Artificial Intelligence
Global Dicing Equipment Market (2021 to 2026) – Growth, Trends, COVID-19 Impact, and Forecasts
Dublin, April 21, 2021 (GLOBE NEWSWIRE) — The “Dicing Equipment Market – Growth, Trends, COVID-19 Impact, and Forecasts (2021 – 2026)” report has been added to ResearchAndMarkets.com’s offering.
The Dicing Equipment Market is expected to grow at a CAGR of 10.43% over the forecast period 2021 to 2026. Principal factors encouraging the growth of this market include the growing demand for smart cards, RFID technology, and automotive power ICs, increasing consumer electronics market, an increase in the number of factories, and the inclination of miniaturization and technology migration.
The dicing equipment market is getting traction due to the inclusion of microelectronics across consumer electronics. The need for technologies such as MEMS devices and power devices are encouraging demand for thin wafers. Additionally, this demand supports the demand for better manufacturing processes, which is a critical phase in the ultra-thin wafer manufacturing processes.
Driven by the rising demand for secure access and identification solutions in the telecommunication, payment, government, and transportation sectors, smart cards have experienced a significant increase in their usage, therefore boosting the dicing equipment market’s growth. For example, according to the Office of National Statistics (UK), the country’s manufacturers of smart cards witnessed sales of GBP 2.2 million in 2018.
India is making accelerated strides in bridging the digital payments divide. The new directive from the Finance Ministry advising banks to issue Near-Field Communication (NFC)-enabled contactless credit and debit cards could be an impetus in the correct direction. These factors drive the use of wireless technology, such as RFID, in smart cards, thereby creating a need for thin wafers, thus fueling market growth.
Furthermore, the increasing electronic components in a vehicle or an automobile is a key driver, particularly in hybrid and electric cars, due to the consumer demand for constant connectivity. According to estimates from Wedbush Securities, Tesla already received 650,000 pre-orders for the Cybertruck in 2020, which is scheduled to hit the roads in late 2021.
The automotive industry’s push to deliver autonomous and electric vehicles in the next decade is also driving the growth for the market studied. For instance, according to the International Energy Agency’s Global EV Outlook, electric passenger car sales rose to 2.1 million in 2019, making the global stock to 7.2 million electric and plug-in hybrid passenger cars.
Blade dicing has been the most widely used process in the separation of silicon wafers into individual chips/devices, both in MEMS and semiconductor technologies. It is also the low-cost dicing technology in many applications.
The demand for minimum power consumption, decreasing heat, and increasing smartphone usage in the emerging countries is expected to drive the utilization of DRAM (dynamic RAM) in mobile devices.
Furthermore, the evolution of 5G technology, coupled with artificial intelligence (AI) powered mobile applications, demands low-power cellular memory solutions. Networking devices, like servers, CPUs, GPUS by enterprises and cloud service providers, also provide memory manufacturers with opportunities, hence boosting the market growth.
Key Market Trends
Memory and Logic (TSV) Application to Dominate the Market
- Companies have been seeking to find a single universal memory that combines the benefits of SRAM, Flash memory, and DRAM. New technologies in memory devices, such as Magnetoresistive random-access memory (MRAM), Phase-change random access memory (PCRAM), and Resistive random-access memory (RRAM), are expected to substitute most of the traditional technologies. This shift in the market has necessitated the change in manufacturing equipment dynamics, forcing equipment providers to develop effective designs for the device manufacturers.
- As data generation grows significantly, cloud data centers need order-of-magnitude enhancements in the speed and power consumption of the data pathways linking servers and storage systems. PCRAM and ReRAM are fast, low-power, and high-density memories, which can be used as “storage-class memory” to fill the widening price-performance gap between server DRAM and storage.
- The demand for minimum power consumption, decreasing heat, and increasing smartphone usage in the emerging countries is expected to drive the utilization of DRAM (dynamic RAM) in mobile devices. Furthermore, the evolution of 5G technology, coupled with artificial intelligence (AI) powered mobile applications, demands low-power cellular memory solutions. Networking devices, like servers, CPUs, GPUS by enterprises, and cloud service providers, also provide memory manufacturers opportunities.
