Artificial Intelligence
The global market for Photonic Integrated Circuit (PIC) is projected to reach US$3.1 billion by 2025
New York, Nov. 03, 2020 (GLOBE NEWSWIRE) — Reportlinker.com announces the release of the report “Global Photonic Integrated Circuit (PIC) Industry” – https://www.reportlinker.com/p03646045/?utm_source=GNW
The growing opportunity in optical communications therefore bodes well for the growth of PICs. Optical communication, also known as optical telecommunication, is growing in popularity driven by factors such as demand for faster internet broadband speeds, ubiquity of data communications networks, and growing use of bandwidth intensive applications such as provision of high speed internet (HSI) and triple play bundled services that includes voice, data, and video streaming. Investments in optical network infrastructures are therefore witnessing robust gains. In addition to telecommunication service providers and MNOs, even companies are rapidly shifting to fibre-optic enabled enterprise networks to handle ever-increasing big data loads and leverage benefits of technologies like IoT, cloud and artificial intelligence. While migration from copper wires to optical fibre access networks begins to mature, there is currently a strong undercurrent of change in the optical networking industry. The industry is witnessing a shift from Passive Optical Networks (PON) technology to Active Optical Network (AON). PON technology utilizes optical splitters to separate light signals of different wavelengths as they are transmitted through the network. AON, on the other hand, utilizes electrical switching equipment like routers, switch aggregator, amplifiers and repeaters, for signal distribution, management and delivery.
Increased deployment of agile optical networks (AON) by network service providers is expected to open up new opportunities for the use of PICs in enabling dynamic scaling of network infrastructures in response to fluctuating data traffic. Few of the factors that will help widen the application and adoption of PICs include breakthroughs in the development of application specific photonic integrated circuits (ASPICs) for new generation optoelectronic devices; innovations in fabrication technologies of ASPICs; surging investments in advanced telecom infrastructure; progressive improvements in photonic integration with conventional technology processes; emphasis on optical signal processing in fiber optic networks; high tide in Wi-Fi equipment installations; and emerging era of quantum computing, among others.
Integration of silicon photonics devices with traditional electronics will unleash new opportunities in on-chip and on-board communication; chip-to-chip interconnections; optical sensing and biophotonics. As we inch closer to exascale computing, optical interconnections will offer an alternative to the otherwise dense network of copper interconnections that will be needed. Photonic Integrated Circuit (PIC) integrates multiple photonic functions and hence is more suitable for exascale processing. While electronic integrated circuits are dense, they can never match the speed offered by PICs. PICs have higher bandwidth; higher levels of immunity to electromagnetic interference; and are compatible with current CMOS fabrication technologies. A PIC comprises of optical devices such as modulators, optical amplifiers, lasers and multiplexers. Asia-Pacific including China is a major market led by developing telecom and electronics industries and rapid shift of the global semiconductor manufacturing base to Southeast Asian countries.
Read the full report: https://www.reportlinker.com/p03646045/?utm_source=GNW
I. INTRODUCTION, METHODOLOGY & REPORT SCOPE
II. EXECUTIVE SUMMARY
1. MARKET OVERVIEW
An Introduction to Photonic Integrated Circuit (PIC)
Materials Used in Making PIC
Integration Models for PIC
Applications
Photonic Integrated Circuit (PIC): Current Market Scenario and
Outlook
Indium Phosphide: Largest & Fastest Growing Material Type
Silicon Substrates Remain in Contention
Hybrid Integration: The Widely Used PIC Fabrication Method
Monolithic Integration Emerges as Fastest Growing Fabrication
Approach
COMPETITIVE LANDSCAPE
Photonic Integrated Circuit (PIC): Fragmented Marketplace
Photonic Integrated Circuit (PIC) Competitor Market Share
Scenario Worldwide (in %): 2020
Recent Market Activity
Impact of Covid-19 and a Looming Global Recession
2. FOCUS ON SELECT PLAYERS
3. MARKET TRENDS & DRIVERS
Optical Communications: Largest Application Market for PIC
Key Trends Influencing the Uptake of PICs in Optical
Communication Space
Soaring Deployments of 100G & Ultra-100G OTNs
Growing Uptake of FTTx Networks
Growing Bandwidth Needs Bring Fiber Optic Networks to the Fore,
Steering PIC Demand
Global IP Traffic Volume in Exabytes for the Years 2019 and 2022
Global IP Traffic Scenario (2019): Percentage Breakdown of Data
Usage by Consumer Segment
A Note on Factors Influencing IP Traffic Growth & Bandwidth Needs
Sharp Increase in Number of Internet Subscribers
