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Global Semiconductor Bonding Market Size to Surpass USD 3.9 Billion Growth by 2030, Exhibiting a CAGR of 3.12%: Zion Market Research Study Report

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Houston, TX, March 27, 2023 (GLOBE NEWSWIRE) — Zion Market Research has published a new research report titled “Semiconductor Bonding Market – By Type (Die Bonder, Wafer Bonder, And Flip Chip Bonder), By Application (RF Devices, 3D NAND, CMOS Image Sensors, LED, And MEMS & Sensors), By Process Type (Die-To-Die Bonding, Wafer-To-Wafer Bonding, And Die-To-Wafer Bonding), By Bonding Technology (Die Bonding Technology And Wafer Bonding Technology), And By Region – Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2023 – 2030” in its research database.

“According to the latest research study, the demand of global Semiconductor Bonding Market size & share in terms of revenue was valued at USD 1.8 billion in 2022 and it is expected to surpass around USD 3.9 billion mark by 2030, growing at a compound annual growth rate (CAGR) of approximately 3.12% during the forecast period 2023 to 2030.”

What is Semiconductor Bonding? How big is the Semiconductor Bonding Industry?

Semiconductor Bonding Market Coverage & Overview:

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The global semiconductor bonding market size was nearly $1.8 Billion in 2022 and is predicted to surge to approximately $3.9 Billion by 2030 apart from recording a CAGR of nearly 3.12% in 2023 – 2030.

Semiconductor is a substance with key electric features enabling it to serve computers and electronic equipment production. Moreover, it is a solid chemical product conducting electricity under specific conditions. Semiconductors find lucrative applications in defense tools, communication systems, transport, computing, healthcare, and renewable energy. The arrangement of semiconductors includes the bonding of atoms in the making of a large number of integrated circuits as well as fabrication equipment. The structure of semiconductor material is homogeneous and is the same throughout the semiconductor bonding model.

Get a Free Sample PDF of this Research Report for more Insights with a Table of Content, Research Methodology, and Graphs – https://www.zionmarketresearch.com/sample/semiconductor-bonding-market

(A free sample of this report is available upon request; please contact us for more information.)

Our Free Sample Report Consists of the Following:

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  • Introduction, Overview, and in-depth industry analysis are all included in the 2023 updated report.
  • The COVID-19 Pandemic Outbreak Impact Analysis is included in the package
  • About 202+ Pages Research Report (Including Recent Research)
  • Provide detailed chapter-by-chapter guidance on Request
  • Updated Regional Analysis with Graphical Representation of Size, Share, and Trends for the Year 2023
  • Includes Tables and figures have been updated
  • The most recent version of the report includes the Top Market Players, their Business Strategies, Sales Volume, and Revenue Analysis
  • Zion Market Research research methodology

(Please note that the sample of this report has been modified to include the COVID-19 impact study prior to delivery.)

Global Semiconductor Bonding Market: Growth Factors

Escalating demand for micro-electromechanical systems and growing preference for electric vehicles will expedite the expansion of the semiconductor bonding market globally. Increasing acceptance of stacked die systems in connected things will proliferate the size of the global semiconductor bonding market. Onset of the 5G network along with a rise in the research on developing the 6G network will help the semiconductor bonding market expand leaps & bounds across the globe. Increase in the use of smartphones and wearable devices will boost global market trends. Apart from this, with semiconductors finding a slew of applications in connected logistics, building & home automation, smart mobility, and smart transport, the market for semiconductor bonding is predicted to gain traction in the years ahead.

Nevertheless, high ownership costs can impede the global semiconductor bonding industry surge. However, the massive preference for semiconductors in packaging and 3D semiconductor assembly along with demand for the product in AI & IoT will open new horizons of growth for the global industry. This, in turn, will offset the impact of a hindrance on the expansion of the global semiconductor bonding business.

