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New IBM Processor Innovations To Accelerate AI on Next-Generation IBM Z Mainframe Systems

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New IBM Telum II Processor and IBM Spyre Accelerator unlock capabilities for enterprise-scale AI, including large language models and generative AI
Advanced I/O technology enables and simplifies a scalable I/O sub-system designed to reduce energy consumption and data center footprint
PALO ALTO, Calif., Aug. 26, 2024 /PRNewswire/ — IBM (NYSE: IBM) revealed architecture details for the upcoming IBM Telum® II Processor and IBM Spyre™ Accelerator at Hot Chips 2024. The new technologies are designed to significantly scale processing capacity across next generation IBM Z mainframe systems helping accelerate the use of traditional AI models and Large Language AI models in tandem through a new ensemble method of AI.

With many generative AI projects leveraging Large Language Models (LLMs) moving from proof-of-concept to production, the demands for power-efficient, secured and scalable solutions have emerged as key priorities. Morgan Stanley research published in August projects generative AI’s power demands will skyrocket 75% annually over the next several years, putting it on track to consume as much energy in 2026 as Spain did in 2022.1 Many IBM clients indicate architectural decisions to support appropriately sized foundation models and hybrid-by-design approaches for AI workloads are increasingly important.
The key innovations unveiled today include:
IBM Telum II Processor: Designed to power next-generation IBM Z systems, the new IBM chip features increased frequency, memory capacity, a 40 percent growth in cache and integrated AI accelerator core as well as a coherently attached Data Processing Unit (DPU) versus the first generation Telum chip. The new processor is expected to support enterprise compute solutions for LLMs, servicing the industry’s complex transaction needs.IO acceleration unit: A completely new Data Processing Unit (DPU) on the Telum II processor chip is engineered to accelerate complex IO protocols for networking and storage on the mainframe. The DPU simplifies system operations and can improve key component performance.IBM Spyre Accelerator: Provides additional AI compute capability to complement the Telum II processor. Working together, the Telum II and Spyre chips form a scalable architecture to support ensemble methods of AI modeling – the practice of combining multiple machine learning or deep learning AI models with encoder LLMs. By leveraging the strengths of each model architecture, ensemble AI may provide more accurate and robust results compared to individual models. The IBM Spyre Accelerator chip, previewed at the Hot Chips 2024 conference, will be delivered as an add on option. Each accelerator chip is attached via a 75-watt PCIe adapter and is based on technology developed in collaboration with the IBM Research. As with other PCIe cards, the Spyre Accelerator is scalable to fit client needs.”Our robust, multi-generation roadmap positions us to remain ahead of the curve on technology trends, including escalating demands of AI,” said Tina Tarquinio, VP, Product Management, IBM Z and LinuxONE. “The Telum II Processor and Spyre Accelerator are designed to deliver high-performance, secured, and more power efficient enterprise computing solutions. After years in development, these innovations will be introduced in our next generation IBM Z platform so clients can leverage LLMs and generative AI at scale.”
The Telum II processor and the IBM Spyre Accelerator will be manufactured by IBM’s long-standing fabrication partner, Samsung Foundry, and built on its high performance, power efficient 5nm process node. Working in concert, they will support a range of advanced AI-driven use cases designed to unlock business value and create new competitive advantages. With ensemble methods of AI, clients can achieve faster, more accurate results on their predictions. The combined processing power announced today will provide an on ramp for the application of generative AI use cases. Some examples could include:
Insurance Claims Fraud Detection: Enhanced fraud detection in home insurance claims through ensemble AI, which combine LLMs with traditional neural networks geared for improved performance and accuracy.Advanced Anti-Money Laundering: Advanced detection for suspicious financial activities, supporting compliance with regulatory requirements and mitigating the risk of financial crimes.AI Assistants: Driving the acceleration of application lifecycle, transfer of knowledge and expertise, code explanation as well as transformation, and more.Specifications and Performance Metrics:
Telum II processor: Featuring eight high-performance cores running at 5.5GHz, with 36MB L2 cache per core and a 40% increase in on-chip cache capacity for a total of 360MB. The virtual level-4 cache of 2.88GB per processor drawer provides a 40% increase over the previous generation. The integrated AI accelerator allows for low-latency, high-throughput in-transaction AI inferencing, for example enhancing fraud detection during financial transactions, and provides a fourfold increase in compute capacity per chip over the previous generation. 
The new I/O Acceleration Unit DPU is integrated into the Telum II chip. It is designed to improve data handling with a 50% increased I/O density. This advancement enhances the overall efficiency and scalability of IBM Z, making it well suited to handle the large-scale AI workloads and data-intensive applications of today’s businesses.
Spyre Accelerator: A purpose-built enterprise-grade accelerator offering scalable capabilities for complex AI models and generative AI use cases is being showcased. It features up to 1TB of memory, built to work in tandem across the eight cards of a regular IO drawer, to support AI model workloads across the mainframe while designed to consume no more than 75W per card. Each chip will have 32 compute cores supporting int4, int8, fp8, and fp16 datatypes for both low-latency and high-throughput AI applications.
Availability
The Telum II processor will be the central processor powering IBM’s next-generation IBM Z and IBM LinuxONE platforms. It is expected to be available to IBM Z and LinuxONE clients in 2025. The IBM Spyre Accelerator, currently in tech preview, is also expected to be available in 2025.
Statements regarding IBM’s future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
About IBM
IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. Thousands of government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM’s long-standing commitment to trust, transparency, responsibility, inclusivity and service.
Additional Sources
Read more about the IBM Telum II Processor.Read more about the IBM Spyre Accelerator.Read more about the IO AcceleratorMedia Contact:
Chase SkinnerIBM [email protected] 
Aishwerya PaulIBM [email protected] 
1 Source: Morgan Stanley Research, August 2024.

