Readyverse Studios, a leading next-gen game publisher, proudly unveils Promptopia, an AI-powered generative creation tool that brings unmatched creative possibilities to the digital world. Making its debut at the Blockworks tech conference Permissionless III, Promptopia is an innovative sandbox experience where players can bring their imaginations to life by creating game-ready objects, environments, music, and more with the simplest of text prompts.
Unlocking  a new level of digital creativity, Promptopia combines multiplayer gameplay with real-time AI asset generation allowing users to build, share, and play in a world shaped by their own ideas. By harnessing the latest in AI technology, Promptopia shatters the boundaries between creators and players, transforming anyone into a game designer with ease.

Promptopia provides players with limitless creative freedom, integrating AI tools in real time to generate 3D assets and environments within The Readyverse platform, which already includes a variety of globally recognized IP, such as Reebok, Cool Cats, DeLorean and Ready Player One. From stunning scenery to interactive objects, Promptopia opens a world of possibilities in a social, collaborative virtual environment. 
“Promptopia is a new experimental game experience that allows us to see how generative AI and game mechanics can come together in interesting ways,” said Readyverse Studios Co-Founders Aaron McDonald and Shara Senderoff. “Promptopia builds the groundwork for the UGC experience in The Readyverse. We’re giving players the ability to make what’s in their mind an immediate reality, and have prompt engineering become part of a deeper immersive gameplay experience. We’ve prioritized creativity and fun at the core so the interactive user experience can be appreciated by every gamer as they bring their imaginations to life through gameplay. It’s a blank canvas waiting for your ideas to be incorporated.”
While many tech giants are exploring the possibilities of AI, Promptopia from Readyverse Studios sets a new standard by offering an unparalleled level of integration within gameplay. As part of The Readyverse ecosystem, and using the novel “Altered State” generative 3D model developed by Futureverse and music AI platform Jen, players can generate real-time, game-ready assets, environments, and soundtracks through simple text prompts. Promptopia is designed to democratize game creation, allowing anyone to become a creator regardless of their technical skill level.
The post The Readyverse Debuts AI Tool “Promptopia” for Limitless Creativity in Gaming appeared first on HIPTHER Alerts.