- At the Data Center Investment Conference & Expo South, it was discussed that 4,000 new data centers might be needed to accommodate the data growth and the need for edge computing across the United States, by 2020. With the volume of digital traffic expected to triple over the next five years, the dependency on the data centers is expected to increase significantly, and thus, providing scope for memory ICs for networking devices, like servers.
- With TSV (Through Silicon Via) technology gaining popularity for low power and high-performance devices, like mobile, and other wireless and networking devices, the scope for stealth dicing equipment increases. As TSV enables 2.5/3D package for the applications mentioned above, the equipment becomes handy for TSV Assembly/Packaging (chip-to-chip and chip-to-wafer assembly with stealth dicing and other processes). A combination of laser dicing and blade dicing is used in Memory and Logic.
- Buyers of the thinning and dicing equipment, like Samsung, GigaDevice Semiconductor, SK Hynix, and Micron, have invested in new fabs and fab equipment between 2017-2018, which the DRAM industry was projected to experience significant two-year growth. However, with the market entering a phase of oversupply earlier than predicted, the price declines occurred starting in the third quarter of 2018.
- With relatively less spending by memory manufacturers, the device manufacturers would only need a certain amount of DRAMs to meet the performance requirements for electronic devices. The companies’ capital expenditure trend is expected to remain slow over the forecast period, thus impacting the revenues of the thinning and dicing equipment.
China to Hold a Major Market Share of the Market
- The growing adoption of smart electronic devices is encouraging manufacturing prospects. Necessary incorporation of electronics in automotive applications is one of the principal drivers driving the growth of the China Dicing Equipment Market.
- The integration of artificial intelligence, IoT, and connected devices across multiple end-use verticals is anticipated to encourage the semiconductor manufacturing equipment market growth in the projection period. China has grown a global manufacturing center with the presence of various manufacturing industries.
- As semiconductor supply chains begin changing due to the US-China trade conflict, India is leveraging the benefit. According to stats from the United Nations Comtrade database, annual IC imports into India in 2018 jumped by 281% to USD 8 billion.
- According to World Semiconductor Trade Statistics (WSTS) and SIA Estimates, the Asia Pacific region, which includes markets like China, has surpassed all other regional markets in sales, as electronic equipment production shifted to the area. It has multiplied in size since then – from USD 39.8 billion in 2001 to over USD 282 billion in 2018.
- With the growth in electronic equipment production across the region, the biggest country market across the Asia Pacific region is China. According to the WSTS and SIA Estimates, China is the sole largest country of APAC region, whereby accounting for 56% of the Asia Pacific market and is capturing 34% of the total global market in 2018.
- According to the SEMI, a notable global association helping the electronics industry’s manufacturing supply chain, more than 90% of the factories constructed in the world were located in the Asia Pacific. It is estimated that most of these factories are concentrated in China. With initiatives for Tokyo Olympics 2020 already in motion, the semiconductor manufacturing region is anticipated to open up better possibilities for the dicing equipment shortly.
Competitive Landscape
The Dicing Equipment Market is highly competitive and consists of several major players. In terms of market share, few of the major players currently dominate the market. These major players with a prominent share in the market are focusing on expanding their customer base across foreign countries. These companies are leveraging on developing new innovations to increase their recognition and market share and increase their profitability.
- Oct 2019 – Panasonic is teaming up with IBM Japan to improve the semiconductor manufacturing process. The companies collaboratively develop and markets a new high-value-added system to optimize the overall equipment effectiveness (OEE) of customers’ semiconductor manufacturing processes and to realize high-quality manufacturing.
