 22 categories, from which the Top Awards were chosen:
Animal Sciences, sponsored by Society for ScienceMaddux Alexander Springer, Honolulu, Hawaii
Behavioral and Social Sciences, sponsored by Society for ScienceAndrew Y. Liang, San Jose, California
Biochemistry, sponsored by RegeneronAmy Hong Xiao, Garden City, New York
Biomedical and Health Sciences, sponsored by RegeneronRia Kamat, Hackensack, New Jersey; Kevin Xuan Lei, Shanghai, China
Biomedical Engineering, sponsored by Alfred E. Mann CharitiesAyush Garg, Dublin, California; Divij Motwani, Palo Alto, California; Akash Ashish Pai, Portland, Oregon
Cellular and Molecular Biology, sponsored by RegeneronLara and Maya Sarah Hammoud, Beverly Hills, Michigan
Chemistry, sponsored by Society for ScienceAkilan Sankaran, Albuquerque, New Mexico; Arjun Suresh Malpani and Siddharth Daniel D’costa, Portland, Oregon
Computational Biology and Bioinformatics, sponsored by RegeneronKun-Hyung Roh, Bronx, New York
Earth and Environmental Sciences, sponsored by Google.orgNikhil Vemuri, Durham, North Carolina; Justin Yizhou Huang and Victoria Ou, The Woodlands, Texas
Embedded Systems, sponsored by HPChloe Rae and Sophie Rose Filion, Welland, Ontario, Canada
Energy: Sustainable Materials and Design, sponsored by Siemens EnergyAlia Wahban, Hamilton, Ontario, Canada
Engineering Technology: Statics and Dynamics, sponsored by Howmet Aerospace FoundationChiyo Nakatsuji, Bunkyoku, Tokyo, Japan; Kevin Shen, Olympia, Washington
Environmental Engineering, sponsored by JacobsKrish Pai, San Diego, California; Jack Shannon, Clane, Kildare, Ireland
Materials Science, sponsored by Howmet Aerospace FoundationGrace Sun, Lexington, Kentucky
Mathematics, sponsored by Akamai FoundationAnna Oliva, Houston, Texas
Microbiology, sponsored by Schattner FoundationMatthew Chang, Irvine, California
Physics and Astronomy, sponsored by Richard F. Caris Charitable Trust IIHarini Thiagarajan and Vishal Ranganath Yalla, Bothell, Washington; Shuhan Luo, Worcester, Massachusetts
Plant Sciences, sponsored by Society for SciencePauline Estrada, Fresno, California; Tanishka Balaji Aglave, Dover, Florida
Robotics and Intelligent Machines, sponsored by RegeneronMichal Lajciak, Dubnica nad Vahom, Trenciansky kraj, Slovakia; Anthony Efthimiadis, Oakville, Ontario, Canada
Systems Software, sponsored by MicrosoftMichelle Wei, San Jose, California
Technology Enhances the Arts, sponsored by Society for ScienceAnant Khandelwal, Sritan Motati and Siddhant Sood, Alexandria, Virginia
Translational Medical Science, sponsored by RegeneronZheng-Chi Lee, West Lafayette, Indiana; Ingrid Wai Hin Chan, Hong Kong, China
The full list of all award-winning ISEF 2024 finalists is available here: https://www.societyforscience.org/press-release/regeneron-isef-2024-full-awards.
View all the finalists’ research here: https://projectboard.world/isef.
About the Regeneron International Science and Engineering FairThe Regeneron International Science and Engineering Fair (Regeneron ISEF), a program of Society for Science for over 70 years, is the world’s largest global science competition for high school students. Through a global network of local, regional and national science fairs, millions of students are encouraged to explore their passion for scientific inquiry. Each spring, a group of these students is selected as finalists and offered the opportunity to compete for approximately U.S. $9 million in awards and scholarships.