 

 

 

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Artificial Intelligence

BingX Lists AgentLayer on Launchpool, Unlocking New Staking Opportunities

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VILNIUS, Lithuania, Sept. 13, 2024 /PRNewswire/ — BingX, a global leading cryptocurrency exchange, is thrilled to announce the launch of a new digital asset, AgentLayer ($AGENT), on its Launchpool. As a decentralized network for autonomous AI agents, AgentLayer is designed to coordinate and collaborate with human oversight in a permissionless environment. At the heart of this innovation is $AGENT, a new AI currency that powers the Agent Economy on the Base blockchain, enabling the minting, deployment, and swapping of AI assets on-chain. This limited-time staking event will take place from September 13 to September 18, giving BingX users the chance to earn AGENT tokens while discovering the potential of this innovative AI-powered project.

Vivien Lin, Chief Product Officer at BingX and Head of BingX Labs, shared her enthusiasm about the listing of AgentLayer on the Launchpool, highlighting the project’s potential to revolutionize AI-driven technologies. “We believe that AgentLayer represents a significant step forward in how AI agents can collaborate autonomously across industries. This token listing should make it easier for users to engage with this exciting new frontier of decentralized AI, unlocking incredible opportunities for growth and innovation.”
BingX Launchpool is built to provide a seamless and rewarding staking experience for its users. They can deposit or withdraw their staked assets at any time during the event period. Rewards are generated hourly based on random snapshots and automatically credited to participants’ accounts. Once the event ends, the staked assets will be automatically returned to BingX users, ensuring a smooth and risk-free experience.
In this round, participants can stake USDT or BTC, with a total reward pool of 6.5 million AGENT tokens. This Launchpool has a deposit limit, allowing BingX users to stake up to 20,000 USDT in the USDT pool and up to 0.35 BTC in the BTC pool. BingX users can further maximize their rewards by participating in a later staking activity involving AGENT.
The introduction of AgentLayer on BingX Launchpool is part of the exchange’s ongoing commitment to providing users with access to cutting-edge blockchain projects and fostering innovation within the cryptocurrency space. With flexible staking options, automated rewards, and risk-free asset management, BingX continues to enhance user engagement and bring meaningful opportunities to its global community.
About BingX
Founded in 2018, BingX is a leading cryptocurrency exchange serving over 10 million users worldwide. BingX offers diversified products and services, including spot, derivatives, copy trading, and asset management – all designed for the evolving needs of users, from beginners to professionals. BingX is committed to providing a trustworthy platform that empowers users with innovative tools and features to elevate their trading proficiency. In 2024, BingX proudly became Chelsea FC’s principal partner, marking an exciting debut in the world of sports.
For more information please visit: https://bingx.com/
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Global AI Summit 2024 continued to transform data and AI landscape on final day

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RIYADH, Saudi Arabia, Sept. 13, 2024 /PRNewswire/ — The third edition of the Global AI Summit (GAIN) closed today, after a series high profile collaborations poised to drive AI innovation and growth.