AI servers, driven by Nvidia’s GB200 superchip, have experienced significant growth. The cutting-edge B200 chip, due to its high thermal design power, requires direct-to-chip cooling. Supermicro announced that it had shipped over 2000 direct-liquid-cooled AI server racks by the end of August 2024, and it has expanded its manufacturing capacity to 5000 racks per month. Supermicro reported that it has around 75% of the liquid-cooled AI server rack market, and IDTechEx believes that this production capacity expansion will lead to a surge in liquid-cooled server racks, as well as the number of cold plates. The projections for the number of cold plates for AI servers in IDTechEx’s new report, “Thermal Management for Data Centers 2025-2035: Technologies, Markets, and Opportunities”, align with Supermicro’s latest announcement.
IDTechEx believes that this production capacity expansion is expected to drive a rapid increase in the deployment of liquid-cooled racks across the AI and high-performance computing (HPC) sectors, along with a notable rise in the use of cold plates. Cold plates are integral to direct-liquid-cooling systems, as they are responsible for absorbing and dissipating the significant heat generated by high-performance chips like Nvidia’s B200. IDTechEx’s recent research into thermal management for data centers echoes Supermicro’s projections, highlighting the increasing importance of liquid cooling technologies in managing the heat loads associated with next-generation AI and HPC hardware.
Direct-to-chip (D2C) cooling, also known as cold plate cooling, is a sophisticated cooling method wherein a cold plate is mounted directly onto the chip (GPU or CPU). The plate facilitates the transfer of heat from the chip to a circulating coolant, which then dissipates the heat. D2C cooling can be divided into two main categories: single-phase and two-phase systems, depending on the type of coolant used. Single-phase D2C typically uses a water-glycol mixture, which circulates through the system and transfers heat away from the chip via convection. This type of cooling is efficient for systems with moderate TDPs, as the coolant remains in a liquid state throughout the process. In contrast, two-phase D2C cooling uses a coolant like fluorinated refrigerant, which absorbs heat through a phase change. As the coolant transitions from liquid to gas, it provides significantly greater cooling power, making it well-suited for systems with extremely high TDPs.
The rapid increase in chip TDPs is driving the demand for more advanced cooling solutions. AI and HPC applications, in particular, are pushing the limits of current cooling technologies, as these workloads require chips with significantly higher power consumption to handle complex computations. Nvidia’s GPU roadmap, combined with Intel’s recent announcement of its Falcon Shores GPU – expected to have a TDP of 1,500W – suggests that GPUs and CPUs with TDPs exceeding 1,500W likely become common within the next one to two years. IDTechEx predicts that this ongoing rise in TDP will eventually lead to a shift from single-phase to two-phase D2C cooling systems, as the latter offers superior heat dissipation capabilities required for these high-power chips despite the unclear timeline.
In addition to direct-to-chip cooling, immersion cooling has garnered significant attention as an alternative solution for high-performance systems. Similar to D2C, immersion cooling can be split into two categories: single-phase immersion cooling (1-PIC) and two-phase immersion cooling (2-PIC). However, unlike D2C, immersion cooling involves submerging the entire server into a bath of coolant, which absorbs heat directly from all components. This method is highly effective for cooling densely packed systems with high power requirements, as it eliminates the need for air-based cooling entirely. In single-phase immersion cooling, the coolant remains in a liquid state, similar to single-phase D2C. Two-phase immersion, however, leverages a phase change in the coolant, similar to two-phase D2C, to provide even more efficient heat dissipation.
While immersion cooling offers numerous advantages in terms of thermal efficiency, it comes with several challenges. The process of submerging servers requires extensive retrofitting of existing infrastructure, as well as rigorous material compatibility tests to ensure that the components can withstand prolonged exposure to the coolant. This results in higher upfront costs compared to D2C cooling systems. Additionally, immersion cooling systems, especially two-phase variants, face regulatory challenges. For example, 3M’s Novec products, commonly used as two-phase coolants, are set to be discontinued by the end of 2025. As of now, no PFAS-free or “forever chemical”-free two-phase coolants have been officially announced, adding another layer of complexity for companies considering immersion cooling solutions.
Cooling in data centers occurs at various levels, ranging from chip-level to facility-level cooling. Each level requires different cooling strategies, with technologies like D2C and immersion cooling primarily focusing on chip, server, and rack-level thermal management. At the room and facility levels, air-based cooling remains the most common approach in 2024. Computer room air conditioning (CRAC) units and computer room air handling (CRAH) units are widely used to cool entire server rooms or data center floors. However, the growing heat loads generated by high-performance AI and HPC systems are pushing the limits of air cooling, prompting the adoption of more efficient liquid-based solutions.
One such solution is liquid-to-liquid (L2L) cooling, which is becoming increasingly popular for facility-level heat management. In L2L cooling, a cooling distribution unit (CDU) transfers heat from one liquid loop to another, enhancing heat exchange efficiency. This system is particularly effective for data centers dealing with higher heat loads from AI and HPC workloads. Supermicro’s CEO has predicted that liquid-cooled data centers, which currently represent around 1% of the market, will grow to 30% by 2026. IDTechEx shares this optimistic outlook, noting that while L2L cooling is gaining traction, its widespread adoption will likely be concentrated in newly constructed data centers due to the significant retrofitting required for existing facilities. However, many existing data centers, particularly those using CRAH units, already have facility water systems in place, which can be leveraged for L2L cooling retrofits. These existing water systems are often the starting point for upgrading older data centers to accommodate more advanced liquid cooling technologies.
In conclusion, the rapid rise of AI and HPC applications is driving a fundamental shift in data center cooling strategies. As chips like Nvidia’s B200 and Intel’s Falcon Shores GPU push the limits of thermal design power, direct-to-chip and immersion cooling solutions are becoming critical to managing the heat loads in modern data centers. This unprecedented transition brings significant opportunities to players in the data center cooling value chain, including but not limited to coolant suppliers, server makers, system integrators, cold plate manufacturers, materials suppliers, and cooling equipment (e.g., HVAC) suppliers. More details about the opportunities can be found in IDTechEx’s latest research report, “Thermal Management for Data Centers 2025-2035: Technologies, Markets, and Opportunities”.
The post The Rise of AI Drives 9 Fold Surge in Liquid Cooling Technology appeared first on HIPTHER Alerts.