In 2019, Regeneron became the title sponsor of ISEF to help reward and celebrate the best and brightest young minds globally and encourage them to pursue careers in STEM to positively impact the world. Regeneron ISEF is supported by a community of additional sponsors, including Akamai Foundation, Alfred E. Mann Charities, Aramco, Caltech, Google.org, Gordon and Betty Moore Foundation, Howmet Aerospace Foundation, HP, , Jacobs, King Abdulaziz & his Companions Foundation for Giftedness and Creativity, Microsoft, National Geographic Society, Richard F. Caris Charitable Trust II, Rise, an initiative of Schmidt Futures and the Rhodes Trust, Schattner Foundation, Siemens Energy, Annenburg Foundation, Ballmer Group, Broadcom Foundation, Cesco Linguistic Services, Conrad N. Hilton Foundation, Edison International, Insaco, Oracle Academy, The Eli and Edythe Broad Foundation, The Ralph M. Parsons Foundation and US Army ROTC. Many are entrepreneurs across a wide range of industries. Learn more at https://www.societyforscience.org/isef/.
About Society for ScienceSociety for Science is a champion for science, dedicated to promoting the understanding and appreciation of science and the vital role it plays in human advancement. Established in 1921, Society for Science is best known for its award-winning journalism through Science News and Science News Explores, its world-class science research competitions for students, including the Regeneron Science Talent Search, the Regeneron International Science and Engineering Fair and the Thermo Fisher Scientific Junior Innovators Challenge, and its outreach and equity programming that seeks to ensure that all students have an opportunity to pursue a career in STEM. A 501(c)(3) membership organization, Society for Science is committed to inform, educate and inspire. Learn more at www.societyforscience.org and follow us on Facebook, Twitter, Instagram and Snapchat (Society4Science).
About RegeneronRegeneron (NASDAQ: REGN) is a leading biotechnology company that invents, develops and commercializes life-transforming medicines for people with serious diseases. Founded and led by physician-scientists, our unique ability to repeatedly and consistently translate science into medicine has led to numerous approved treatments and product candidates in development, most of which were homegrown in our laboratories. Our medicines and pipeline are designed to help patients with eye diseases, allergic and inflammatory diseases, cancer, cardiovascular and metabolic diseases, neurological diseases, hematologic conditions, infectious diseases and rare diseases.
Regeneron believes that operating as a good corporate citizen is crucial to delivering on our mission. We approach corporate responsibility with three goals in mind: to improve the lives of people with serious diseases, to foster a culture of integrity and excellence and to build sustainable communities. Regeneron is proud to be included on the Dow Jones Sustainability World Index and the Civic 50 list of the most “community-minded” companies in the U.S. Throughout the year, Regeneron empowers and supports employees to give back through our volunteering, pro bono and matching gift programs. Our most significant philanthropic commitments are in the area of early science education, including the Regeneron Science Talent Search and the Regeneron International Science and Engineering Fair (ISEF).
For more information, please visit www.Regeneron.com or follow Regeneron on LinkedIn, Instagram, Facebook or X.
More information about the top winners and access to visual assets visit: https://www.societyforscience.org/isef-2024-media-kit.
Media ContactsJoseph Brown, [email protected]
Gayle Kansagor, Society for [email protected]
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Artificial Intelligence
J.P. Morgan Life Sciences Private Capital, Blue Horizon Advisors and United Al Saqer Announce Winner of Inaugural 2024 Life Sciences Innovation Summit
In conjunction with Abu Dhabi Global Healthcare Week 2024
ABU DHABI, UAE, May 17, 2024 /PRNewswire/ — J.P. Morgan Life Sciences Private Capital, Blue Horizon Advisors and United Al Saqer Group announced today Rayees Rahman of Harmonic Discovery as the winner of the inaugural J.P. Morgan Asset Management: Life Sciences Innovation Summit. Harmonic Discovery is a precision pharmacology company applying its generative chemistry platform to advance next-generation kinase inhibitors.