Directly Purchase a copy of the report with TOC @ https://www.zionmarketresearch.com/buynow/su/semiconductor-bonding-market

Report Scope

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Report Attribute Details
Market Size in 2022 USD 1.8 billion
Projected Market Size in 2030 USD 3.9 billion
CAGR Growth Rate 3.12% CAGR
Base Year 2022
Forecast Years 2023-2030
Key Market Players Kulicke & Soffa, Moschip Technologies Ltd, Tata Elxsi Ltd, Shinkawa Ltd, Shibaura Mechatronics, Yamaha Motor Robotics Corporation Co., Fuji Corporation, SPEL Semiconductor Ltd, Panasonic Corporation, SUSS MicroTech SE, ASM Pacific Technology Ltd., Fasford Technology, EV Group, Ruttonsha International Rectifier Ltd, Dixon Technologies (India) Ltd, and BE Semiconductor Industries N.V.
Key Segment By Type, By Application, By Process Type, By Bonding Technology, And By Region
Major Regions Covered North America, Europe, Asia Pacific, Latin America, and the Middle East &, Africa
Purchase Options Request customized purchase options to meet your research needs. Explore purchase options

Semiconductor Bonding Market: Segmentation Analysis

The global semiconductor bonding market is divided into process type, type, application, bonding technology, and region.

In terms of process type, the market for semiconductor bonding is segmented into die-to-wafer bonding, die-to-die bonding, and wafer-to-wafer bonding segments. Furthermore, the die-to-wafer bonding segment is predicted to account for the major share of the global market over the anticipated period. The segmental growth can be owing to its proven success in CMOS image sensors as well as other memory & logic systems. Moreover, the use of die-to-wafer bonding in the heterogeneous integration phase will further steer the segmental expansion.

In terms of type, the global semiconductor bonding market is sectored into flip chip bonder, die bonder, and wafer bonder segments.

On basis of bonding technology, the semiconductor bonding market across the globe is segmented into wafer bonding technology and die bonding technology segments.

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On basis of application, the semiconductor bonding industry across the globe is bifurcated into 3D NAND, RF Devices, LED, CMOS Image Sensors, and MEMS & Sensors segments. Moreover, the LED segment, which contributed the largest industry share in 2022, will lead the application space in the ensuing period. The segmental expansion can be due to the directional nature & high efficacy of LED. Furthermore, LEDs are utilized in parking garage lighting, outdoor area lighting, street lights, task lighting, modular lighting, and refrigerated case lighting. Moreover, LED is used in households for cove lighting, thereby boosting the demand for LEDs in the residential sector.

The global Semiconductor Bonding market is segmented as follows:

By Type

  • Die Bonder
  • Wafer Bonder
  • Flip Chip Bonder

By Application

  • RF Devices
  • 3D NAND
  • CMOS Image Sensors
  • LED
  • MEMS & Sensors

By Process Type

  • Die-to-Die Bonding
  • Wafer-to-Wafer Bonding
  • Die-to-Wafer Bonding

By Bonding Technology

  • Die Bonding Technology
  • Wafer Bonding Technology

Browse the full “Semiconductor Bonding Market – By Type (Die Bonder, Wafer Bonder, And Flip Chip Bonder), By Application (RF Devices, 3D NAND, CMOS Image Sensors, LED, And MEMS & Sensors), By Process Type (Die-To-Die Bonding, Wafer-To-Wafer Bonding, And Die-To-Wafer Bonding), By Bonding Technology (Die Bonding Technology And Wafer Bonding Technology), And By Region – Global And Regional Industry Overview, Market Intelligence, Comprehensive Analysis, Historical Data, And Forecasts 2023 – 2030”– Report at https://www.zionmarketresearch.com/report/semiconductor-bonding-market

Competitive Landscape

Some of the main competitors dominating the global Semiconductor Bonding market include – 

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  • Kulicke & Soffa
  • Moschip Technologies Ltd
  • Tata Elxsi Ltd
  • Shinkawa Ltd
  • Shibaura Mechatronics
  • Yamaha Motor Robotics Corporation Co.
  • Fuji Corporation
  • SPEL Semiconductor Ltd
  • Panasonic Corporation
  • SUSS MicroTech SE
  • ASM Pacific Technology Ltd.
  • Fasford Technology
  • EV Group
  • Ruttonsha International Rectifier Ltd
  • Dixon Technologies (India) Ltd
  • BE Semiconductor Industries N.V.

