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[Latest] Global Advanced Chip Packaging Market Size/Share Worth USD 71.8 Billion by 2032 at a 8.2% CAGR: Custom Market Insights (Analysis, Outlook, Leaders, Report, Trends, Forecast, Segmentation, Growth, Growth Rate, Value)

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Austin, TX, USA, July 31, 2023 (GLOBE NEWSWIRE) — Custom Market Insights has published a new research report titled Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D packaging, 3D packaging, fan-out wafer-level packaging (FOWLP), flip-chip packaging, system-in-package (SiP) solutions), By Packaging (Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Wafer-Level Chip Scale Package (WLCSP)), By End-Use Industry (Electronics, Automotive, Telecommunications, Industrial, Healthcare, Aerospace and Defence), and By Region – Global Industry Overview, Statistical Data, Competitive Analysis, Share, Outlook, and Forecast 2023–2032 in its research database.

“According to the latest research study, the demand of global Advanced Chip Packaging Market size & share was valued at approximately USD 35.6 Billion in 2022 and is expected to reach USD 39.2 Billion in 2023 and is expected to reach a value of around USD 71.8 Billion by 2032, at a compound annual growth rate (CAGR) of about 8.2% during the forecast period 2023 to 2032.”

Click Here to Access a Free Sample Report of the Global Advanced Chip Packaging Market @ https://www.custommarketinsights.com/request-for-free-sample/?reportid=27355

Advanced Chip Packaging Market: Growth Factors and Dynamics

  • Increasing Demand for Miniaturization: The growing need for smaller, lighter, and more powerful electronic devices has driven the demand for advanced chip packaging solutions. These packaging technologies enable the integration of more functionalities into smaller form factors, supporting the trend of miniaturization in various industries.
  • Shift towards System Integration and Multi-Chip Solutions: As technology advances, electronic devices are increasingly embracing system integration and multi-chip solutions. Advanced chip packaging allows different chips and components to be combined in a single package, resulting in smaller devices with improved connectivity and easier assembly. This integration leads to compact and versatile devices that offer enhanced performance and functionality.
  • Rising Complexity of Semiconductor Devices: As semiconductor devices become more complex and advanced, traditional packaging methods may not meet the performance requirements. Advanced chip packaging techniques, such as 2.5D and 3D packaging, offer higher interconnect density and improved electrical performance, addressing the challenges posed by complex semiconductor designs.
  • Demand for Higher Data Transfer Rates: With the rise in data-intensive applications and high-speed connectivity, the demand for advanced chip packaging solutions with better signal integrity and thermal management has surged. Packaging technologies like flip-chip and wafer-level chip scale packaging (WLCSP) enable higher data transfer rates and efficient heat dissipation.
  • Focus on Energy Efficiency: Energy efficiency is a key consideration for modern electronic devices. Advanced chip packaging technologies, such as fan-out wafer-level packaging (FOWLP) and system-in-package (SiP) solutions, enable the integration of power management and heterogeneous components, enhancing energy efficiency and prolonging battery life.
  • Innovation and Technological Advancements: Continuous innovation in packaging materials, design techniques, and manufacturing processes is driving the advanced chip packaging market. New materials, such as fan-out molding compounds and organic substrates, and innovative manufacturing methods are contributing to improved performance, reliability, and cost-effectiveness of advanced chip packaging solutions.

Request a Customized Copy of the Advanced Chip Packaging Market Report @ https://www.custommarketinsights.com/request-for-customization/?reportid=27355

Advanced Chip Packaging Market: Partnership and Acquisitions

  • Qualcomm Technologies and Samsung Electronics (2020): In 2020, Qualcomm Technologies collaborated with Samsung Electronics to develop advanced chip packaging solutions for 5G smartphones. The partnership aimed to seamlessly integrate Qualcomm’s 5G modems with Samsung’s Exynos processors using innovative packaging techniques, enabling enhanced 5G connectivity in smartphones.
  • Amkor Technology and GlobalFoundries (2021): In 2021, Amkor Technology, Inc. partnered with GlobalFoundries to jointly develop and offer advanced packaging solutions for various semiconductor applications. This collaboration combined Amkor’s expertise in advanced packaging with GlobalFoundries’ manufacturing capabilities, enabling both companies to cater to the diverse packaging needs of their customers.
  • TSMC’s Acquisition of Invecus Limited (2020): In 2020, Taiwan Semiconductor Manufacturing Company Limited (TSMC) acquired Invecus Limited, a semiconductor materials supplier. This acquisition strengthened TSMC’s capability to access essential materials for advanced chip packaging, ensuring a steady supply chain for their semiconductor manufacturing operations.
  • SK Hynix’s Acquisition of Intel’s NAND Business (2021): In 2021, SK Hynix Inc. acquired Intel Corporation’s NAND memory and storage business. While not directly related to chip packaging, this acquisition allowed SK Hynix to enhance its semiconductor product lineup, including the integration of NAND flash chips into advanced chip packaging solutions for various applications.

Report Scope

Feature of the Report Details
Market Size in 2023 USD 39.2 Billion
Projected Market Size in 2032 USD 71.8 Billion
Market Size in 2022 USD 35.6 Billion
CAGR Growth Rate 8.2% CAGR
Base Year 2022
Forecast Period 2023-2032
Key Segment By Technology, Packaging, End-Use Industry and Region
Report Coverage Revenue Estimation and Forecast, Company Profile, Competitive Landscape, Growth Factors and Recent Trends
Regional Scope North America, Europe, Asia Pacific, Middle East & Africa, and South & Central America
Buying Options Request tailored purchasing options to fulfil your requirements for research.

