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Micron Launches U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future

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HIROSHIMA, Japan, May 20, 2023 (GLOBE NEWSWIRE) — Micron Technology, Inc., the largest foreign investor in Japan over the last five years, today announced the launch of the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future. Aimed at cultivating a more robust and highly-skilled semiconductor workforce for the two countries, the partnership will drive emerging research while increasing the pipeline of students studying a semiconductor curriculum. U.S. Secretary of State Antony J. Blinken and Japanese Minister of Education, Culture, Sports, Science and Technology Keiko Nagaoka presided over the signing of a memorandum of understanding (MOU), marking a step forward in advancing U.S.-Japan technological competitiveness and resilience.

UPWARDS for the Future, established by Micron and other industry partners, brings together 11 universities from across the U.S. and Japan to develop leading semiconductor curricula, creating opportunities for cross-collaboration. The founding universities are known for their high-quality education and proven commitment to diversity, equality and inclusion (DEI) and closing the gender equity gap in STEM, which is crucial to building the industry’s workforce of the future.

Growing the STEM talent pipeline requires reaching groups that are underrepresented in the semiconductor industry today. UPWARDS for the Future intends to establish pathways into higher education and facilitate new programs dedicated to attracting and retaining those historically underrepresented groups, in addition to supporting the efforts partner institutions have undertaken to date.

“Leading in next-generation technologies requires developing a next-generation workforce,” said Rahm Emanuel, United States Ambassador to Japan. “Semiconductors are critical to our economy and to our security, and the UPWARDS for the Future program will enable the United States and Japan, as allies and economic partners, to build that workforce.”

More than $60 million in contributions over the next five years from a variety of sources, including Micron and its partners, will go towards supporting the launch and implementation of this innovative program, which deepens ties between industry and higher education across the U.S. and Japan. The network, expected to impact approximately 5,000 students per year, will provide access to experiential learning in cleanrooms and memory-related research across institutions, with a particular focus on promoting opportunities for female students, staff and leaders.

“UPWARDS for the Future reflects Micron’s long-term commitment to strengthening the semiconductor ecosystems in the U.S. and Japan. Building and sustaining advanced memory semiconductor leadership requires a robust workforce from diverse backgrounds,” said Micron President and CEO Sanjay Mehrotra. “Micron is proud to be at the forefront of this once-in-a-generation opportunity to unite leading educational institutions and foster greater technology innovation.”

Over the past five years, Micron has increased representation of women globally, with female representation at Micron Japan increasing by 56% in recent years. The company continues to increase its number of female inventors. More than 22% of the original patent applications Micron filed in fiscal year 2022 named a woman as an inventor. In February 2023, Micron Japan was named on Great Place to Work® Institute’s 2023 Best Workplaces in Japan list for the third consecutive year, and especially recognized for engaging its team members and embracing a culture of inclusion and innovation.

Technology innovation and leadership remain the cornerstone of Micron’s business success. The company has contributed to more than 53,000 patents over its lifetime. In 2022, Micron was granted over 3,000 patents – averaging more than eight patent grants per day. This past week, Micron announced that it will be the first semiconductor company to put extreme ultraviolet patterning technology into production in Japan with its Hiroshima fab playing a critical role in the company’s development of its next-generation of DRAM, the 1-gamma (1γ) node.

Micron’s multiple sites in Japan are central to its research and development roadmap for the company’s cutting-edge DRAM technology across its product lines. Micron has invested over $13 billion in Japan since 2013. With more than 4,000 engineers and technicians across the country, Micron is committed to workforce development and ensuring Japan’s continued economic growth and prosperity. Micron has hired more than 1,500 new employees nationwide over the past five years to facilitate the production of nearly 10% of the world’s DRAM supply from Micron’s Hiroshima fab.

Quotes from Partners:

“Partnerships like these will help the U.S. and its allies keep pace with a changing global innovation landscape, and combined with NSF’s other recent investments in semiconductor research and workforce development, keep us in the vanguard of global competitiveness. The diversity of the science and engineering workforce on a global scale is not only the right thing to do, but also necessary, as global competition for talent is fierce and investing in a broad demographic of the population is the only way we can accelerate progress and tackle the global shortage of semiconductor workers.”

– NSF Director Sethuraman Panchanathan

“Boise State takes great pride in its long-standing partnership with Micron in business and engineering, as well as in our materials science, cybersecurity, and computer science and workforce development programs. In this critical moment, we are excited to step forward to advance innovation, security, and economic prosperity by joining with a select group of top universities in the U.S. and Japan in an effort to support semiconductor leadership and advance our national interests. The University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future initiative will make a significant impact for Idaho, the nation, and the world.”