In partnership with the Department of Health – Abu Dhabi (DoH), the Summit took place on May 14-15, 2024 at Cleveland Clinic Abu Dhabi and showcased the 11 innovative finalists, as well as highlighted existing innovators and opportunities in the Emirate of Abu Dhabi. The event also featured keynote speeches from Dr. Laurie Glimcher of Dana-Farber Cancer Institute, Dr. Shahrukh Hashmi of the Department of Health – Abu Dhabi, and Dr. David Ho of Columbia University Medical Center and provided attendees networking opportunities to gain valuable insights into the future of life sciences innovation.
In addition, the jury designated Chun-Hao Huang of Algen Biotechnologies as honourable mention. Algen Biotechnologies is a platform therapeutics and drug discovery company using world-leading CRISPR and AI to find treatments for cancer, inflammation and metabolic diseases.
The winners were selected by an esteemed, international panel of judges, which included:Laurie Glimcher, MD, President and CEO at Dana-Farber Cancer InstituteJorge Guzman, MD, CEO at Cleveland Clinic Abu DhabiProf. Shahrukh Khurshid Hashmi, MD, Director of Research, Department of Health, Abu DhabiYasmine Hayek Kobeissi, PhD, CQF, BSc., Executive Director at Blue Horizon AdvisorsAnya Schiess, Managing Partner at J.P. Morgan Life Sciences Private CapitalWalid Zaher, PhD, Co-Founder and CEO, Carexso
Dr. Asma Al Mannaei, Executive Director of the Research and Innovation Centre at the Department of Health – Abu Dhabi said: “Under the directives of the UAE’s wise leadership, and renowned for its world-leading medical infrastructure, Abu Dhabi stands at the forefront of healthcare excellence, offering an unparalleled opportunity for advancement in healthcare for global partners. It was our utmost pleasure hosting the J.P. Morgan Asset Management Life Sciences Innovation Summit 2024 on the sidelines of Abu Dhabi Global Healthcare Week and we commend the winners for their pioneering efforts in driving impactful advancements in healthcare; their dedication to innovation not only transforms the landscape of medicine, but also holds the promise of improving lives worldwide.”
Stephen Squinto, PhD, Chief Investment Officer, J.P. Morgan Life Sciences Private Capital said: “We are thrilled with the level of biotech passion and innovation that we observed at this year’s Summit in Abu Dhabi. The energy was truly palpable we are thrilled to announce Rayees Rahman as the winner of our first Life Sciences Innovation Summit. Harmonic Discovery’s approach embodies the next generation of drug discovery and development. We appreciate the time and effort of all participants and cannot wait for our next event in the region.”
Nabil Kobeissi, Chief Executive Officer of Blue Horizon Advisors, said: “As the main sponsor, we are committed to nurturing and fostering the growth of all 11 finalists in this vibrant biotech ecosystem. This Summit marks the beginning of a transformative journey, and we are confident that it will pave the way for a flourishing hub in the region. We are also pleased to announce that we will commit to invest in and partner with the winner, Harmonic Discovery, to support its future growth in the region.”
Sponsors for the event included J.P. Morgan Life Sciences Private Capital, J.P. Morgan Commercial Bank, Blue Horizon Advisors, United Al Saqer Group, Thermo Fisher Scientific, and Salam Capital. The Summit organisation, logistics and finalist recruitment were facilitated by Lyfebulb.
Of importance, at the Summit, Mr. Mohamed Al Breiki, Executive Director of Sustainable Development at Masdar City, announced that Masdar City Free Zone would award all 11 Finalists complimentary business licenses to further support their establishment in the region. Masdar City is one of the world’s most sustainable urban developments and innovation hubs with a growing focus on life science entrepreneurship in Abu Dhabi.