(A free sample of the Advanced Chip Packaging report is available upon request; please contact us for more information.)

Our Free Sample Report Consists of the following:

  • Introduction, Overview, and in-depth industry analysis are all included in the 2023 updated report.
  • The COVID-19 Pandemic Outbreak Impact Analysis is included in the package.
  • About 220+ Pages Research Report (Including Recent Research)
  • Provide detailed chapter-by-chapter guidance on the Request.
  • Updated Regional Analysis with a Graphical Representation of Size, Share, and Trends for the Year 2023
  • Includes Tables and figures have been updated.
  • The most recent version of the report includes the Top Market Players, their Business Strategies, Sales Volume, and Revenue Analysis 
  • Custom Market Insights (CMI) research methodology

(Please note that the sample of the Advanced Chip Packaging report has been modified to include the COVID-19 impact study prior to delivery.)

Request a Customized Copy of the Advanced Chip Packaging Market Report @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/


Advanced Chip Packaging Market: COVID-19 Analysis

The COVID-19 pandemic has had a significant impact on the Advanced Chip Packaging Market, with the industry experiencing both positive and negative effects. Here are some of the key impacts:

  • Supply Chain Disruptions: The COVID-19 pandemic caused disruptions in the global supply chain, impacting the availability of raw materials, components, and equipment required for advanced chip packaging. This led to delays in production and increased costs for manufacturers.
  • Shift in Consumer Demand: With the pandemic’s impact on remote work, e-learning, and online entertainment, there was a surge in demand for electronic devices like laptops, tablets, and smartphones. This increased demand put additional pressure on the advanced chip packaging market to meet the growing need for high-performance chips.
  • Resilient Supply Chain: To recover, the advanced chip packaging industry focused on building a more resilient supply chain, diversifying sourcing locations, and securing critical components to reduce dependency on specific regions.
  • Accelerated Digital Transformation: The pandemic accelerated digital transformation, leading to increased demand for cloud services and data centers. Advanced chip packaging companies seized this opportunity to cater to the growing need for high-performance chips in cloud computing infrastructure.
  • Investment in Automation and AI: To enhance manufacturing efficiency and reduce workforce dependency, companies invested in automation and artificial intelligence technologies, streamlining production processes and mitigating the impact of labor shortages.
  • Focus on R&D and Innovation: Recovery efforts involved increased investment in research and development to create more advanced chip packaging solutions that meet the evolving demands of emerging technologies like 5G, AI, and IoT, ensuring continued growth in a post-pandemic world.
  • Adoption of Remote Collaboration Tools: The pandemic necessitated remote working and collaboration. Advanced chip packaging companies embraced digital tools and virtual collaboration platforms to ensure seamless communication between teams, enabling them to continue their work efficiently despite physical restrictions.
  • Focus on Healthcare and Medical Electronics: The pandemic highlighted the importance of healthcare and medical electronics. Advanced chip packaging companies redirected efforts towards developing chips for medical devices, diagnostic equipment, and telemedicine solutions, contributing to the healthcare industry’s recovery and growth.

In conclusion, the COVID-19 pandemic has had a mixed impact on the Advanced Chip Packaging Market, with some challenges and opportunities arising from the pandemic. Manufacturers and retailers need to remain agile and adapt to the changing market conditions to overcome these challenges and capitalize on new growth opportunities.

Request a Customized Copy of the Advanced Chip Packaging Market Report @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

Key questions answered in this report:

  • What is the size of the Advanced Chip Packaging market and what is its expected growth rate?
  • What are the primary driving factors that push the Advanced Chip Packaging market forward?
  • What are the Advanced Chip Packaging Industry’s top companies?
  • What are the different categories that the Advanced Chip Packaging Market caters to?
  • What will be the fastest-growing segment or region?
  • In the value chain, what role do essential players play?
  • What is the procedure for getting a free copy of the Advanced Chip Packaging market sample report and company profiles?

Key Offerings:

  • Market Share, Size & Forecast by Revenue | 2023−2032
  • Market Dynamics – Growth Drivers, Restraints, Investment Opportunities, and Leading Trends
  • Market Segmentation – A detailed analysis by Types of Services, by End-User Services, and by regions
  • Competitive Landscape – Top Key Vendors and Other Prominent Vendors

Buy this Premium Advanced Chip Packaging Research Report | Fast Delivery Available – [220+ Pages] @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

List of the prominent players in the Advanced Chip Packaging Market:

  • Intel Corporation
  • Taiwan Semiconductor Manufacturing Company Limited (TSMC)
  • Advanced Micro Devices Inc. (AMD)
  • Samsung Electronics Co. Ltd.
  • Amkor Technology, Inc.
  • ASE Group (Advanced Semiconductor Engineering Inc.)
  • Qualcomm Technologies Inc. (a subsidiary of Qualcomm Incorporated)
  • SK Hynix Inc.
  • Siliconware Precision Industries Co. Ltd. (SPIL)
  • Texas Instruments Incorporated (TI)
  • Others

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(We customized your report to meet your specific research requirements. Inquire with our sales team about customizing your report.)