 Key Insights from Primary Research:

  • According to the analysis shared by our research forecaster, the Semiconductor Bonding market is likely to expand at a CAGR of around 3.12% during the forecast period (2023-2030).                  
  • In terms of revenue, the Semiconductor Bonding market size was valued at around US$ 1.8 billion in 2022 and is projected to reach US$ 3.9 billion by 2030.
  • The global market is anticipated to record massive growth over the forecast period with the emergence of new technologies such as artificial intelligence, power-efficient sensing devices, brain-inspired computing, robotics, and automated equipment.
  • Based on type, the wafer bonder segment to contribute the highest share of the global market over the forecast period
  • In terms of application, the LED segment is predicted to account for a major share of the global market during the predicted timespan.
  • On basis of technology, the die bonding technology segment is predicted to account for a major share of the global market during the predicted timespan.
  • Region-wise, the Asia-Pacific semiconductor bonding market is projected to record the fastest CAGR over the assessment timespan.

Have Any Query? Ask Our Experts: https://www.zionmarketresearch.com/inquiry/semiconductor-bonding-market

Key questions answered in this report:

  • What is the market size and growth rate forecast for Semiconductor Bonding industry?
  • What are the main driving factors propelling the Semiconductor Bonding Market forward?
  • What are the leading companies in the Semiconductor Bonding Industry?
  • What segments does the Semiconductor Bonding Market cover?
  • How can I receive a free copy of the Semiconductor Bonding Market sample report and company profiles?

Key Offerings:

  • Market Size & Forecast by Revenue | 2023−2030
  • Market Dynamics – Leading Trends, Growth Drivers, Restraints, and Investment Opportunities
  • Market Segmentation – A detailed analysis By Type, By Application, By Process Type, By Bonding Technology, And By Region
  • Competitive Landscape – Top Key Vendors and Other Prominent Vendors

Request for Customization on this Report as per your requirements – https://www.zionmarketresearch.com/custom/6697

(We tailor your report to meet your specific research requirements. Inquire with our sales team about customising your report.)

Regional Analysis:

Furthermore, the semiconductor bonding market in North America is anticipated to lead the global market in the forthcoming years. The expansion of the market in the sub-continent can be due to a rise in the trend of using hybrid and electric vehicles in the counties such as the U.S. and Canada.

The semiconductor bonding market in the Asia-Pacific is slated to register the highest CAGR over the forecast timeframe. The regional market growth in the ensuing years can be due to the thriving capacitive tactile sensor industry in the countries such as China. A large number of firms in the sub-continent are trying to manufacture next-gen semiconductor bonding solutions including wafer bonding and gold wire bonding solutions. In addition to this, the presence of key manufacturers and suppliers of semiconductors in countries such as China, Taiwan, and South Korea will contribute majorly to the revenue of the semiconductor bonding market in the Asia-Pacific zone.

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By Region

  • North America
    • U.S.
    • Canada
    • Rest of North America
  • Europe
    • France
    • UK
    • Spain
    • Germany
    • Italy
    • Rest of Europe
  • Asia Pacific
    • China
    • Japan
    • India
    • South Korea
    • Rest of Asia Pacific
  • The Middle East & Africa
    • Saudi Arabia
    • South Africa
    • Rest of the Middle East & Africa
  • Latin America
    • Brazil
    • Argentina
    • Rest of Latin America

Recent Developments

  • In the second quarter of 2021, ASM Pacific Technology, a key semiconductor chip assembly manufacturing firm based in Singapore,  introduced three new manufacturing tools with high precision die bonding techniques and micro-transfer printing technologies for enabling heterogeneous amalgamation of ultra-thin die ranging up to 300mm wafer base. The initiative will boost the scope of semiconductor bonding demand in Asia in the forthcoming years.
  • In the second half of 2020, Palomar® Technologies, a key U.S.-based supplier of automated microelectronic assembly equipment and contract assembly solutions, introduced thermosonic, fully automated, and high-speed wire bonder The move will expedite the semiconductor bonding industry in North America

To know an additional revised 2023 list of market players, request a brochure of the report: https://www.zionmarketresearch.com/requestbrochure/semiconductor-bonding-market

Semiconductor Bonding Market: Opportunities

Escalating popularity of 3D semiconductor assembling to open new growth opportunities for the global market

Surging popularity of 3D semiconductor assembling and the thriving packaging sector as well as the use of connected things and machine learning tools in a spectrum of industries will create new growth avenues for the global semiconductor bonding market size.