– Boise State University President Marlene Tromp

“Hiroshima University, as one of Japan’s oldest centers of excellence for semiconductor research, has fostered a large number of engineers over the last 40 years for Hiroshima’s high-tech industry cluster, where Micron’s cutting-edge fab is at the core. This U.S.-Japan partnership is an important strategic project for our university, as it aims to further education and the talent pipeline and strengthen R&D in the semiconductor field. Increasing the number of female engineers is a core element of this partnership, contributing to the diversification and advancement of the semiconductor workforce. We are very excited about this collaboration and honored to contribute towards the economic security alliance among U.S. and Japan universities under UPWARDS for the Future.”

– Hiroshima University President Mitsuo Ochi

“It is an immense pleasure and honor for Kyushu University to become part of this remarkable initiative, UPWARDS for the Future. In our daily lives, semiconductors play an indispensable role, and the development of people through education is crucial. As universities, we bear the responsibility of creating and sharing knowledge to shape the workforce of tomorrow. With great anticipation, I embrace this collaborative endeavor, particularly to nurture diverse talent within the semiconductor industry. Together, we will build a future where all voices are valued.”

– Kyushu University President Tatsuro Ishibashi

“Nagoya University is delighted and privileged to be a member of the U.S.-Japan University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future, initiated by Micron. In close collaboration with Micron and other leading U.S. and Japanese universities, we will continue to leverage our strengths in cultivating global talent and ensuring equal opportunities for women to drive further innovation and advancements in the semiconductor and STEM field.”

– Nagoya University President Naoshi Sugiyama

“A robust, re-energized semiconductor ecosystem is a cornerstone to the vibrant U.S.-Japan partnership. With the largest undergrad STEM enrollment among America’s leading research universities, a top-4 graduate engineering college in the U.S., and the Semiconductor Degrees Program, Purdue is committed to working with Micron and our academic collaborators in both countries on workforce, research, and innovation in semiconductors. Honoring the late Purdue Professor Ei-ichi Negishi, who received Nobel Prize in Chemistry in 2010 and was buried in his hometown in Japan this year, Purdue University is making an additional investment to this Japan-US semiconductor partnership by creating the Negishi Fellowship for talent exchange between the two countries.”

– Purdue University President Mung Chiang

“As the first technological university in the U.S., RPI is rapidly building on its rich history in semiconductor research, education and workforce development to create and lead an ecosystem for future chips. A strong partnership with Micron, the U.S. government, academic partners in the U.S. and abroad will be critical to our success. At RPI, we are particularly pleased with the focus on increasing the participation of women and other traditionally underrepresented minorities in semiconductors. Together, we will develop a diverse and highly-skilled talent pool, fill a critical need in the global economy, and provide excellent educational and training opportunities for students.”

Rensselaer Polytechnic Institute President Martin A. Schmidt

“As a leading producer of STEM graduates, Rochester Institute of Technology recognizes the crucial role that semiconductors and related technologies play in driving innovation and economic growth. Equally important, we are committed to fostering diversity and removing educational barriers. We look forward to partnering with our academic colleagues in Japan and in the U.S., as well as Micron, through the University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future to advance semiconductor research and workforce development. By empowering underrepresented groups to enter the semiconductor industry, we can harness the power of diverse perspectives and drive progress forward for the benefit of all. Together, we will create innovative solutions that build a more prosperous future.”

– Rochester Institute of Technology President David Munson

“Advancing innovative semiconductor R&D, manufacturing, supply chains and workforce development is essential to ensuring a carbon-neutral society, as well as economic growth and security. As a leader in semiconductor R&D from materials to chips, Tohoku University is pleased to join Micron and other leading universities in Japan and the United States in the University Partnership for Workforce Development & Research in Semiconductors (UPWARDS) initiative. Tohoku University is confident that this partnership will drive progress towards a sustainable world and will lead to the advancement of women in the field.”

-Tohoku University President Hideo Ohno

“Semiconductors are created through vast collaborative efforts from the materials, processing, manufacturing, packaging and circuit design fields, to the highly specialized expertise that enables its systemization and societal implementation. We firmly believe that the cooperation of brilliant minds driving each of these groundbreaking research fields will pave the way for the development of next-generation semiconductors, serving as a major driving force for the evolution of science and its contributions to social and economic advancement. We eagerly anticipate the opportunity to work with top universities in Japan and the U.S. through UPWARDS for the Future.”