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Browse the full Advanced Chip Packaging Market Size, Trends and Insights By Technology (2.5D packaging, 3D packaging, fan-out wafer-level packaging (FOWLP), flip-chip packaging, system-in-package (SiP) solutions), By Packaging (Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Wafer-Level Chip Scale Package (WLCSP)), By End-Use Industry (Electronics, Automotive, Telecommunications, Industrial, Healthcare, Aerospace and Defence), and By Region – Global Industry Overview, Statistical Data, Competitive Analysis, Share, Outlook, and Forecast 2023–2032 Report at https://www.custommarketinsights.com/report/advanced-chip-packaging-market/  

Advanced Chip Packaging Market – Regional Analysis

The Advanced Chip Packaging Market is segmented into various regions, including North America, Europe, Asia-Pacific, and LAMEA. Here is a brief overview of each region:

  • North America: Trend – In North America, the Advanced Chip Packaging market is driven by a focus on technological advancements and innovation. The region has a strong presence of leading semiconductor companies and research institutions, fostering the development of cutting-edge chip packaging techniques and materials. Key players in this region include Intel Corporation, Qualcomm Technologies, Inc., Amkor Technology, Inc., and Texas Instruments Incorporated.
  • Europe: Trend – In Europe, the Advanced Chip Packaging market is characterized by a growing emphasis on sustainable and eco-friendly packaging solutions. The region is actively exploring green packaging materials and techniques to reduce environmental impact and meet the demands of environmentally conscious customers. Dominating Market Players – Leading players in the European market include ASML Holding N.V., Infineon Technologies AG, NXP Semiconductors N.V., and STMicroelectronics N.V. These companies are at the forefront of providing advanced chip packaging solutions tailored to European industries’ sustainability goals.
  • LAMEA (Latin America, Middle East, and Africa): In the LAMEA region, the Advanced Chip Packaging market is influenced by increasing investments in infrastructure development and smart city initiatives. The demand for chip packaging solutions for IoT applications, telecommunication infrastructure, and industrial automation drives the market’s growth. Dominating Market Players – Prominent players in the LAMEA market include GlobalFoundries, ON Semiconductor Corporation, Tower Semiconductor Ltd., and South Microelectronics. These companies contribute to the region’s technological advancement through their diverse chip packaging offerings catering to various end-use industries.
  • Asia-Pacific: Trend – The Asia-Pacific region experiences a surge in the demand for advanced chip packaging solutions driven by rapid industrialization and the adoption of advanced technologies. The region’s focus on 5G deployment, IoT applications, and smart manufacturing fuels the demand for innovative chip packaging techniques. The major Prominent players in this region include such as Taiwan Semiconductor Manufacturing Company Limited (TSMC), Samsung Electronics Co., Ltd., ASE Group (Advanced Semiconductor Engineering, Inc.)

Click Here to Access a Free Sample Report of the Global Advanced Chip Packaging Market @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

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The Advanced Chip Packaging Market is segmented as follows:

By Technology

  • 5D packaging, 3D packaging
  • fan-out wafer-level packaging (FOWLP)
  • flip-chip packaging
  • system-in-package (SiP) solutions

By Packaging

  • Ball Grid Array (BGA)
  • Quad Flat Package (QFP)
  • Chip Scale Package (CSP)
  • Wafer-Level Chip Scale Package (WLCSP)

By End-Use Industry

  • Electronics
  • Automotive
  • Telecommunications
  • Industrial
  • Healthcare
  • Aerospace and Defence

Click Here to Get a Free Sample Report of the Global Advanced Chip Packaging Market @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

By Region

North America

  • The U.S.
  • Canada
  • Mexico

Europe

  • France
  • The UK
  • Spain
  • Germany
  • Italy
  • Rest of Europe

Asia Pacific

  • China
  • Japan
  • India
  • Australia
  • South Korea
  • Rest of Asia Pacific

The Middle East & Africa

  • Saudi Arabia
  • UAE
  • Egypt
  • Kuwait
  • South Africa
  • Rest of the Middle East & Africa

Latin America

  • Brazil
  • Argentina
  • Rest of Latin American

This Advanced Chip Packaging Market Research/Analysis Report Contains Answers to the following Questions.

  • Which Trends Are Causing These Developments?
  • Who Are the Global Key Players in This Advanced Chip Packaging Market? What are Their Company Profile, Product Information, and Contact Information?
  • What Was the Global Market Status of the Advanced Chip Packaging Market? What Was the Capacity, Production Value, Cost and PROFIT of the Advanced Chip Packaging Market?
  • What Is the Current Market Status of the Advanced Chip Packaging Industry? What’s Market Competition in This Industry, Both Company and Country Wise? What’s Market Analysis of Advanced Chip Packaging Market by Considering Applications and Types?
  • What Are Projections of the Global Advanced Chip Packaging Industry Considering Capacity, Production and Production Value? What Will Be the Estimation of Cost and Profit? What Will Be Market Share, Supply and Consumption? What about imports and exports?
  • What Is Advanced Chip Packaging Market Chain Analysis by Upstream Raw Materials and Downstream Industry?
  • What Is the Economic Impact On Advanced Chip Packaging Industry? What are Global Macroeconomic Environment Analysis Results? What Are Global Macroeconomic Environment Development Trends?
  • What Are Market Dynamics of Advanced Chip Packaging Market? What Are Challenges and Opportunities?
  • What Should Be Entry Strategies, Countermeasures to Economic Impact, and Marketing Channels for Advanced Chip Packaging Industry?