Hosted by the Saudi Data and AI Authority (SDAIA), GAIN has brought together AI experts and business leaders from across the globe. The final day kicked off with a session exploring the technical foundations of Explainable AI – systems helping humans to interpret the predictions made by machine learning models – featuring representatives from The Alan Turing Institute, Thales, and Cognizant Technology Solutions.
It also saw the next generation of AI talent celebrated on stage following this week’s International AI Olympiad, in which students from 25 countries competed to solve problems using the latest technologies. The competition was launched as a platform to help the next generation of AI experts and enthusiasts keep pace with the rapid changes in AI technology and exchange ideas.
The final day also focused on AI and education, with dedicated sessions on personalized learning with generative AI, as well as a discussion on how we bridge the innovation gap between academia and industry.  
Several landmark Memoranda of Understanding (MoU) and partnerships were secured, including:
Microsoft: signed an MoU with SDAIA  to develop a joint Center of Excellence dedicated to accelerating innovation in the field of Generative AI, with a special focus on Arabic Large Language Models. The enhanced partnership will also see “ALLaM” – SDAIA’s Arabic LLM – generally available on Microsoft Azure.
Dell: signed an MoU with SDAIA to develop talent in the Kingdom, which will include equipping citizens with practical experience and knowledge about AI concepts and applications.
Oracle: signed an MoU with SDAIA to raise citizens’ awareness of AI and enhance skills to support the Saudi Arabian labor market. This will be achieved through several collaborative initiatives, including workshops and comprehensive training programs that provide professional certifications in data and AI.
IBM: and SDAIA have joined forces to host the watsonX platform and the “ALLaM” model – a specialized Arabic language model – on the government cloud “Deem.” By combining IBM’s expertise in AI with Deem’s secure infrastructure, the collaboration provides a high-performance environment for government agencies to leverage AI technologies.
KloudSpot: signed an MoU with SDAIA to implement advanced cloud services that support AI and Internet of Things technologies. The partnership is expected to contribute significantly to Saudi Arabia’s digital transformation goals.
Saudi Arabia Ministry of Tourism: also partnered with SDAIA to create an AI Center of Excellence dedicated to transforming the tourism sector.
Additionally, the summit saw the establishment of key partnerships with ST Engineering for smart city solutions.
The summit is due to return in Riyadh in 2026.
[email protected] 
 

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Hikvision to Bring Smarter, Greener Mobility to ITS World Congress 2024

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HANGZHOU, China, Sept. 13, 2024 /PRNewswire/ — Hikvision is set to unveil its latest innovations in urban mobility at the ITS World Congress 2024, taking place from September 16th to 20th in Dubai. Located at booth number H6-G6, Hikvision invites attendees to experience a transformative vision of urban mobility, anchored in the theme: “Embrace AIoT for safer, smarter, and greener mobility.”

Highlighted solutions: innovations for every aspect of urban mobility
Hikvision will present a broad range of solutions designed to enhance urban transportation. These innovations address critical areas such as traffic violation management, traffic order management, road operations, and smart public transport. Notably, a case study will showcase how Hikvision’s innovative green wave technology has successfully reduced travel time by 50% on a major road with 34 intersections. Additionally, a simulated bus environment will demonstrate how AI-assisted on-board monitoring enhances both safety and efficiency for public transport.
From detecting road violations and managing congestion to managing buses and ensuring road safety, these solutions use advanced technologies such as integrated traffic enforcement devices, green wave systems, AI-powered traffic cameras, and on-board devices. Together, they create a cohesive and intelligent urban mobility ecosystem that promises safer, more efficient, and environmentally friendly transportation.
Transportation Operations Coordination Center (TOCC): the nerve center of smart mobility
At the heart of Hikvision’s exhibit is the TOCC. This advanced solution integrates data from across urban landscapes—including vehicles, roads, and environmental factors—into a centralized hub. The TOCC’s capabilities in real-time traffic monitoring and emergency response management will be demonstrated on an extra-large LED wall. Visitors can experience firsthand how the TOCC offers accurate traffic state monitoring and proactive detection of traffic anomalies, ensuring seamless coordination during emergencies. This cutting-edge technology is poised to redefine how cities manage their traffic systems, offering a glimpse into the future of urban mobility.
Experience area: a glimpse into tomorrow’s traffic solutions
In the Product Experience Area, visitors will be immersed in a simulated urban intersection setup, showcasing Hikvision’s latest traffic management innovations. This space will showcase the company’s core technologies, such as DarkFighter, which detects both visible and invisible light, minimizing light pollution; and radar-video fusion, which combines millimeter-wave radar with cameras for comprehensive traffic detection and data analysis. Featured products will include checkpoint cameras, radar-video fusion cameras, all-in-one spotters, intelligent pedestrian traffic lights, radars and acoustic sensors. Attendees will gain hands-on experience with the technology that is transforming city streets into smarter, safer environments.
“Our participation in the ITS World Congress is an exciting opportunity to demonstrate how AIoT can create safer, smarter, and greener urban environments,” said Frank Zhang, President of Hikvision MEA. “By integrating advanced technologies into transportation systems, we are not only enhancing safety and efficiency but also reducing environmental impact, making our cities more sustainable for future generations.”
Stay tuned for more updates as we approach the ITS World Congress 2024, and be sure to experience these innovative solutions in person at Booth H6-G6.
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