Reasons to Purchase this report:
- The market estimate (ME) sheet in Excel format
- 3 months of analyst support
Key Topics Covered:
1 INTRODUCTION
1.1 Study Assumptions and Market Definition
1.2 Scope of the Study
2 RESEARCH METHODOLOGY
3 EXECUTIVE SUMMARY
4 MARKET DYNAMICS
4.1 Market Overview
4.2 Industry Attractiveness – Porter’s Five Forces Analysis
4.2.1 Threat of New Entrants
4.2.2 Bargaining Power of Buyers
4.2.3 Bargaining Power of Suppliers
4.2.4 Threat of Substitutes
4.2.5 Intensity of Competitive Rivalry
4.3 Market Drivers
4.3.1 Technological Advancements, and Evolution of Next Generation Devices
4.4 Market Challenges
4.4.1 Mass Manufacturing Challenges
4.4.2 Recent outbreak of COVID-19
4.5 Industry Value Chain Analysis
4.6 Assessment of Impact of Covid-19 on the Industry
5 MARKET SEGMENTATION
5.1 By Dicing Technology
5.1.1 Blade Dicing
5.1.2 Laser Ablation
5.1.3 Stealth Dicing
5.1.4 Plasma Dicing
5.2 By Application
5.2.1 Logic & Memory
5.2.2 MEMS
5.2.3 Power
5.2.4 CMOS Image Sensor
5.2.5 RFID
5.3 Geography
5.3.1 China
5.3.2 Taiwan
5.3.3 South Korea
5.3.4 North America
5.3.5 Europe
5.3.6 Rest of the World
6 POTENTIAL LIST OF KEY CUSTOMERS FOR DICING EQUIPMENT
7 COMPETITIVE LANDSCAPE
7.1 Company Profiles*
7.1.1 Suzhou Delphi Laser Co. Ltd
7.1.2 SPTS Technologies Limited (KLA Tencor Corporation)
7.1.3 ASM Laser Separation International (ALSI) BV
7.1.4 Tokyo Seimitsu Co. Ltd.
7.1.5 Neon Tech Co. Ltd
7.1.6 Nippon Pulse Motor Taiwan (NPM) Group
7.1.7 Panasonic Corporation
7.1.8 Plasma-Therm
8 INVESTMENT ANALYSIS
9 MARKET OPPORTUNITIES AND FUTURE TRENDS
For more information about this report visit https://www.researchandmarkets.com/r/e4xlsa
Artificial Intelligence
Relu Secures FDA 510(k) and CE Marking for Revolutionary Dental Software Relu® Creator
LEUVEN, Belgium, Oct. 1, 2024 /PRNewswire/ — Relu, a pioneer in artificial intelligence (AI) assisted segmentation for dental labs and software companies, proudly announces the dual achievement of 510(k) clearance by the U.S. Food and Drug Administration (FDA) and CE Mark approval by an EU Notified Body. These regulatory milestones authorize the commercial distribution of the Relu® Creator, the cutting-edge dental tool that enables users to create 3D anatomical models from patients in just minutes.
FDA clearance signifies compliance with U.S. medical device standards, while the CE Mark confirms adherence to EU regulations for product safety and consumer protection. This dual recognition underscores Relu’s commitment to excellence in the oral health sector.
“We are thrilled to have attained both FDA and CE approval for the Relu® Creator,” stated Adriaan Van Gerven, CTO and Co-founder, of Relu. “These significant achievements are a testament to Relu’s dedication to creating superior technology that meets the highest international safety and quality standards. We’re poised to revolutionize patient and dentist experiences across both continents.”
“This approval paves the way for our advanced technology to enter US and EU dental markets with the highest potential for growth. Having led strategy in Dental, AI and Orthodontic sectors, I consider this achievement a key differentiator that sets Relu® Creator apart. This is a major step forward in Relu’s mission to modernize dental care,” said Bindu Saran, former Global Head of Orthodontic Technology at Straumann, former Sr. Manager of R&D at Ormco, and Board Member at Relu.