FREQUENTLY ASKED QUESTIONS

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  • What is Semiconductor Bonding?
  • Which key factors will influence global semiconductor bonding market growth over 2023-2030?
  • What will be the value of the global semiconductor bonding market during 2023-2030?
  • What will be the CAGR value of the global semiconductor bonding market during 2023-2030?
  • Which region will record the highest growth in the semiconductor bonding industry globally?
  • Which are the major players leveraging the global semiconductor bonding market growth?

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Artificial Intelligence

How AIoT shapes the future of mobility: Hikvision at ITS World Congress 2024

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HANGZHOU, China, Sept. 27, 2024 /PRNewswire/ — Hikvision made a significant impact at the ITS World Congress in Dubai with its captivating theme, “Embrace AIoT for safer, smarter, and greener mobility.” Its booth became a hub of innovation, where visitors explored AIoT solutions that are reshaping the transportation landscape, sparking deep conversations on the future of urban mobility.

Road safety revolution: harnessing AIoT for secure transportation
Hikvision’s commitment to road safety was on full display at its booth through the impressive array of AIoT solutions designed to create secure and reliable traffic environments. The company’s technology provides 24/7 traffic monitoring, ensuring continuous oversight of motor vehicles, non-motorized vehicles, pedestrians and environmental factors. This comprehensive, real-time information collection enables traffic managers to prevent accidents and enhance road safety. Among the showcased products was the 20 MP IR ANPR Checkpoint Capture Unit, renowned for its high-definition capture capabilities, bolstering traffic safety measures.
A standout innovation was the integration of advanced radar and camera technologies, ensuring uninterrupted, comprehensive detection even in adverse weather conditions. The Radar-Video Fusion Incident Detection Cameras, featured prominently in the product experience area, enable early detection and warning of potential hazards. They are particularly effective in challenging situations such as curved roads, blind spots at intersections, and obstacles beyond visual range.
Attendees also engaged with onboard monitoring products on the simulated bus, including dome network cameras, which is designed to enhance passenger safety. Driving assistance products, such as the Driver Status Monitor (DSM), were demonstrated to mitigate unsafe driving behaviors and ensure safer journeys.
Urban mobility redefined: smart traffic innovations
In the realm of smarter mobility, Hikvision showcased its multidimensional sensing technology, which integrates visible light sensors, infrared sensors, radar, and sonar. This technology expands perception capabilities, significantly improving traffic management and situational awareness. The use of AI-powered comprehensive sensing elevates incident monitoring and violation detection to unprecedented levels of accuracy and efficiency.
A major attraction was the Radar-Video Fusion TandemVu PTZ Camera, which integrates millimeter-wave radar with high-resolution cameras for extensive traffic detection and data analysis. AI-based algorithms combine these two systems to enhance target information, detecting up to 16 types of incidents. This leads to the development of a large-scale fusion model that merges spatial physical data with image semantic information. The result is ultra-long-range perception, achieving over 95% accuracy in vehicle trajectory detection. This robust system improves traffic violation management and optimizes traffic flow, significantly enhancing road efficiency.
At the simulated bus station, visitors observed how AI-assisted people counting automated the collection of passenger flow statistics at peak stop hours and bus line frequency during busy periods. Paired with smart bus stop digital signage, the solution improves bus service quality, operational efficiency, passenger experience, and overall public transport effectiveness.
Sustainable transportation: leading the charge for greener cities
Hikvision’s commitment to sustainable urban mobility was evident through its innovative green wave technology and eco-friendly checkpoint solutions. Green wave technology efficiently manages traffic flow to reduce congestion and lower carbon emissions, aligning with global sustainability goals. Visitors were particularly impressed by a case study showcasing a green wave solution implemented in Zhoushan, China. Over a stretch of 21 kilometers and 34 intersections, this main road cut travel times by 50%.
The use of DarkFighterX technology in checkpoint cameras also received significant attention. This technology senses both visible and invisible light, resulting in more accurate and realistic images. It enhances traffic violation enforcement efficiency while minimizing the need for high ambient light levels, thus reducing light pollution. The 9M DarkfightX ANPR Checkpoint Camera exemplified this dedication to environmental stewardship.
Frank Zhang, President of Hikvision MEA, remarked, “Hikvision supports sustainable urban planning by empowering traffic departments to address congestion and transportation challenges.” He further emphasized, “Our system’s openness fosters a secure and reliable platform for developing smart and green cities. Additionally, our solar technology is extensively utilized in remote areas, while our smart street lighting solutions reduce energy consumption by 20-30%, promoting intelligent urban transportation and advancing global sustainability objectives.”
Hikvision’s presence at the ITS World Congress in Dubai underscored its leadership in integrating AIoT technologies to drive safer, smarter, and greener mobility solutions. The engaging presentations and advanced product demonstrations captured significant attention from industry partners and customers, reaffirming the company’s role as a pioneer in shaping the future of urban transportation. As the world moves towards more intelligent and sustainable transportation systems, Hikvision remains at the forefront, embracing AIoT to create a safer, smarter, and greener future for all.
To find out more about Hikvision’s advanced traffic and public transport solutions, please explore the Hikvision official website.
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Artificial Intelligence