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Artificial Intelligence
Congregating in the Lion City for a Win-Win Future of Intelligent Computing at the Global Data Center Facility Summit 2024
SINGAPORE, May 17, 2024 /PRNewswire/ — On May 17, 2024, the Global Data Center Facility Summit 2024 was held in Singapore with the theme of “Power the Digital Era Forward.” At the summit, over 600 data center industry leaders, technical experts, and ecosystem partners gathered to discuss new trends and opportunities of the global data center industry in the intelligent computing era. The attendees also got to experience all-scenario, all-ecosystem, and all-service end-to-end (E2E) solutions, share innovative practices of green data centers in the Asia Pacific and Europe, and experience the exhibition vehicle to unveil the mystery of Outdoor PowerPOD that features one power system per container. By fully embracing the intelligent computing era, Huawei strives to power the digital era forward.
Seizing Opportunities Brought by AI and Jointly Building Green & Reliable Computing Infrastructure
At the opening speech, Charles Yang, Senior Vice President of Huawei and President of Marketing, Sales and Services, Huawei Digital Power, noted that since ChatGPT ushered in the AI era, large models keep pushing the limits of computing power and the intelligent computing industry is witnessing an unprecedented construction boom. As predicted, 100 GW will be added to the global data center installed capacity and the market value will exceed US$600 billion in the next five years.
According to Charles, with opportunities come challenges. The primary challenge concerning the data center industry is reliability and electricity. Data centers are scaling up from the MW-level to the GW-level. E2E reliability of data centers is becoming even more important than ever. In response to the opportunities, Huawei will work with customers and partners to expand the industry space.
Steering Data Centers to the AI Era with Product + Service + Ecosystem
During the summit, Sun Xiaofeng, President of Huawei Data Center Facility & Critical Power Business, delivered a speech titled “Power the Digital Era Forward. ” He stated that as AI large models are penetrating, the surging compute demands drive the expansive growth in data center.
To address the challenges, Huawei strives to build product + service + ecosystem E2E data center solutions that feature fast deployment, flexible cooling, green energy, and ultimate reliability.
Fast deployment: Data centers are fully modularized and prefabricated to ensure high quality and efficient construction.Flexible cooling: Air-liquid fusion and integrated cooling source emerges as the optimal cooling architecture for intelligent computing.Green energy: New generation-grid-load-storage integrated solution is built to ensure the sound operations of intelligent computing centers.Ultimate reliability: Data centers are safeguarded through reliable products and preventive protection.Currently, Huawei’s global service network covers more than 170 countries with over 1800 professional engineers, providing 24/7 technical support. With N+ flagship service centers, Huawei has built a one-hour service radius for its customers.
The ecosystem is a key part for a win-win future of intelligent computing. Huawei works with partners to develop comprehensive E2E solutions and provide customers with one-stop data center services.
During the summit, Huawei and the ASEAN Centre for Energy released a white paper on “Building Next Generation Data Center Facility in ASEAN.” The document provides insights into the status quo, challenges, and trends of data centers in the ASEAN region, and emphasizes that efficient and energy-saving products and solutions should be applied. It also proposes future-oriented policy recommendations for data center markets.
In the ecosystem exhibition area, Huawei showcased scenario-based solutions for large-, medium-, and small-sized data centers, and demonstrated data center consulting, design, integrated development, and delivery capabilities with dozens of ecosystem partners including CIMC, Weichai, CSCEC, and Huashi.
On a special note, the Huawei Outdoor PowerPOD exhibition vehicle made its global debut. The Huawei Outdoor PowerPOD features one power system per container, outdoor deployment, plug-and-play, and high protection rating and reliability. It has become the preferred choice for decoupling the power supply architecture.
A single tree cannot make a forest.
AI is presenting great opportunities. By delving into the industry, aggregating partner ecosystems, and making innovations applicable to transformations, Huawei will continue to help customers build reliable computing infrastructure, accelerating the industry to embrace AI and powering the digital era forward.
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