The Relu® Creator integrates cutting-edge AI to deliver features such as automated anatomical identification, and enhanced 3D imaging for dental diagnostics and treatment planning. By improving precision and increasing overall efficiency in dental procedures, Relu® Creator is set to be an essential tool for modern dental clinics.
About Relu
Relu is founded in 2019 with the dream of making dental treatments safer and faster. They plug in advanced computer vision and artificial intelligence to automate manual workflows. Their Relu® Engine and Relu® Creator are used by dental lab and software partners for more than thousands of orthodontic and implant treatments every day. Relu is headquartered in Leuven, BE with an office in Boston, MA, USA. Learn more at relu.eu.
© 2024 Relu
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Artificial Intelligence
Danish telecoms giant TDC NET chooses IFS Cloud to boost workforce efficiency and modernize infrastructure
LONDON, Oct. 1, 2024 /PRNewswire/ — IFS, the leading provider of enterprise cloud and Industrial AI software, today announced that TDC NET, Denmark’s largest provider of telecommunications infrastructure, has chosen to implement IFS Cloud to supercharge operational efficiencies across its business.
A longstanding IFS customer, TDC Net will use the IFS Cloud for Field Service Management to streamline its workforce management (WFM) processes, including field service operations. Implementing IFS Cloud will also allow the Danish telco company to consolidate its WFM systems into a single platform, eliminating process duplication and controlling costs.
IFS Cloud for Field Service Management including IFS Planning and Scheduling Optimization (IFS PSO) will allow TDC NET to assign the right technicians with the appropriate skills to the right jobs and dynamically schedule tasks based on real-time data such as technician availability, location, and traffic conditions. This enhanced efficiency is critical as TDC NET continues its mission to transition its nationwide network infrastructure from copper to fiber, implement IoT solutions, and adopt AI technologies – all in a sustainable way to reach the company’s net zero target in 2030.
Beyond workforce management IFS Cloud will enable TDC NET to consolidate its wider IT operations, removing legacy infrastructure and reducing the number of current systems across the business.
Carsten Rasmussen, Head of IT enablement in TDC Net, said: “As we work towards phasing out copper infrastructure and becoming a modern digital infrastructure provider, consolidating our IT systems is critical. Partnering with IFS and accessing IFS Cloud will give us the field service and resource management capabilities we need to simplify, automate, and build a sustainable architecture that meets the demands of the new digital age.”
Jesper Illum, Country Manager, Denmark, IFS, said: “TDC Net is not only Denmark’s largest provider of telecommunications infrastructure but also a forward-thinking company committed to transforming its operations with fiber and 5G technologies. IFS Cloud will help it scale its systems, increase automation, and improve customer deliveries.”
IFS partner, Infosys, will implement and roll out IFS Cloud and the associated services.
About TDC NET
TDC NET is a Danish telecommunications company focused on building, operating and maintaining telecommunications infrastructure in Denmark. It provides a wide range of services, including fiber broadband and the best 5G mobile network in Denmark. TDC NET plays a key role in digitalising Denmark by investing in and upgrading network infrastucture to ensure high-quality connectivity and access for both individuals and businesses. For more information, please visit tdcnet.com
About IFS
IFS is the world’s leading provider of Industrial AI and enterprise software for hardcore businesses that make, service, and power our planet. Our technology enables businesses which manufacture goods, maintain complex assets, and manage service-focused operations to unlock the transformative power of Industrial AI™ to enhance productivity, efficiency, and sustainability.IFS Cloud is a fully composable AI-powered platform, designed for ultimate flexibility and adaptability to our customers’ specific requirements and business evolution. It spans the needs of Enterprise Resource Planning (ERP), Enterprise Asset Management (EAM), Supply Chain Management (SCM), Information Technology Service Management (ITSM), and Field Service Management (FSM). IFS technology leverages AI, machine learning, real-time data and analytics to empower our customers to make informed strategic decisions and excel at their Moment of Service™.IFS was founded in 1983 by five university friends who pitched a tent outside our first customer’s site to ensure they would be available 24/7 and the needs of the customer would come first. Since then, IFS has grown into a global leader with over 6,500 employees in 80 countries. Driven by those foundational values of agility, customer-centricity, and trust, IFS is recognized worldwide for delivering value and supporting strategic transformations. We are the most recommended supplier in our sector. Visit ifs.com to learn why.
