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Through Glass Via (TGV): The Next Generation Advanced Packaging Solution

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KAOHSIUNG, Oct. 23, 2023 /PRNewswire/ — On September 19, 2023, Intel announced one of the industry’s first glass substrates for next-generation advanced packaging. The industry believes that glass substrates are emerging as a promising alternative interposer material, especially for heterogeneous packaging such as 2.5D or 3D packages.

As the demand for AI, high-speed computation (HPC), and powerful computing continues to grow, there is an increasing need to enhance the number of transistors in a single package. However, traditional organic materials like silicon, commonly used for interposers, are encountering limitations. Glass substrates offer numerous advantages, including exceptional flatness, high thermal stability, and rigidity. These attributes enable the miniaturization and integration of transistors on a glass substrate.
E&R, an advanced laser innovation provider, has dedicated a self-developed accelerated optics solution (ACES) combined with advanced laser technology to delivering total solutions for glass substrates for several years, including TGV, Laser Glass Polishing, and multi-beam path Laser cutting solutions for glass.
Processing glass substrates presents significant challenges, primarily due to their high durability, especially in the context of achieving 2.5D or 3D packaging through the Through-Glass-Via (TGV) technique. This challenge is further complicated by the stringent accuracy and via size requirements.
“UPH is the key.
TGV, an essential method for glass substrates to achieve 2.5D/3D packaging, involves internal modification for subsequent wet etching processes. Currently, the most common TGV method uses a filamentation beam to generate multiple shots for internal modification, with a VPS of approximately 50 vias per second only. However, E&R has opted for a Bessel beam system as our self-developed optics (ACES) and laser total solution, which significantly increases the VPS and accuracy. Currently, we can achieve between 600 and 1,000 vias per second for the random pattern layout while maintaining an accuracy of 5 um -3 sigma”. – mentioned by E&R CSO Vic Chao.
E&R’s TGV tool full automation machine can handle glass panels up to 600mm*600mm, with a thickness of up to 1,100um, while achieving a good aspect ratio of 1:10. The via diameter can be controlled from 50um to 200um with a defect-free sidewall, of which the roughness can achieve ≤ 1 um after etching.
E&R will participate in the 2023 Semicon Europa at Messe München, Germany, from November 14th–17th at MESSE München, booth# B2378. Please visit us to explore more possibilities for your application.
Reference link: https://www.allaboutcircuits.com/news/intel-develops-glass-substrate-for-next-generation-advanced-chip-packaging-needs/ 
Media Contact: [email protected]
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Artificial Intelligence

Eye Level holds its 2024 Eye Level Math Olympiad for students to test out their math skills.

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SEOUL, South Korea, Oct. 17, 2024 /PRNewswire/ — Eye Level is hosting the 2024 Math Olympiad (ELMO 2024), inviting students from grades 1 to 8 worldwide to showcase their math skills. The competition will run from November 9 to December 1, following each country’s schedule across 15 countries.object

This Olympiad, part of the annual Eye Level Math Olympiad series established in 2004, offers students a valuable opportunity to assess and enhance their mathematical abilities. The test lasts approximately one hour and is designed to challenge students across various areas of math skills, covering most arithmetic and critical thinking domains. Questions are tailored to each grade level, allowing students to evaluate their skills objectively.All participants will receive a certificate of participation and a comprehensive analysis of their test results. Official results and winners will be announced in January 2025 on myeyelevel.com, with award ceremonies planned to be held locally for outstanding participants.
Registration is currently open on myeyelevel.com.
About Eye Level
Eye Level is an international provider of supplemental education services in Math and English with more than 2 million students having experienced its programs. Eye Level guides the students to learn at their own pace, and achieve their goals. With a growth-minded learning process, Eye Level helps students build good learning habits that become the foundation of great talent – setting them up for success in school and beyond. 
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Artificial Intelligence

n2 Group Advances HPC/AI Portfolio by Acquiring Managed Services Company X-ISS

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OXFORD, England, Oct. 17, 2024 /PRNewswire/ — n2 Group, the transformative computing technology investment company, announces the acquisition of high-performance computing (HPC) and AI specialists, X-ISS. The addition of X-ISS expands the Group’s portfolio– joining NAG, VSNi, BioTeam and STAC—as it accelerates advancements in technology and computation, underpinned by innovation, technical excellence, and a focus on long-term growth.

