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Thermal Spray Wire Market to Reach $1.9 Billion, Globally, by 2029 at 7.5% CAGR: Allied Market Research

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Allied Market Research published a report, titled, “Thermal Spray Wire Market by Material Type (Nickel-Based Alloys, Cobalt-Based Alloys, Aluminum Alloys, Stainless Steel and Others), Process Type (Flame Spray, Cold Spray, Arc Spray, Plasma Spray and Others), and End-Use (Aerospace, Automotive, Oil & Gas, Power Generation and Others): Global Opportunity Analysis and Industry Forecast, 2024-2029″. According to the report, the thermal spray wire market was valued at $1.2 billion in 2023, and is estimated to reach $1.9 billion by 2029, growing at a CAGR of 7.5% from 2024 to 2029.
Download PDF Brochure: https://www.alliedmarketresearch.com/request-sample/A323754
Prime determinants of growth
The global thermal spray wire market is experiencing growth due to several factors such as enhancement of wear and corrosion resistance, thermal spray wire significantly enhances the wear and corrosion resistance of these components, boosting the market for thermal spray wires. However, Availability of substitutes is expected to restraint the growth of thermal spray wire market during the forecast period. Moreover, expansion in the medical and electronics sectors offers remunerative opportunities for the global thermal spray wire market.
Report coverage & details:

Report Coverage

Details

Forecast Period

2024–2029

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Base Year

2023

Market Size in 2023

$1.2 billion

Market Size in 2029

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$1.9 billion

CAGR

7.5 %

No. of Pages in Report

300

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Segments Covered

Material Type, Process Type, End-Use and Region.

Drivers

Enhancement of wear and corrosion resistance
Increase in demand for rising maintenance, repair, and overhaul (MRO) activities

 

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Opportunities

Advancements in aviation technologies, such as navigation aids, communication systems

 

Restraint

High initial investment and operating costs

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The nickel-based alloys segment is expected to remain the largest type throughout the forecast period.
Nickel-based alloys are highly resistant to corrosion, making them ideal for protective coatings in harsh environments such as chemical processing plants, marine environments, and oil and gas industries. These alloys maintain their strength and integrity at high temperatures, making them suitable for applications in aerospace, power generation turbines, and other high-temperature industrial processes. Thermal spray coatings of nickel-based alloys can provide excellent wear resistance, extending the life of components subjected to abrasive and erosive conditions.
Procure Complete Report (300 Pages PDF with Insights, Charts, Tables, and Figures) @ https://bit.ly/3YW0iwV
The arc spray segment is expected to lead throughout the forecast period.
The arc spray process offers several advantages, including high deposition efficiency, excellent bond strength, and the ability to apply coatings over large areas quickly. Additionally, thermal spray coatings can be applied to a wide range of substrates, including metals, ceramics, and plastics, making it a versatile surface protection technique. However, proper surface preparation and application parameters are crucial to ensure the quality and performance of the thermal spray coating.
The aerospace segment dominated the thermal spray wires market throughout the forecast period.
In the aerospace sector, thermal spray wire is extensively utilized in the production of thermal barrier coatings (TBCs) for turbine engine components. These coatings are applied to critical parts such as turbine blades and vanes to protect them from high temperatures encountered during engine operation. By using specialized thermal spray wires, engineers can tailor coatings to withstand extreme heat and thermal cycling, enhancing engine efficiency and longevity.
Asia-Pacific to maintain its dominance by 2033.
In countries such as China, Japan, South Korea, and India, thermal spray has extensive application in sectors such as aerospace, automotive, energy, and manufacturing. China, being one of the largest consumers of thermal spray wire in the region, utilizes it in the automotive industry for coating engine components to enhance wear resistance and corrosion protection. Additionally, the growing aerospace sector in China demands thermal spray coatings for turbine blades, combustion chambers, and other critical components, further driving the demand for thermal spray wire.
For Purchase Inquiry: https://www.alliedmarketresearch.com/thermal-spray-wire-market/purchase-options
Players: –

Astro Alloys Inc
THERMION
OC Oerlikon Management AG
Höganäs AB
Metallisation Limited
Polymet, Parat Tech
Flame Spray Technologies B.V.
Praxair S.T. Technology
Shanghai AlloTech Industrial Co., Ltd.

The report provides a detailed analysis of these key players in the global thermal spray wire market. These players have adopted different strategies such as new product launches, collaborations, expansion, joint ventures, agreements, and others to increase their market share and maintain dominant shares in different regions. The report is valuable in highlighting business performance, operating segments, product portfolio, and strategic moves of market players to showcase the competitive scenario.
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The post Thermal Spray Wire Market to Reach $1.9 Billion, Globally, by 2029 at 7.5% CAGR: Allied Market Research appeared first on HIPTHER Alerts.