Anti-Drone Market worth $7.05 billion by 2029 – Exclusive Report by MarketsandMarkets™

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DELRAY BEACH, Fla., Sept. 27, 2024 /PRNewswire/ — The global anti-drone market was valued at USD 2.16 billion in 2024 and is projected to reach USD 7.05 billion by 2029; it is expected to register a CAGR of 26.7% during the forecast period according to a new report by MarketsandMarkets™. Increasing government spending on counter-drone technologies, rising incidence of critical infrastructure security breaches by unauthorized drones, and surge in adoption of aerial remote sensing technologies to safeguard critical infrastructure are attributed to the demand for anti-drone.

Download PDF Brochure: https://www.marketsandmarkets.com/pdfdownloadNew.asp?id=177013645
Browse in-depth TOC on “Anti-Drone Market” 178 – Tables61 – Figures253 – Pages
Anti-Drone Market Report Scope:
Report Coverage
Details
Market Revenue in 2024
$ 2.16 billion
Estimated Value by 2029
$ 7.05 billion
Growth Rate
Poised to grow at a CAGR of 26.7%
Market Size Available for
2020–2029
Forecast Period
2024–2029
Forecast Units
Value (USD Million/Billion)
Report Coverage
Revenue Forecast, Competitive Landscape, Growth Factors, and Trends
Segments Covered
By System Type, Application, Platform type, Vertical, and Region
Geographies Covered
North America, Europe, Asia Pacific, and Rest of World
Key Market Challenge
Vulnerability to hacking
Key Market Opportunities
Emphasis on improving unmanned aircraft systems technology
Key Market Drivers
Growing number of illicit activities
By System Type: Hybrid systems to account for the larger market share in the forecasted year.
The hybrid segment accounted for the largest share of the anti-drone market in 2029. The trends of integrating multiple anti-drone technologies are rising since they are most effective in detecting, tracking, and neutralizing drone threats. These systems merge electronic, kinetic, and lasers, providing a comprehensive defense solution against UAVs. Hybrid systems use electronic, kinetic, and laser-based countermeasures to offer optimum protection against drones. These systems are designed to detect, track, identify, categorize, and mitigate drones at operational wide ranges ranging from a few km up to tens of km.
By Platform: The ground-based segment accounted for the largest market share in the forecast year.
The ground-based segment will hold a major share of the anti-drone market in 2029. Many ground-based anti-drone systems use several electronic technologies, such as radar, IR sensors, acoustic systems, and RF & GNSS jammers. MESA radar solutions are used mostly for counter-UAS purposes, protecting critical infrastructure, military camps, and other security-sensitive sites from unauthorized drones. One such solution is EchoGuard, a ground-based airspace management solution that contains a software-defined 3D radar that can be specific to the site. This system can identify single or multiple off-chance drones, including swarms in unauthorized areas. They provide accurate and sustained airspace surveillance for the field of view (FOV) they are configured, and both human and AI-monitored visual checks. The system can be easily transported and integrated directly with the command-and-control centers or another identification sensor for portable use, and multiple units of the system can be combined to cover vast areas or lengths of borders. Major providers of ground-based counter-drone systems include companies like EchoDyne Corporation, DeTect, Meteksan Defense, and WhiteFox Defense. Acoustics-based Discovair G2 utilizes patented microphone arrays. With 128 interconnected microphone elements, the Discovair sensor units can establish azimuth and elevation to the target in real-time using advanced digital signal processing.
Inquiry Before Buying: https://www.marketsandmarkets.com/Enquiry_Before_BuyingNew.asp?id=177013645