Click Here to Access a Free Sample Report of the Global Advanced Chip Packaging Market @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

Reasons to Purchase Advanced Chip Packaging Market Report

  • Advanced Chip Packaging Market Report provides qualitative and quantitative analysis of the market based on segmentation involving economic and non-economic factors.
  • Advanced Chip Packaging Market report outlines market value (USD) data for each segment and sub-segment.
  • This report indicates the region and segment expected to witness the fastest growth and dominate the market.
  • Advanced Chip Packaging Market Analysis by geography highlights the consumption of the product/service in the region and indicates the factors affecting the market within each region.
  • The competitive landscape incorporates the market ranking of the major players, along with new service/product launches, partnerships, business expansions, and acquisitions in the past five years of companies profiled.
  • Extensive company profiles comprising company overview, company insights, product benchmarking, and SWOT analysis for the major market players.
  • The Industry’s current and future market outlook concerning recent developments (which involve growth opportunities and drivers as well as challenges and restraints of both emerging and developed regions.
  • Advanced Chip Packaging Market Includes in-depth market analysis from various perspectives through Porter’s five forces analysis and provides insight into the market through Value Chain.

Reasons for the Research Report

  • The study provides a thorough overview of the global Advanced Chip Packaging market. Compare your performance to that of the market as a whole.
  • Aim to maintain competitiveness while innovations from established key players fuel market growth.

Buy this Premium Advanced Chip Packaging Research Report | Fast Delivery Available – [220+ Pages] @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/

What does the report include?

  • Drivers, restrictions, and opportunities are among the qualitative elements covered in the worldwide Advanced Chip Packaging market analysis.
  • The competitive environment of current and potential participants in the Advanced Chip Packaging market is covered in the report, as well as those companies’ strategic product development ambitions.
  • According to the component, application, and industry vertical, this study analyzes the market qualitatively and quantitatively. Additionally, the report offers comparable data for the important regions.
  • For each segment mentioned above, actual market sizes and forecasts have been given.

Who should buy this report?

  • Participants and stakeholders worldwide Advanced Chip Packaging market should find this report useful. The research will be useful to all market participants in the Advanced Chip Packaging industry.
  • Managers in the Advanced Chip Packaging sector are interested in publishing up-to-date and projected data about the worldwide Advanced Chip Packaging market.
  • Governmental agencies, regulatory bodies, decision-makers, and organizations want to invest in Advanced Chip Packaging products’ market trends.
  • Market insights are sought for by analysts, researchers, educators, strategy managers, and government organizations to develop plans. 

Request a Customized Copy of the Advanced Chip Packaging Market Report @ https://www.custommarketinsights.com/report/advanced-chip-packaging-market/ 

About Custom Market Insights:

Custom Market Insights is a market research and advisory company delivering business insights and market research reports to large, small, and medium-scale enterprises. We assist clients with strategies and business policies and regularly work towards achieving sustainable growth in their respective domains.

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The Australia Data Center Market Size Will Witness Investments of $7.71 Billion by 2029 – Get Insights on 135 Existing Data Centers and 23 Upcoming Facilities across Australia – Arizton

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the-australia-data-center-market-size-will-witness-investments-of-$7.71-billion-by-2029-–-get-insights-on-135-existing-data-centers-and-23-upcoming-facilities-across-australia-–-arizton

CHICAGO, May 9, 2024 /PRNewswire/ — According to Arizton’s latest research report, the Australia data center market is growing at a CAGR of 3.22% during 2023-2029.