IFS Press Contacts:
Europe / MEA / APJ: Adam GillbeIFS, Director of Corporate & Executive CommunicationsEmail: [email protected] Phone: +44 7775 114 856
North America / LATAM: Mairi MorganIFS, Director of Corporate & Executive CommunicationsEmail: [email protected] Phone: +44 7918 607 299
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Artificial Intelligence
TraceLink Releases Amadeus, the First Generative AI Assistant for Accelerating the Digitalization of Supply Networks on the Opus Platform
Trained on a rich set of information from a unified content repository, Opus Orchestration Architects, Solution Designers, Network Administrators, and those simply interested in learning more about TraceLink’s solutions are empowered with information in seconds
BOSTON, Oct. 1, 2024 /PRNewswire/ — TraceLink, the largest end-to-end digital network platform for intelligent orchestration of the supply chain, today announced the launch of Amadeus, an AI Assistant to help users across the supply chain configure and optimize supply networks. Powered by advanced Large Language Model (LLM) algorithms, Amadeus allows users to find answers across a large volume of the TraceLink University educational content ecosystem, including developer resources, educational “how-to” materials, and technical documentation, delivering detailed, accurate responses tailored to their needs.
Whether navigating through extensive resources, searching for specific content, or exploring related topics, Amadeus provides intelligent answers drawn from a knowledge base refreshed on a daily basis. Its advanced search capabilities and context-aware assistance with source URL and citations ensure a smooth, reliable, current, and efficient content discovery process. With instant access to TraceLink University documents, educational whitepapers, case studies, and more, Amadeus delivers quick, within-seconds responses tailored to specific customer use cases, helping users solve complex business problems with confidence.
“With Amadeus, we are offering a powerful way for customers to engage with the wealth of knowledge within TraceLink University,” said Shabbir Dahod, President and CEO at TraceLink. “By integrating generative AI and LLMs with our extensive content library, Amadeus helps users to quickly find the information they need to optimize their supply chain operations. This is just the beginning of how TraceLink aims to harness AI to further transform supply chain management in the future.”
Amadeus’ AI functionality is further enriched by its robust safeguards. Built-in guardrails and alignment with OpenAI’s safety protocols verify that responses are relevant and accurate, eliminating AI hallucinations and keeping users on track. With these AI safety features built into Amadeus, users receive the most applicable and trusted answers, helping them make informed decisions in real-time. Looking forward, Amadeus will securely integrate content from customers’ own orchestration networks, thereby enabling a powerful AI-driven experience on top of end-to-end supply chain network intelligence to leverage predictions to drive business results.
Learn more about TraceLink’s Opus Magnum release, the only no-code network digitalization platform designed to democratize access to end-to-end supply chain integration and orchestration.
See Opus Magnum live at FutureLink Barcelona 2024, the only thought-leadership, education, and networking event for life sciences and healthcare leaders needing critical intelligence and better collaboration across supply chain relationships, from October 2-4, 2024. With keynotes headlined by the industry’s top thought leaders, a full day of TraceLink University educational sessions, three orchestration tracks led by customers and solution partners, and an immersive product and solution exhibition, this year’s FutureLink will focus on the end-to-end digitalization of your supply chain to link your enterprise systems and processes to the network. Register now.
About TraceLink:
TraceLink Inc. is the largest end-to-end intelligent supply chain platform for life sciences and healthcare, enabling end-to-end orchestration by connecting more than 291,000 healthcare and life sciences entities through its B2N Integrate-Once™ network. Leading businesses trust TraceLink to deliver complete global connectivity, visibility, and traceability of healthcare products, ensuring that every patient gets the medicines they need when needed, safely and securely.
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