By Region: Americas are expected to hold the largest share of the anti-drone market during the forecast period.
Americas is expected to capture the largest share in the anti-drone industry during the forecast period. The growth can be attributed to protecting crucial infrastructure in the region. Governments, particularly in the US, invest in anti-drone systems for military bases, borders, and critical infrastructure. For Instance, in April 2023, RTX secured a USD 237 million contract from the US Army to provide Ku-band Radio Frequency Sensors (KuRFS) and Coyote effectors. These systems are designed to detect and neutralize unmanned aircraft systems (UAS). The contract includes stationary and mobile systems and a specified quantity of effectors, all aimed at enhancing the Army’s operations within the US Central Command region.
Key Players-
The key companies offering anti-drone companies include RTX (US), Lockheed Martin Corporation (US), Leonardo S.p.A. (Italy), Thales (France), and IAI (Israel).
Get 10% Free Customization on this Report: https://www.marketsandmarkets.com/requestCustomizationNew.asp?id=177013645
Browse Adjacent Market: Semiconductor and Electronics Market Research Reports &Consulting
Related Reports: 
Drone Sensor Market Size, Share, Industry Growth & Trends by Sensor Type, Platform (VTOL Type, Fixed Wing Type, Hybrid Type), Application (Navigation, Collision Detection & Avoidance, Data Acquisition, Motion Detection, Power Monitoring), End Users and Region – Global Forecast to 2029
Smart Agriculture Market Size, Share, Statistics and Industry Growth Analysis Report by Offering (Hardware, Software, Services), Agriculture Type, Farm Size (Large, Medium, Small), Application (Precision Farming, Livestock Monitoring) and Region (America, Europe, Asia Pacific, Row) – Global Forecast to 2028
About MarketsandMarkets™
MarketsandMarkets™ has been recognized as one of America’s best management consulting firms by Forbes, as per their recent report.
MarketsandMarkets™ is a blue ocean alternative in growth consulting and program management, leveraging a man-machine offering to drive supernormal growth for progressive organizations in the B2B space. We have the widest lens on emerging technologies, making us proficient in co-creating supernormal growth for clients.
Earlier this year, we made a formal transformation into one of America’s best management consulting firms as per a survey conducted by Forbes.
The B2B economy is witnessing the emergence of $25 trillion of new revenue streams that are substituting existing revenue streams in this decade alone. We work with clients on growth programs, helping them monetize this $25 trillion opportunity through our service lines – TAM Expansion, Go-to-Market (GTM) Strategy to Execution, Market Share Gain, Account Enablement, and Thought Leadership Marketing.
Built on the ‘GIVE Growth’ principle, we work with several Forbes Global 2000 B2B companies – helping them stay relevant in a disruptive ecosystem. Our insights and strategies are molded by our industry experts, cutting-edge AI-powered Market Intelligence Cloud, and years of research. The KnowledgeStore™ (our Market Intelligence Cloud) integrates our research, facilitates an analysis of interconnections through a set of applications, helping clients look at the entire ecosystem and understand the revenue shifts happening in their industry.
To find out more, visit www.MarketsandMarkets™.com or follow us on Twitter, LinkedIn and Facebook.
Contact: Mr. Rohan SalgarkarMarketsandMarkets™ INC. 1615 South Congress Ave.Suite 103, Delray Beach, FL 33445USA: +1-888-600-6441Email: [email protected] Our Web Site: https://www.marketsandmarkets.com/Research Insight: https://www.marketsandmarkets.com/ResearchInsight/anti-drone-market.aspContent Source: https://www.marketsandmarkets.com/PressReleases/anti-drone.asp
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Artificial Intelligence