To Know More, Click: https://www.arizton.com/market-reports/australia-data-center-market-investment-analysis
Australia Data Center Market Report Scope
Report Attributes
Details
Market Size (Investment)
USD 7.71 Billion (2029)
Market Size (Area)
1,460.0 thousand sq. Feet (2029)
Market Size (Power Capacity)
303.0 MW (2029)
CAGR Investment (2023-2029)
3.22 %
Colocation Market Size (Revenue)
USD 2.05 Billion (2029)
Historic Year
2020-2022
Base Year
2023
Forecast Year
2024-2029
The data center market in Australia has been witnessing significant growth in investments over the past few years. It is expected to grow at an absolute growth rate of around 20% between 2023-2029. Australia is among the top destinations for data center investments in the APAC region.
Sydney, Melbourne, and Perth are the primary data center hubs hosting most data centers in the country. Canberra, Brisbane, Darwin, and other cities are among the emerging locations in Australia with abundant land availability for data center development.
Investment Opportunities
In November 2023, OVHcloud announced the launch of its upcoming SYD3 Sydney data center facility, which is expected to be operational in 2024.In November of 2023, Rest Super invested about $656 million in a data center in Brisbane, which Quinbrook Infrastructure Partners are developing.In November 2023, NEXTDC announced the development of the D1 data center facility in Darwin; the facility is expected to go operational by Q2 2024.AirTrunk announced the expansion of its SYD2 data center campus in Sydney; once fully built, the facility will account for an additional power capacity of around 30 MW, making it an aggregate capacity of around 120 MW. This second phase is expected to be completed in 2024. AirTrunk’s upcoming SYD3 Sydney facility calls for an aggregate investment of about $670 million.In an August 2023 news article, Macquarie Data Centres revealed its plan to expand its upcoming IC3 Super West facility in Sydney regarding power capacity. As per January 2024 news article, Macquarie Data Centres has received approval to build/grow the IC3 Super West, its third facility in Sydney.In August 2023, STACK Infrastructure announced the MEL01 A data center launch in Melbourne, located at 399 Palmers Road. The entire campus will have a power capacity of around 72 MW, divided equally between buildings A and B. As of early 2024, Building B is still a work in progress. Furthermore, the company plans new facilities in Canberra, Hume, and Perth.Rising Procurement of Renewable Energy in Australia Boosting the Market Opportunities
In 2022, according to IRENA, solar energy accounted for around 61% of Australia’s overall renewable energy capacity, followed by wind, hydro, and bioenergy (in decreasing order), from which renewable power is extracted for all the sustainable energy needs of the country. Australia aims to achieve its target of zero carbon emissions by 2050. The country announced plans to reach almost 43% less emission than in 2005.
According to the Australia National Electricity Market (NEM), the renewable energy share in the country is expected to reach around 41% by 2030. By 2025, Australia aims to achieve 100% instantaneous renewable energy for its main grid, starting with a half-hour period and gradually increasing to cover hours and days. This transition will be facilitated by an increase in wind, solar, and energy storage solutions to meet the country’s new target of 82% renewables by 2030. The retirement of coal-based power generation facilities in the coming years will contribute to this goal.
Microsoft in Australia Recent Development During 2022-2024:
In October 2023, Microsoft, a hyperscale tech giant, decided to expand its footprint in Australia by investing over $3 billion to increase and expand its computing capacity in the country by over 250% in the next two years. It is expected to go live by late 2025.In July 2023, Microsoft announced the completion of the construction of Building 1 of the Station Road data center; Building 2 is still a work in progress. This is expected to be completed by late 2024.Why Should You Buy This Research? 
Market size is available in terms of investment, area, power capacity, and Australia colocation market revenue.An assessment of the data center investment in Australia by colocation, hyperscale, and enterprise operators.Investments in the area (square feet) and power capacity (MW) across cities in the country.A detailed study of the existing Australia data center market landscape, an in-depth market analysis, and insightful predictions about market size during the forecast period.Snapshot of existing and upcoming third-party data center facilities in AustraliaFacilities Covered (Existing): 135Facilities Identified (Upcoming): 23Coverage: 20 LocationsExisting vs. Upcoming (Area)Existing vs. Upcoming (IT Load Capacity)Data Center Colocation Market in the AustraliaColocation Market Revenue & Forecast (2023-2029)Retail Colocation Revenue (2023-2029)Retail Colocation PricingThe Australia data center market investments are classified into IT, power, cooling, and general construction services with sizing and forecast.A comprehensive analysis of the latest trends, growth rate, potential opportunities, growth restraints, and prospects for the industry.Business overview and product offerings of prominent IT infrastructure providers, construction contractors, support infrastructure providers, and investors operating in the market.A transparent research methodology and the analysis of the demand and supply aspects of the market.Market Segmentation
IT InfrastructureServersStorage SystemsNetwork InfrastructureElectrical InfrastructureUPS SystemsGeneratorsSwitches & SwitchgearsPDUsOther Electrical InfrastructureMechanical InfrastructureCooling SystemsRack CabinetsOther Mechanical InfrastructureCooling SystemsCRAC and CRAHChillersCooling Towers, Condensers and Dry CoolersEconomizers and Evaporative CoolersOther Cooling UnitsGeneral ConstructionCore & Shell DevelopmentInstallation & commissioning ServicesBuilding & Engineering DesignFire Detection & Suppression SystemsPhysical SecurityData Center Infrastructure Management (DCIM)Tier StandardTier I & Tier IITier IIITier IVGeographySydneyMelbournePerthOther CitiesVendor Landscape
IT Infrastructure Providers: Arista Networks, Atos, Broadcom, Cisco Systems, Dell Technologies, Extreme Networks, Hewlett Packard Enterprise, Hitachi Vintara, IBM, Juniper Networks, Lenovo, Oracle, Pure Storage, Quanta Cloud Technology, and Super Micro Computer.Data Center Construction Contractors & Sub-Contractors: AECOM, A W Edwards, Aurecon, Benmax, BGIS, Dem, FDC Construction & Fitout, FKG Group, Greenbox Architecture, HDR (Hurley Palmer Flatt), Hutchinson Builders, Icon, ISG, John Holland, Kapitol Group, Linesight, Manteena Group, Nilsen, Paramount Airconditioning, Parratech, SCEE Group, Stowe Australia, & Taylor Group Construction.Support Infrastructure Providers: ABB, Airedale, Alfa Laval, Canovate, Caterpillar, Condair, Cummins, Delta Electronics, Eaton, Everett Smith & Co, Green Revolution Cooling, HITEC Power Protection, Kohler, Legrand, Mitsubishi Electric, Piller Power Systems, Rittal, Rolls Royce, Schneider Electric, STULZ, Thycon, & Vertiv.Data Center Investors: 5G Networks, AirTrunk, Amazon Web Services, CDC Data Centres, DC Two, DCI Data Centers, Digital Realty, Equinix, Edge Centres, Fujitsu, Global Switch, Leading Edge Data Centres, Keppel Data Centres, Macquarie Data Centres, Microsoft, NEXTDC, & STACK Infrastructure.New Entrants: GreenSquareDC, Stockland, Supernode, Trifalga, & Vantage Data Centers.Key Questions Answered in the Report:
Q: How big is the Australia data center market?
Q: How much MW of power capacity will be added across Australia from 2024 to 2029?
Q: What is the growth rate of the Australia data center market?
Q: What factors are driving the Australia data center market?
Q: Which cities are included in the Australia data center market report?
Get the Detailed TOC @ https://www.arizton.com/market-reports/australia-data-center-market-investment-analysis
Check Out Some of the Top Selling Research Reports:    
Singapore Data Center Market – Investment Analysis & Growth Opportunities 2024-2029
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Indonesia Data Center Market – Investment Analysis & Growth Opportunities 2024-2029
Taiwan Data Center Market – Investment Analysis & Growth Opportunities 2024-2029
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Invoca Named a Leader in Real-Time Revenue Execution Platforms Report

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Report recognises Invoca’s innovative platform for delivering “game-changing AI capabilities to revenue teams.”
SANTA BARBARA, Calif., May 9, 2024 /PRNewswire/ — Invoca today announced that Forrester Research has named Invoca as a Leader in The Forrester Wave™: Real-Time Revenue Execution Platforms, Q2 2024 report. Forrester evaluated the most significant revenue execution platform vendors based on three main categories — current offering, strategy, and market presence — along with interviews with customers. Invoca is the top-ranked vendor in both the current offering and strategy categories and among the top-ranked in market presence. Invoca also received the highest possible score in 19 of the 31 evaluation criteria, including AI differentiators, AI: large language model utilisation, Marketing: performance optimisation, In-call guidance: pre-call insights, System configuration: privacy, and Interaction capture: integrations.