-Tokyo Institute of Technology President Kazuya Masu

“Our economic security depends on our ability to expand semiconductor development, manufacturing, and expertise. As a leader in chip engineering and workforce development for the global innovation economy, the University of Washington is proud to partner with Micron and other leading U.S. and Japanese universities in the University Partnership for Workforce Advancement and Research & Development in Semiconductors (UPWARDS) for the Future, which has great potential to drive advancements in this crucial scientific field.”

– University of Washington President Ana Mari Cauce

“Virginia Tech is proud to partner with Micron and leading U.S. and Japanese universities to support economic innovation by advancing growth and diversity in the semiconductor workforce. Our top-ranked Electrical and Computer Engineering Department is educating the next generation of engineers with 10 specialized areas of study including a new major in Chip-Scale Integration. UPWARDS for the Future is aligned with Virginia Tech’s commitment to increase diversity in STEM education by fostering inclusion and success for women and individuals from underrepresented and underserved communities. This creative partnership will keep Micron and Virginia Tech at the forefront in meeting the nation’s critical need for talented, innovative engineers with a global perspective.”

– Virginia Tech President Tim Sands

About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions, transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.

© 2023 Micron Technology, Inc. All rights reserved. Information, products, and/or specifications are subject to change without notice. Micron, the Micron logo, and all other Micron trademarks are the property of Micron Technology, Inc. All other trademarks are the property of their respective owners.

Micron Media Relations Contact
Erica Rodriguez Pompen
Micron Technology, Inc.
+1 (408) 834-1873
[email protected]

Micron Investor Relations Contact
Farhan Ahmad
Micron Technology, Inc.
+1 (408) 834-1927
[email protected]

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A Fond Farewell: Memories to Treasure from MWC 2024

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HONG KONG, March 4, 2024 /PRNewswire/ — As IPLOOK reflects on its successful participation in MWC 2024, the company is left with countless memories, insights and opportunities that will continue to inspire its team long after the event has ended.

IPLOOK’s Impressive Showing 
IPLOOK’s booth was a hub of activity throughout the 4-day event, drawing in crowds of attendees eager to learn more about IPLOOK’s innovative core network solutions. Some of the key achievements and gains for IPLOOK at MWC 2024 included:
Strong partnerships forged: IPLOOK nailed several new partnerships with leading telecom companies, expanding its reach and impact in the industry.Positive industry coverage: IPLOOK’s presence at MWC 24 attracted the attention of industry research outlets, resulting in conversations highlighting IPLOOK’s leading position in core network market, ability of innovation and integration capability of space, air and ground communications.Brand awareness increased: The event provided an excellent opportunity for IPLOOK to raise its profile and establish itself as a leader in the core network market. Its booth attracted a number of visitors who were already aware of its role as a core network expert, eager to explore the advancements presented by IPLOOK.Valuable feedback received: IPLOOK took the opportunity to gather feedback from attendees on its products and services, which will be invaluable in driving IPLOOK’s future product development and improvements.Innovations that Stole the Show
This year’s MWC, as per its theme “Future First”, was a testament to the power of technology to transform our future life. Attendees were treated to demonstrations of the latest innovation in AIGC, AI-RAN, Open Gateway, and 6G, showcasing how these technologies can revolutionize industries and improve people’s lives.
What’s Next for IPLOOK?
As IPLOOK sets its sights on the horizon, the company is energized by the prospect of deepening connections within the telecom ecosystem and discovering the groundbreaking advancements that lie ahead at MWC’s next chapter. With a steadfast dedication to product innovation, IPLOOK will also journey to key industry events like MVNOs World Congress and AfricaCom, forging new paths into uncharted markets and showcasing its unwavering commitment to the evolution of the telecom landscape.
Contact: [email protected] IPLOOK on LinkedIn @IPLOOK Networks
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Mobica Appoints Gary Butters as CEO, Building on Success and Fuelling Continued Growth

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LONDON, March 4, 2024 /PRNewswire/ — Mobica, the global software and engineering provider, has announced Gary Butters as their Chief Executive Officer (CEO).

 
Gary joined Mobica as Chief Revenue Officer (CRO) in November 2020 and as part of outgoing CEO Sam Kingston’s leadership team, delivered significant success, leading to Mobica’s acquisition by Cognizant in March 2023. 
This acquisition will significantly expand Cognizant’s IoT embedded software engineering capabilities as part of their overall strategy to help companies modernise technology, reimagine processes and transform experiences so they stay ahead in a fast-changing world.
 
