Wafer Processing Equipment Market Worth USD 13.35 Bn. by 2029 Technological advancement, and key benchmarking of market players

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Pune, Jan. 24, 2023 (GLOBE NEWSWIRE) — According to the “Wafer Processing Equipment Market” research published by Maximize Market Research, the market is expected to grow from USD 8.7 billion in 2021 to USD 13.35 billion in 2029, at a CAGR of 5.5 percent during the forecast period from 2022 to 2029.  The top five value-creation companies create economic profit in each wafer processing equipment to drive the market.

Wafer Processing Equipment Market Scope and Research Methodology

The methods used for collecting information for the report involve 4 main activities. These activities help in estimating the current size of the wafer processing equipment market. Thorough secondary research was conducted to collect information on the Wafer Processing Equipment market, such as new technologies coming into the market, and components connected with the market. The collected information was validated by experts from the Manufacturing and Construction industry across all the value chains through primary research. and bottom-up approaches were used for estimating the market size. The secondary research includes collecting data from sources such as government publications such as country-level Manufacturing and Construction associations and organizations, World Bank, Eurostat, Organization for Economic Co-operation and Development (OECD), and CDC; regulatory and corporate filings such as SEC filings, annual reports, investor presentations, and business magazines, financial statements, press releases, and research journals, free and paid manufacturing and construction databases and trade, business, and professional associations. The secondary data collected was then analyzed to predict the overall size of the market which was later validated with primary research.

Thorough primary research was consucted to provide a clear picture of the wafer processing equipment market through secondary research. Many market experts were interviewed for the primary research from both the supply-side players and demand-side players across five major regions, namely, Europe, North America, Asia Pacific, South America, and Middle East and Africa. Apart from the interviews, primary data was collected through mails, questionnaires, and telephonic interviews.

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Wafer Processing Equipment Market Overview

With the growing demand for consumer electronics, the wafer-processing equipment market is expected to grow. As the market for electronic products has grown, so have consumer expectations for new devices’ better features. RFIDs and wafers are combined in a number of consumer electronics and identity solutions, including smart cards, identification tags, and others, to create integrated circuits. Customers are requesting thinner wafers and ultra-smooth surfaces for seamless electrical product integration. The increased need for smaller wafers with better device performance is a significant development in the wafer processing equipment market. The final thickness of wafers, for instance, is flattened down to tens of micrometers. The majority of semiconductor wafers used in power, CIS, and memory applications are thinned down to 100-200 m more details are covered in report.

Wafer Processing Equipment Market Dynamics

An important development in the wafer processing equipment market is the growing demand for smaller wafers due to better device performance. Wafers and other semiconductor substrates are thinned to final thicknesses of tens of m. The majority of semiconductor wafers, including those for power, CIS, and memory applications, are flattened down to 100-200 nm. Further thickness reduction is needed for memory devices due to the need to optimize the memory capacity of single packages, improved data transmission rates, and power consumption mostly driven by mobile applications. Silicon wafers with a thickness of more than 200 m are used in common memory products like 2D NAND/DRAM. From 50 m to 30 m thick silicon substrates, 3D stacked DRAM thickness is expected to continue decreasing by 2025. The thinnest wafers available today for all purposes with a thickness under 10 m are BSI CIS wafers. In recent years, ultra-smooth surfaces and thinner wafers for inclusion into electronics have steadily increased and helped to drive the wafer processing equipment market growth.

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Wafer Processing Equipment Market Regional Insights

Asia Pacific Wafer Processing Equipment Market is expected to dominate the market during the forecast period. Growing technological development like artificial intelligence and the Internet of things influences the market. Growing research and development activities and high investment by key players and new product launches highly impact market growth. Also, the growing adoption of wafer processing equipment and government initiative drive the market growth.

The increasing population and per capita income and innovative technology accelerate the growth of the wafer processing equipment market. Government agencies, companies, and third-party agencies are highly focused on quality manufacturing and construction product, which also helps to drive the market.

Market Size in 2021 USD 8.7 Bn.
Market Size in 2029 USD 13.29 Bn.
CAGR 5.5 % (2022-2029)
Forecast Period 2022-2029
Base Year 2021
Number of Pages 213
No. of Tables 110
No. of Charts and Figures 112
Segement Covered Process, Application, End-User
Regional Scope North America, Europe, Asia Pacific, Middle East and Africa, South America
Report Coverage Market Share, Size & Forecast by Revenue | 2022−2029, Market Dynamics, Growth Drivers, Restraints, Investment Opportunities, and Key Trends, Competitive Landscape, Key Players Benchmarking, Competitive Analysis, MMR Competition Matrix, Competitive Leadership Mapping, Global Key Players’ Market Ranking Analysis.

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Wafer Processing Equipment MarketKey Competitors are:

  • Applied Materials Inc
  • ASML Holding Semiconductor Company
  • Tokyo Electron Limited
  • Lam Research Corporation
  • KLA Corporation
  • DISCO
  • Hitachi Kokusai Linear
  • KLA Corporation
  • Lam Research Corporation
  • Motorola Solutions, Inc.
  • Nikon Corporation,
  • Plasma-Therm
  • Spts Technologies Ltd.

Key questions answered in the Wafer Processing Equipment Market are:

  • What are the technological innovations in Wafer Processing Equipment Market?
  • What are the factors driving the growth of the Wafer Processing Equipment Market?
  • Which technology insight dominated the Wafer Processing Equipment Market in 2021?
  • How has COVID-19 affected the growth of the Wafer Processing Equipment Market?
  • What is the growth rate of the Wafer Processing Equipment Market during the forecast period?
  • What are the trends of the Asia-Pacific region in the Wafer Processing Equipment Market?
  • Who are the market top 3 leaders in Wafer Processing Equipment Market in the North America region?
  • Which deployment mode led the Wafer Processing Equipment Market in 2021?
  • Who are the key players in the Wafer Processing Equipment Market?
  • What are the key factors restraining the growth of the Wafer Processing Equipment Market?
  • Which region held the largest market share in Wafer Processing Equipment Market?
  • What is the growth rate of the North America Wafer Processing Equipment Market
  • What is key feature of Wafer Processing Equipment?

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Key Offerings:

  • Market Share, Size & Forecast by Revenue | 2022−2029
  • Market Dynamics –Drivers, Restraints, Investment Opportunities, and Key Trends, challenges, market strategy, competitive landscape
  • Market Segmentation – Process, Application, End-User, and Region
  • Competitive Landscape – Top Key market players and Other Prominent players

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