The report states, “[Invoca’s] success starts with a vision focused on enabling revenue teams to drive growth by delivering the most complete platform for optimising the entire buying experience. Invoca has a track record of innovation that continues to raise the bar on what is possible to fulfil its vision.”
Revenue Execution Platforms Unify the Buying Journey to Drive Revenue Growth
Invoca’s revenue execution platform enables revenue teams to connect customer buying journey data across the marketing team that engages customers and the sales teams that close the deals. By using a comprehensive revenue execution platform, revenue teams can finally connect their marketing investments directly to revenue, improve digital engagement, and drive higher-quality leads.
Invoca also enables sales teams in the contact centre or at distributed business locations to access information from the customer’s digital journey from a centralised source, enabling them to provide the best call experience possible and close more sales opportunities.
Revenue Execution Platforms Needed to Power Today’s Buyer Journey
“B2C revenue teams across marketing and sales are feeling more pressure to directly connect revenue to their investments. But a lack of alignment and poor visibility of the full buying journey makes that nearly impossible,” said Peter Isaacson, Chief Marketing Officer at Invoca. “I believe Invoca was named a revenue execution Leader because we help marketing and sales teams manage the complete buyer journey from the first click to the final sale, so they can drive revenue growth.”
By using Invoca’s comprehensive revenue execution platform, revenue teams can connect their paid media investments directly to revenue, improve digital engagement and deliver the best buyer experiences to drive more sales. The Forrester report states that “reference customers rave about the versatility of the platform and its collaboration with customers around enhancements.”
Windstream, an Invoca customer, embodies this approach to revenue execution by tightly aligning the marketing and sales teams so they can work together to increase revenue.
“‍We’re a better marketing organisation because we have a strong partnership with sales,” said Aaron Pierce, VP of Marketing at Windstream. “Our teams have realised that we make each other better — I think that’s the biggest win. And now, when we have a problem, we can put all the smartest people together in the room to tackle it.”
“The Invoca platform has allowed us to unlock a ‘full-funnel’ view of our marketing performance that incorporates both online and offline,” said Lorenzo Clark, VP of Digital Sales at Windstream. “Now, we can get a read on lead quality because we can see what’s happening on sales calls and also track sales performance on a lead-by-lead basis.”
The Forrester Wave™The Forrester Wave™ is Forrester’s evaluation of top products in a technology market. The report assesses the core capabilities and strategies of these products based on an executive strategy briefing and/or product demo session, criteria questionnaire, and customer reference calls/surveys.
The Forrester Wave™: Real-Time Revenue Execution Platforms, Q2 2024 report is available for download here.
Additional Resources:
Learn more about Revenue Execution Platforms: https://www.invoca.com/uk/product/revenue-execution-platformHow real-time revenue execution platforms drive business growth: https://www.invoca.com/uk/blog/revenue-execution-platformThe 5 Revenue Execution Platform Uses You Need to Know About: https://www.invoca.com/uk/blog/revenue-execution-platform-usesAbout InvocaInvoca is the leading revenue execution platform to connect marketing and sales teams to enable them to track and optimise the buying journey and drive more revenue. By using a comprehensive revenue execution platform with deep integrations with leading technology platforms, revenue teams can better connect their paid media investments directly to revenue, improve digital engagement, and deliver the best buyer experiences to drive more sales. With Invoca, top consumer brands, including AutoNation, DIRECTV, Mayo Clinic, Mutual of Omaha, and Verizon, experience unbelievable results powered by undeniable data. Invoca has raised $184M from leading venture capitalists, including Upfront Ventures, Accel, Silver Lake Waterman, H.I.G. Growth Partners, and Salesforce Ventures. For more information, visit www.invoca.com.
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Fight Against Pancreatic Cancer Ramps Up as Market Size Revenues Expected to Exceed $36 Billion by 2036

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FN Media Group News Commentary
PALM BEACH, Fla., May 9, 2024 /PRNewswire/ — The incidence of pancreatic cancer is increasing globally, which is driving the growth of the market. As of 2023, the American Cancer Society predicts that 64,050 Americans will be diagnosed with pancreatic cancer. It is estimated that 50,550 people will die from pancreatic cancer (26,620 men and 23,930 women). Pancreatic cancer is an aggressive form of cancer, and it is often not detected until it is in an advanced stage. Additionally, the treatment options for pancreatic cancer are limited, and the survival rate is low. These factors are contributing to the rise in pancreatic cancer cases, which in turn is driving the growth of the pancreatic cancer market.  A recent report from Research Nester projected that the global pancreatic cancer market size is slated to expand at ~18% CAGR between 2024 and 2036. The market is poised to garner a revenue of USD 36 billion by the end of 2036, up from a revenue of ~USD 6 billion in the year 2023. The report said: “Advancements in diagnosis and treatment options for pancreatic cancer are also driving the growth of the market. As researchers gain a better understanding of the different types of pancreatic cancer, they are developing more targeted treatments that are more likely to be effective with fewer side effects. Additionally, new treatment options, such as immunotherapy and targeted therapies, are improving patient outcomes and extending survival rates.”  Active biotech and pharma companies in the markets this week include Oncolytics Biotech® Inc. (NASDAQ: ONCY) (TSX: ONC), Zai Lab Limited (NASDAQ: ZLAB), Notable Labs, Ltd. (NASDAQ: NTBL), Cardiff Oncology, Inc. (NASDAQ: CRDF), Johnson & Johnson (NYSE: JNJ).