 
OTM Mumbai has been named the #1 travel trade show in India and Asia in a customised market research study commissioned by Fairfest Media Limited which was conducted by NielsenIQ – the world’s leading consumer intelligence company. The customised research, conducted among participants and visitors who have attended two or more travel trade shows in the region, found a ‘significantly higher quantum of respondents stating OTM (Mumbai) to be the leading show at a National, Regional and Asia level’ — outperforming other major shows in the region, including ITB Asia, ITB India and SATTE Delhi.
The comprehensive survey evaluated 18 international travel trade shows across Asia and 20 regional shows in India. In addition to identifying the leading travel trade show, the survey highlighted key findings related to exhibitors’ and visitors’ overall experience, satisfaction, and willingness to attend again.
Key Survey Findings:

OTM as the Top Trade Show in India: 59% of respondents across India selected OTM as their preferred trade show, a significantly higher percentage than any other event in the country.
Leadership in Asia: In the broader Asia-wide context, OTM secured 42% of the vote, significantly higher than other events in Asia, further reinforcing its position as a market leader.
Exhibitor and Visitor Satisfaction: OTM outperformed its competitors in terms of satisfaction with the quality of exhibits and the profile of visitors.
Venue Quality: OTM garnered ‘significantly higher satisfaction regarding the quality of the venue across all competition on Top Box Satisfaction,’ says the customised study conducted by NielsenIQ & commissioned by Fairfest Media.

The survey extensively covered several granular aspects of satisfaction, including the quality of exhibits, the profile of visitors, the relevance of speakers and conference sessions, and the quality of venue and other services. A copy of the report submitted to Fairfest Media by NielsenIQ is available here. (link)
The fieldwork by NielsenIQ is done in an unbiased manner without intervention from Fairfest Media Limited and quality control procedures were followed strictly. The date of the fieldwork is 2nd Aug to 4th Sept 2024. The areas covered in the customised study (conducted by NielsenIQ & commissioned by Fairfest Media) include India, Vietnam, Bangladesh, Singapore, Sri Lanka, Nepal, United Kingdom, Kenya, Bahrain, Thailand, Maldives, Rwanda, Greece, Malaysia, Seoul, Philippines, Ethiopia, Nigeria and South Africa. The population covered includes exhibitors and visitors of travel trade shows. The sample size was overall (N=312); exhibitors (N=23), visitors (N=289). The total usable database of visitors shared with NielsenIQ was over 14,000 and of exhibitors was over 2,200. The sampling method was online, purposive sampling.
These findings confirm that OTM consistently delivers high-quality buyers and offers the highest return on investment (ROI) for participants. The survey results reinforce OTM’s status as the leading B2B show in Asia for travel industry professionals.The next edition of OTM, from 30 January to 1 February 2025, at the Jio World Convention Centre in Mumbai, is expected to be the largest ever, further strengthening its substantial lead in both the country and the region, according to the organisers. It will bring together over 40,000 travel industry professionals from over 60 countries, with pre-qualified buyers from India, Asia and beyond.
The post OTM recognised as the ‘Leading Travel Trade Show in India and Asia’, in a customised study by NielsenIQ commissioned by Fairfest Media appeared first on HIPTHER Alerts.