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SUBBD and Luna PR Join Forces to Shape the Future of AI-Powered Content Creation

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 SUBBD, an AI-powered content creation platform designed to empower digital creators, is proud to announce its strategic partnership with Luna PR, a global marketing and communications agency specialising in web3 and emerging technologies. This collaboration aims to accelerate SUBBD’s mission of empowering digital creators by leveraging advanced AI and blockchain technology.
Luna PR will leverage its extensive web3 expertise to support SUBBD with comprehensive communications strategies, social media management, and targeted marketing campaigns. With a proven track record of over 600 successful projects since 2017 and a presence in four key global cities, Luna PR is uniquely positioned to elevate SUBBD’s brand presence and community engagement.
Maral Nouri, COO of Luna PR, stated: “As content creators ourselves, we understand the importance of staying ahead in today’s fast-paced digital landscape. Our partnership with SUBBD reflects this vision, empowering creators to effortlessly push boundaries and become trendsetters. SUBBD’s transformative platform equips creators with advanced AI tools to stay ahead of the curve, and we’re excited to support this evolution in content creation.”
Gabrielle Taylor, CEO of SUBBD, commented: “Partnering with Luna PR marks a significant step in our journey to transform the content creation industry. Luna PR’s expertise and strategic insights make them the ideal partner as we expand our platform and continue to support creators in maximising their potential through AI-powered solutions.”
SUBBD is transforming content creation with its AI-powered platform, designed to empower digital creators by enhancing autonomy, improving monetisation, and building deeper audience connections. By developing proprietary AI solutions, SUBBD is redefining how content is created, managed and monetised. With features like AI Personal Assistant, AI-driven content creation, blockchain security, and advanced analytics, SUBBD is pushing boundaries to help creators maximise their potential in the digital creator economy.
The post SUBBD and Luna PR Join Forces to Shape the Future of AI-Powered Content Creation appeared first on HIPTHER Alerts.

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[2024 Pujiang Innovation Forum] Highlights of WeStart2024

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As an integral part of the 17th Pujiang Innovation Forum, WeStart2024 was held at Dongjiao State Guest Hotel and Zhangjiang Science Hall, Shanghai from September 7 to 10. Under the theme of “Refactoring & Renewal”, this year’s conference focused on sci-tech entrepreneurship and investment, aiming to create a global entrepreneurship investment platform that bridges projects with capital. This platform leverages capital to bolster sci-tech innovation and economic transformation. The four-day event boasted two main forums, one symposium, 13 roadshow marathons, and multiple industry sharing sessions. Renowned investment agencies like CICC, Zero2IPO, and Shenzhen Capital Group were invited to delve into the innovative investment landscape, exploring avenues for global collaboration, building a new paradigm of entrepreneurship investment, and stimulating new drivers to sci-tech innovation.
Let’s review the highlights.
Shanghai has been fortifying its position as a global sci-tech innovation center by intensifying element concentration, enhancing functions and services, and cultivating a comprehensive sci-tech ecosystem. This has turned Shanghai into a heaven for entrepreneurship and a magnet for investment. WeStart2024 brought together government bodies, experts, scholars, venture firms at home and abroad, sci-tech businesses, and nearly 1,000 audience professionals to discuss entrepreneurship investment and create an ecosystem for sci-tech innovation together through diverse sci-tech innovation stakeholders, transforming this ecosystem from a strategic blueprint into reality.
On September 8, WeStart2024 kicked off with main forums, featuring 13 keynote speeches and two roundtable dialogues. Key sci-tech finance terms such as “patient capital”, “fundraising, investment, management and exit”, “investment in early-stage, small, long-term and hard technologies”, “angel investment”, and “high-quality development of the capital market” were frequently mentioned, becoming the focal point of discussions and highlighting the future development of sci-tech finance. The roundtable dialogues unveiled the latest sci-tech investment opportunities and delved into trends, current statuses, and strategies of sci-tech entrepreneurship investment amidst new situations and transformative environments.
The exhibition hall housed a Start-ups Exhibition Zone, showcasing nearly 20 TOP100 roadshow projects and products and the investment ecosystems and achievements of three to five leading venture firms through the linkage of the Entrepreneur Joint Exhibition Zone, the Investment Institution Zone, and the One-to-One Negotiation Zone. There were boards briefing on typical sci-tech businesses in the fields of biomedicine and AI. Social scenes for entrepreneurship investment were also offered to facilitate direct communication between projects and investors.
WeStartTOP100, a new addition to the Startup in Shanghai International Innovation and Entrepreneurship Competition, was launched in June. It selected 100 projects from over 2,000 global entries for on-site roadshows during the conference. The four-day event featured 13 marathon project roadshows with over 100 projects, focusing on six key areas: three in hard tech—biomedicine, artificial intelligence, and advanced manufacturing—and three in future industries—future information, future materials, and future energy.
A special roadshow for universities was also held, where Shanghai-based universities, including Shanghai Jiao Tong University, ShanghaiTech University, University of Shanghai for Science and Technology, Shanghai University of Engineering Science, Shanghai Ocean University, East China Normal University, Shanghai University, and Shanghai Polytechnic University, displayed high-quality research projects. Focusing on exchanges and investment and financing matchmaking in cutting-edge interdisciplinary areas and core technologies in key fields, this roadshow further propelled the commercialization of S&T outcomes in universities. The special roadshow for Hong Kong University of Science and Technology introduced top-notch innovative projects from Hong Kong universities to Shanghai, fostering a new chapter for sci-tech cooperation between the two cities.
In particular, the conference prioritized global vision and international cooperation. During the international roadshow, high-quality projects from countries and regions like France, Germany, Hungary, Zimbabwe, and Morocco, as well as Hong Kong (China), were selected to compete. This facilitated interaction between domestic and foreign entrepreneurship investment resources and explored new paths for global collaboration. A 365-day “never-ending” global entrepreneurship investment cooperation and matchmaking mechanism was established to effectively link international sci-tech innovation talent, technology, capital, and market, empowering the sound development of sci-tech entrepreneurship investment.
Furthermore, the conference collaborated with leading players in entrepreneurship investment, Shanghai State-owned Capital Investment Co., Ltd. and CICC Capital, to open special roadshows. Leveraging the expertise and resources of investment agencies, these roadshows directly linked both sides of entrepreneurship investment, working with numerous sci-tech players on-site to explore high-quality projects and fully support entrepreneurs.
The post [2024 Pujiang Innovation Forum] Highlights of WeStart2024 appeared first on HIPTHER Alerts.