CluePoints Launches Medical & Safety Review (MSR) Software to Revolutionize Clinical Data Review

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CluePoints furthers its commitment to delivering innovative solutions that enhance clinical trial efficiency with this latest addition to its enterprise software platform.
KING OF PRUSSIA, Pa., Sept. 27, 2024 /PRNewswire/ — CluePoints continues to transform clinical trial review and leverage its industry-leading software to enhance the interrogation, analysis and presentation of data with the launch of its latest application, Medical & Safety Review (MSR).

The tool simplifies and streamlines the medical analysis of study data through user-friendly dashboards, data manipulation and cleaning, query management and full transparency over the data history. This not only improves efficiency and communication in medical oversight, but also elevates patient safety, differentiating MSR as a smarter and unique solution.
Designed by, and for Medical and Safety Reviewers, MSR converts the manual analysis of patient outcomes, which can be prone to inefficiency and error, into an accurate, efficient process. MSR tackles time-consuming study preparation for specific visualizations by featuring a comprehensive standard visualization library as well as the ability to copy and reuse dashboards across different studies, enabling the identification of outlying values, change tracking, and improved communication for smarter clinical trials.
Other benefits of MSR include:
Enhanced medical review efficiency and reduced human errors via automated checksReduced time spent by clinical and data management teams in reviewing dataImproved collaboration with integrated review workflows across departmentsEnsured record quality and accountability with comprehensive change trackingDriving faster decision making with the proactive detection of trends and safety issuesEnsuring regulatory compliance with rule-based detection and user assignmentsAndy Cooper, Chief Executive Officer at CluePoints, commented, “We are thrilled to announce the launch of Medical & Safety Review to our growing product offerings. MSR is the latest application addition to the CluePoints platform, which includes products such as Risk-Based Quality Management (RBQM) and our Site Profile & Oversight Tool (SPOT). Together, they provide a comprehensive approach to clinical trial optimization, enhancing data integrity, ensuring regulatory compliance, and accelerating drug development. The creation of MSR ensures a more streamlined review process while prioritizing patient safety at every step and empowers medical teams to swiftly identify outliers, track data changes, and improve communication.”
To learn more about CluePoints’ award-winning solutions, please visit www.cluepoints.com
About CluePoints
CluePoints is the premier Risk-Based Quality Management (RBQM) and Data Quality Oversight Software provider. We are leveraging the potential of Artificial Intelligence using Advanced Statistics and Machine Learning to determine the quality, accuracy, and integrity of clinical trial data both during and after study conduct. Aligned with guidance from the FDA, EMA, and ICH E6 (R2), CluePoints is deployed to support central and on-site monitoring, medical review, quality risk management and to drive a holistic Risk-Based strategy in all trials. Coupled with thought leadership and consulting expertise to aid pre-study risk assessment, identification of risk controls and solution implementation, you now have everything you need to adhere with global regulatory guidance. The result is positive clinical development outcomes, increased operational efficiency, lower costs and reduced regulatory submission risk as part of the industry paradigm shift to RBQM.
 

View original content:https://www.prnewswire.co.uk/news-releases/cluepoints-launches-medical–safety-review-msr-software-to-revolutionize-clinical-data-review-302260936.html

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