Research Nester concluded: “The pancreatic cancer market in North America is garner the largest revenue by the end of 2036 due to several demographic changes, including an aging population and increased incidence of obesity and diabetes. In the US, there are 37.3 million diabetics (11.3[R3] % of the population); 28.7 million are diagnosed with diabetes, including 28.5 million adults. As the population ages, there will be a higher prevalence of chronic diseases such as diabetes and obesity, which are risk factors for pancreatic cancer. Additionally, the aging population will lead to an increase in the number of people with pre-existing conditions that can increase the risk of developing pancreatic cancer. Obesity and diabetes are known risk factors for pancreatic cancer, and as these conditions become more prevalent, the number of cases of pancreatic cancer is expected to increase.”
Oncolytics Biotech® Inc. (NASDAQ: ONCY) (TSX: ONC) Receives Regulatory Clearance to Evaluate Pelareorep in Combination with Modified FOLFIRINOX +/- an anti-PD-L1 Inhibitor in Pancreatic Cancer 
US$5 million PanCAN grant provides important support for the fifth cohort of the GOBLET study  Study of modified OLFIRINOX/pelareorep/atezolizumab (Tecentriq ®) combination expands existing pancreatic cancer program  First patient expected to be enrolled in Q2 2024 Oncolytics Biotech ® Inc., a leading clinical-stage company specializing in immunotherapy for oncology, will commence enrollment into a new GOBLET study pancreatic cancer cohort following both German regulatory and ethics approvals. This cohort will evaluate pelareorep in combination with modified FOLFIRINOX (mFOLFIRINOX) with or without the PD-L1 immune checkpoint inhibitor atezolizumab (Tecentriq ® ) in newly diagnosed patients with pancreatic ductal adenocarcinoma (PDAC). It is supported by a US$5M Therapeutic Accelerator Award from the Pancreatic Cancer Action Network (PanCAN), an innovative program established to accelerate the development of new treatments for pancreatic cancer. The chemotherapy regimens of mFOLFIRINOX or gemcitabine + nab-paclitaxel are the two most common standards of care for pancreatic cancer.  Oncolytics has already reported data with the combination of gemcitabine and nab-paclitaxel ( link to the PR , link to the poster ) that surpassed historical outcomes. Positive results from a combination with mFOLFIRINOX could greatly enhance pelareorep’s potential in addressing pancreatic cancer.
“Oncolytics is pleased to announce receipt of regulatory clearance to initiate the mFOLFIRINOX cohort in patients with newly diagnosed metastatic PDAC. We appreciate the opportunity to collaborate with PanCAN, Roche, and AIO on this cohort, which is expected to initiate enrollment in the second quarter,” said Dr. Matt Coffey, President and Chief Executive Officer of Oncolytics. “We believe that working with PanCAN will help to further enrich Oncolytics’ clinical relationships with the pancreatic cancer community. We are also grateful for PanCAN’s Therapeutic Accelerator Award, which is enabling the evaluation of this combination therapy.”
“The Therapeutic Accelerator Award program has been an important part of PanCAN’s approach to advancing innovative treatments for pancreatic cancer. We incorporated input from leading scientists and clinicians in the field of pancreatic cancer to select Oncolytics as a recipient of this award,” said Anna Berkenblit , MD, MMSc, Chief Scientific and Medical Officer at PanCAN. “Increasing patient access to clinical trials is vital to developing improved treatment options, so we are pleased that Oncolytics has received regulatory clearance for the pelareorep/mFOLFIRINOX combination and is poised to enroll the first patient in this cohort. We hope that the results from this study lead to improved outcomes for patients with pancreatic cancer.”
Dirk Arnold , M.D., Ph.D., Director of Asklepios Tumorzentrum Hamburg and primary investigator of the GOBLET trial, commented, “Oncolytics has taken a very strategic approach to the development of pelareorep in pancreatic cancer by focusing its clinical studies on combinations with the most widely used treatment regimens. My experience to date with the GOBLET study, including the positive metastatic PDAC and encouraging anal cancer data reported last year, makes me enthusiastic to initiate enrollment in the mFOLFIRINOX cohort.”
“We previously reported very encouraging results in pancreatic cancer patients for the combination of pelareorep, gemcitabine/nab-paclitaxel, and atezolizumab, and we plan to begin a registration-enabling study of this regimen later this year. The new pelareorep/mFOLFIRINOX cohort offers the opportunity to expand pelareorep’s role in pancreatic cancer. If the mFOLFIRINOX combination shows a compelling efficacy signal, this therapeutic approach could also be advanced to a registration-enabling study, providing two opportunities for pelareorep-based treatment to benefit pancreatic cancer patients,” said Thomas Heineman , M.D., Ph.D., Chief Medical Officer at Oncolytics. “In addition, translational research studies planned for this cohort will help to further elucidate pelareorep’s mechanism of action, including its ability to shape the tumor microenvironment (TME). Notably, we will evaluate the correlation between tumor responses and the expansion of tumor-infiltrating lymphocytes (TILs) in the blood, an effect that was observed in earlier pancreatic cancer studies. We look forward to initiating enrollment into the mFOLFIRINOX/pelareorep study cohort in the second quarter of this year.” CONTINUED… Read these full press releases and more news for ONCY at: https://www.financialnewsmedia.com/news-oncy/  
Other recent developments in the biotech industry of note for cancer events include:
Zai Lab Limited (NASDAQ: ZLAB) recently announced financial results for the first quarter of 2024, along with recent product highlights and corporate updates. “Our first quarter results demonstrate strong commercial execution and pipeline progress across our potential first- and best-in-class product portfolio,” said Dr. Samantha Du, Founder, Chairperson, and Chief Executive Officer of Zai Lab. “The launch of VYVGART is off to an impressive start with $13.2 million of sales in the first quarter. Looking ahead, we expect to accelerate commercial performance for the remainder of the year and are preparing for three new potential launches in 2024. We are also excited by the progress of our late-stage pipeline and we are on track to achieve the objectives outlined in our five-year strategic plan, including significant revenue growth and profitability by the end of 2025.”
“Our net revenues grew 39% y-o-y or 43% y-o-y at CER in the first quarter, driven by strong execution with the launch of VYVGART and uptake of our existing portfolio,” said Josh Smiley, President and Chief Operating Officer of Zai Lab. “With VYVGART’s launch in gMG at the end of last year, and multiple new products and indications expected to launch over the near-term, we are now entering a period of robust growth for Zai Lab. Our significant growth, coupled with our focus on driving efficiencies and productivity across the organization, will drive the evolution of Zai Lab into a profitable, high growth business by the end of 2025. Furthermore, we will continue to focus on expanding our global portfolio through our internal discovery activities and strategic business development,” Mr. Smiley concluded.
Notable Labs, Ltd. (NASDAQ: NTBL), a clinical-stage precision oncology company developing new cancer therapies identified by its Predictive Precision Medicine Platform (PPMP), recently reported financial results for the year ended December 31, 2023 and provided a business update.
“The last year has been a time of great accomplishment for Notable. We built a strong clinical validation dataset, starting with a poster presented at the American Association for Cancer Research (AACR 2023); became a publicly listed company, following the closing of a reverse merger in October 2023; and reported successful PPMP clinical data from the Phase 2 fosciclopirox study that showcased the ability of our platform to accurately predict patient outcomes for specific therapeutics,” said Thomas Bock, M.D., Chief Executive Officer of Notable. “The performance of our platform in accurately predicting the outcome of the fosciclopirox study has enabled us to enhance the clinical trial plan for our lead product candidate, volasertib, in development for patients with relapsed/refractory acute myeloid leukemia (r/r AML). In our upcoming Phase 2 trial, we will be utilizing the platform to enrich the study’s enrollment with patients predicted to respond to volasertib, which we believe will result in more rapid enrollment, shorter time to efficacy data and, ultimately, increased probability of success.”
Cardiff Oncology, Inc. (NASDAQ: CRDF), a clinical-stage biotechnology company leveraging PLK1 inhibition to develop novel therapies across a range of cancers, recently announced financial results for the first quarter ended March 31, 2024, and provided a business update.
“During the start of 2024, we presented several important new data sets supporting our first-line RAS-mutated mCRC strategy and the broader opportunity for onvansertib,” said Mark Erlander, Ph.D., Chief Executive Officer of Cardiff Oncology. “The data from the ONSEMBLE trial replicated, in a second independent and randomized dataset, the bev naïve signal from our earlier Phase 1b/2 KRAS-mutated mCRC trial. And the Phase 1b data published in the peer-reviewed journal Clinical Cancer Research, and the additional data we presented in one of our five posters at AACR, further substantiated our lead program in RAS-mutated mCRC. The additional AACR posters also point toward new indications for onvansertib in RAS wild-type mCRC, small cell lung cancer and ovarian cancer. Looking ahead, we believe that our upcoming data readout from our first-line trial in RAS-mutated mCRC has the potential to serve as a key value inflection point for our company and revolutionize the treatment of RAS-mutated mCRC, an area with no new treatments approved in over two decades.”
Johnson & Johnson (NYSE: JNJ) recently announced that the U.S. Food and Drug Administration (FDA) has approved CARVYKTI® (ciltacabtagene autoleucel; cilta-cel) for the treatment of adult patients with relapsed or refractory multiple myeloma who have received at least one prior line of therapy, including a proteasome inhibitor and an immunomodulatory agent, and are refractory to lenalidomide. With this approval, CARVYKTI® becomes the first and only B-cell maturation antigen (BCMA)-targeted therapy approved for the treatment of patients with multiple myeloma as early as first relapse.
FDA approval is based on positive results from the Phase 3 CARTITUDE-4 study, which demonstrated that the earlier use of CARVYKTI® reduced the risk of disease progression or death by 59 percent compared to standard therapies—pomalidomide, bortezomib and dexamethasone (PVd) or daratumumab, pomalidomide and dexamethasone (DPd)—in adults with relapsed and lenalidomide-refractory multiple myeloma who received one to three prior lines of therapy. The study, which was presented at the 2023 American Society of Clinical Oncology (ASCO) Annual Meeting and published in The New England Journal of Medicine, also included and reported key secondary results such as overall response (OR) and overall survival (OS).
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