n2 Group invests selectively in technical computing companies with deep business impact in a variety of sectors, providing operational support and a collaborative approach to innovation and business transformation. The addition of X-ISS will further strengthen the Group’s already strong HPC/AI credentials, with NAG, STAC and BioTeam already adding to this space. 
X-ISS is a pioneer in Managed Services specifically designed for HPC/AI. With their in-depth understanding of hardware and software complexities within HPC and AI, they deliver highly impactful end-to-end services to clients through the integration, optimization and management of HPC/AI systems. The integration of X-ISS into n2 Group aligns with the Group vision of improving the accessibility, quality and robustness of computing solutions to enable greater productivity in industry. 
X-ISS will operate as an autonomous business within the n2 Group, maintaining its brand, identity and ethos. n2 Group’s status as an independent, member-backed organisation with no external financial stakeholders allows X-ISS to continue providing impartial advice based on the technology needs and challenges of its clients. Inter-group synergies will enable greater innovation and collaboration, advancing the Group’s position and long-term HPC/AI market impact. 
“X-ISS strengthens the n2 community in the strategically important area of HPC/AI”, said Adrian Scales, Snr Director of Investments and Partnerships at n2 Group. “As a respected boutique HPC service provider, X-ISS is helping clients navigate an increasingly complex landscape in terms of technologies and software integrations with AI and analytics. The acquisition strongly complements the Group’s existing HPC professional services capability, and we are delighted to have them on board.”
“This is an important milestone for X-ISS.”, said Deepak Khosla, CEO X-ISS, “The partnership with n2 Group will enable us to enhance our flagship ManagedHPC solution by leveraging n2’s complementary services and product developments, allowing us to deliver even greater value to our customers. As businesses face increasing challenges with complex technologies like AI and cloud computing, we’re now better equipped to support them with the same quality, passion, and partnership that defines X-ISS. I am excited about the opportunities this can bring for current and future X-ISS customers.”
About n2 Group  
At n2 Group we are transforming computing and technology investment with a radical new approach. Our businesses are all established, purpose-driven market-leaders in computing products or services. We stimulate long-term sustainable growth through group-level support in strategy, business development, innovation, and operations. With no shareholders or external financial interests, we reinvest all profits back into the group or to the community, reinforcing our commitment to positive social impact through technological advancements.    
n2 Group companies are at the forefront of computing and IT infrastructure, helping clients in various sectors to be more productive, innovative or reduce risk through advanced software and services. Rapidly expanding in high-performance computing, artificial intelligence, and scientific computing, our businesses maintain their unique brands and identities, but benefit from the expanded network available through the group.   
n2 Group Companies  
•  BioTeam: Scientific computing consultancy integrating technologies, data, and cultures to accelerate science. 
•  NAG: Advanced products and services in algorithms, optimization, high-performance computing and AI. 
•  STAC: Independent financial services technology research and community events. 
•  VSNi: Proven statistical solutions and data expertise driving innovation and success.  
•  X-ISS: Industry leading management and analytics solutions for HPC/AI systems.
For more detailed information and the latest updates, visit n2 Group. 
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TIE 2024 Unveils a New Era of Innovation

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A New Era of AI-powered Innovation and Industrial Revolution: Driving Integration of Smart Tech into Daily Life.
TAIPEI, Oct. 17, 2024 /PRNewswire/ — The 2024 Taiwan Innotech Expo (TIE) kicked off today at Taipei World Trade Center with a focus on “Smart Tech Island –The New Era of AI.” This year’s event showcases over a thousand advanced technologies and research achievements across six key areas: digital information, data security, precision health, defense, green and renewable energy, and civil and military resilience, heralding a new chapter in the technological evolution of industries.

Online and On-Site Exhibitions Offers Comprehensive Access to the Latest Innovations
TIE 2024 offers a seamless blend of virtual and physical experiences. Visitors can explore technologies, register for events, and plan their visit online before the expo opens. During the expo period, the event website provides essential tools such as e-meeting requests, product maps, and program registration. For those who were unable to attend in person, online attendees can view exhibits and access business negotiation records even after the expo is closed, fostering ongoing collaboration and opportunities. As a leading platform for technological innovation exchanges in Taiwan, TIE 2024 showcases the nation’s advancements in AI and smart technologies. This event is anticipated to drive industry transformation and opens new chapters in technological innovation.
Official Website: https://tie.twtm.com.tw/en

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