Gary takes over the role with the remit to complete the integration of Mobica into Cognizant while continuing to deliver double-digit growth.
Mobica, which is headquartered in Manchester UK, with operations in Europe and the US, provides world-class software engineering and development expertise to many of the most recognised global brands. Founded in 2004, it serves a number of sectors, with particular expertise in the automotive, manufacturing, industrial and semiconductor industries.
In his role as CEO, Gary will continue Mobica’s vision of delivering exceptional value and innovation to it’s clients and customers, while spearheading its growth plan as demand for engineering and software expertise continues to rise.
Commenting on his appointment, Gary says:”Over the past few years, Mobica has seen demand for our world-class engineering increase significantly, particularly with the acceleration in AI and machine learning. This has seen some of the once ‘traditional’ industries such as automotive and manufacturing undergo a radical transformation. 
“As a result, companies are increasingly seeking skilled professionals – particularly in areas such as software development, AI, IoT, and data analytics – in order to stay competitive and meet evolving customer expectations. However, they are vying for a limited pool of technology talent, so access to Mobica engineering services has been vital to enable our customers to remain agile in a rapidly evolving landscape.
“Our ongoing growth is a testament to our team of dedicated ‘Mobicans’ and our unwavering dedication to delivering cutting-edge software engineering solutions. We have consistently provided clients with access to top-tier engineering talent, enabling them to drive digital transformation and achieve their business objectives. I am looking forward to working with our talented team as we continue our ambitious growth plans.”
www.mobica.com 
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Core to Cloud Partners with Cybersecurity Innovator SenseOn to Enable Comprehensive NDR and SIEM Security

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New strategic arrangement allows organisations to monitor identity, endpoint, network and cloud-based activity to stop threats immediately.
CIRENCESTER, England, March 1, 2024 /PRNewswire/ — Core to Cloud, a leading provider of cybersecurity services and solutions, is excited to announce a strategic alliance with SenseOn, a renowned threat detection management platform. This collaboration will empower businesses to bolster their advanced NDR and SEIM operations and secure end-to-end platforms.

In today’s integrated digital landscape, businesses rely on various systems and third-party suppliers. The launch of SenseOn’s platform marks a significant leap forward in proactive threat detection and response, offering a comprehensive solution to combat sophisticated cyber threats. Organisations can identify, detect and respond to vulnerabilities in traditional blind spots. Core to Cloud’s partnership with SenseOn aims to address these challenges by offering a comprehensive and efficient solution for managing threat detection and response.
James Cunningham, CEO and co-founder of Core to Cloud, said: “We are excited to announce our partnership with SenseOn, allowing Core to Cloud to bring our clients a more robust and complete threat detection and management solution. With an ever-changing digital landscape, our clients must be able to detect and respond to any threats within their cyber estate. This partnership offers an all-encompassing approach to managing these risks.” 
One of the critical features of this partnership is that the platform is built upon a foundation of Artificial Intelligence (AI) and Machine Learning (ML) technologies, meticulously designed to evolve alongside cyber threats. Leveraging its unique Deep Learning, SenseOn’s platform analyses vast and complex datasets, providing real-time threat detection, investigation, and autonomous response capabilities. This innovative approach and Core to Cloud’s cybersecurity expertise enables organisations to proactively address potential threats before they escalate, ensuring robust protection against evolving cyber-attacks.
SenseOn’s platform and Core to Cloud’s know-how empower security teams to navigate the complicated threat landscape efficiently. Intelligent automation streamlines incident response, allowing cybersecurity professionals to focus on strategic initiatives rather than routine tasks.
David Atkinson, CEO and Founder of SenseOn, added: “We are excited to announce a pivotal moment in SenseOn’s journey with establishing a strategic channel partnership with Core to Cloud. This collaboration is more than a partnership; it’s an alliance that leverages the strengths of both companies to propel us towards growth. By combining SenseOn’s consolidated threat detection platform with Core to Cloud’s technical and service expertise, we are poised to deliver a new standard in cybersecurity solutions.”
Moreover, Core to Cloud and SenseOn are committed to ongoing collaboration and continuous improvement. As cybersecurity threats evolve, so do the strategies and tools to counter them. This collaboration is not just a one-time solution; it represents an ongoing commitment to enhancing the cybersecurity landscape for businesses of all sizes. Core to Cloud and SenseOn will continue to work together to develop new features, refine existing tools, and provide unparalleled support to our clients.
Core to Cloud’s partnership with SenseOn signifies a major step forward in cybersecurity. By combining expertise, technology, and a shared commitment to excellence, the two companies are paving the way for businesses to navigate the complex digital landscape confidently. Together, they empower businesses to protect their NDR, SEIM and end-to-end platforms.
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