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Tata Electronics and Tokyo Electron Limited (TEL) Announce Strategic Partnership to Grow Semiconductor Ecosystem in India

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Tata Electronics today signed a memorandum of understanding with Tokyo Electron Limited (TEL), a leading global supplier of semiconductor equipment and services. The two companies will collaborate to accelerate semiconductor equipment infrastructure for India’s first Fab being built by Tata Electronics in Dholera, Gujarat, and for its assembly and test facility in Jagiroad, Assam.
Through this partnership, Tata Electronics and TEL will also focus on training Tata Electronics’ workforce on TEL equipment and supporting ongoing improvement and R&D initiatives. This collaboration will leverage the strengths of both companies to establish a robust semiconductor manufacturing ecosystem in India.
As previously announced, Tata Electronics is building India’s first Fab in Dholera, Gujarat, with a total investment of INR 91,000 crores (~US$11bn). In addition, another INR 27,000 crores (~US$3bn) will be invested in a greenfield facility in Jagiroad, Assam, for the assembly and testing of semiconductor chips. Together, these facilities will produce semiconductor chips for applications across automotive, mobile devices, artificial intelligence (AI), and other key segments to serve customers globally. As the construction of these facilities progresses, it is critical to grow partnerships across the entire semiconductor ecosystem, spanning process and design technology, as well as equipment suppliers. With this announcement of the partnership with TEL, Tata Electronics has solidified a critical pillar to achieve its execution targets.
Dr Randhir Thakur, Managing Director & CEO, Tata Electronics, said, “We have a bold vision of becoming a leader in electronics manufacturing by offering integrated solutions across the value chain to our global customers. TEL has a history of working closely with its customers, and its expertise in the semiconductor equipment space will help build a dynamic ecosystem to support the timely execution of bringing up our Fab and advanced packaging factories. We are excited about the customer centricity that TEL brings to this partnership.”
Toshiki Kawai, President & CEO of Tokyo Electron Limited, emphasised, “We are delighted to announce our partnership with Tata Electronics, which brings together our combined expertise and resources to strengthen the semiconductor ecosystem in India significantly. This strategic collaboration spans both front-end fabrication and back-end packaging technologies, highlighting our commitment to delivering exceptional support and value to Tata Electronics. By leveraging our collective strengths, we aim to accelerate development and drive innovation across multiple technology nodes. Together, we are poised to set new benchmarks in the industry, fostering a robust and dynamic semiconductor landscape that will benefit all stakeholders.”
TEL is committed to supporting the Indian semiconductor ecosystem. Both the front-end and back-end product groups will provide resources and technology support to bring advanced TEL products to the Indian market. TEL will lead this effort by also offering diversified products for the MAGIC market (MAGIC—Metaverse, Autonomous Mobility, Green Energy, IoT & Information, Communications). TEL will actively explore opportunities to leverage India’s talent to establish an engineering service in India to support its global product development.
The post Tata Electronics and Tokyo Electron Limited (TEL) Announce Strategic Partnership to Grow Semiconductor Ecosystem in India appeared first on HIPTHER Alerts.

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