Breakdown of Number of Internet Users Worldwide, by Region
(in Millions): H1 2019
High Penetration of IP-enabled Devices
Smartphone Adoption Worldwide by Region (in %): 2018 & 2025
Number of Smartphone Users Worldwide (in Billion): 2016-2022
Global Wireless Communication Market (2018 & 2020): Percentage
Breakdown of Traffic Volume by Mobile Device Type
Faster Broadband Speeds
Proliferation of Bandwidth-Intensive Applications
Breakdown of Global IP Traffic by Application Type (in %): 2019 &
2022
Infrastructure Verticals Where Telecom Investments Continue to
Remain High
Long-Haul Networks
Metropolitan Area Networks (MANs)
Access Networks
Optical Signal Processing Emerges as Fastest Growing
Application Segment
Biophotonics: A Niche Market Segment for PIC
Global Biophotonics Market (2019): Percentage Breakdown of
Revenues by Geographic Region
Expanding Application Base for Biophotonics Generates Parallel
Opportunities for PIC
Increased Focus on Optical In-Vitro Diagnostics Augurs Well
Northbound Trajectory in Fiber Optic Sensors Vertical Gives
Impetus to Market Expansion
Global Fiber Optic Sensors Market (2019 & 2024): Breakdown of
Sales in US$ Million by Geographic Region
Expanding Role of DCI in Data Centers Creates Potential Market
Opportunities
Major Data Center Trends Influencing DCI Implementations
Rapid Growth in Data Center Traffic
Data Center New Floor Space Capacity Additions (in ?000 Sq. ft.)
Worldwide for the Years 2013, 2015, 2017, and 2019
Sharp Expansion in Cloud Data Center
Global Data Center Traffic Scenario (2018, 2020 & 2022):
Percentage Breakdown of Data Center Traffic by Equipment Type
Global Cloud Data Center Market (2018 & 2022): Percentage
Breakdown of Data Center Traffic by Cloud Type
Transition towards Data Center Consolidation
Growing Role of Virtualization
High Tide in Wi-Fi Equipment Installations Bodes Well
Smart Cities Concept to Underpin Sales Growth in the Coming Years
World Smart City Investments (in US$ Billion) for the Years
2018 through 2025
Breakdown of World Smart City Investments (in %) by Country/
Region for the Year 2019
Smart Homes to Drive Demand for PICs
Global Smart Homes Market (In US$ Billion) for the Years 2019,
2021, 2023 & 2025
Upcoming Quantum Computing Model to Infuse New Growth
Opportunities
Economic Unviability of Electronic IC in OEO Conversion Puts
Focus on Photonic IC
Photonic IC vs. Electronic IC: A Brief Comparative Analysis
Reduced Number of Optical Packages & Decreased Need for Fiber
Coupling Enhance the Image of PIC
Technology Innovations: Key to High Growth and Consistent Demand
Next Generation Silicon Photonics & Polymer Based Photonic ICs
Enhance Speed, Bandwidth and Scalability
Collaborative Initiatives Foster Development of Innovative
Products
4. GLOBAL MARKET PERSPECTIVE
Table 1: World Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region – USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa Markets – Independent Analysis of Annual Sales in
US$ Million for Years 2020 through 2027
Table 2: World 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Geographic Region – Percentage Breakdown of
Value Sales for USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets for
Years 2020 & 2027
Table 3: World Current & Future Analysis for Hybrid Integration
by Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 4: World 7-Year Perspective for Hybrid Integration by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 5: World Current & Future Analysis for Monolithic
Integration by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 6: World 7-Year Perspective for Monolithic Integration by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 7: World Current & Future Analysis for Module Integration
by Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 8: World 7-Year Perspective for Module Integration by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 9: World Current & Future Analysis for Indium Phosphide
(InP) by Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 10: World 7-Year Perspective for Indium Phosphide (InP)
by Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 11: World Current & Future Analysis for
Silicon-on-Insulator (SOI) by Geographic Region – USA, Canada,
Japan, China, Europe, Asia-Pacific, Latin America, Middle East
and Africa Markets – Independent Analysis of Annual Sales in
US$ Million for Years 2020 through 2027
Table 12: World 7-Year Perspective for Silicon-on-Insulator
(SOI) by Geographic Region – Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2020 & 2027
Table 13: World Current & Future Analysis for Gallium Arsenide
(GaAs) by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 14: World 7-Year Perspective for Gallium Arsenide (GaAs)
by Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 15: World Current & Future Analysis for Silicon (Si) by
Geographic Region – USA, Canada, Japan, China, Europe,
Asia-Pacific, Latin America, Middle East and Africa Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 16: World 7-Year Perspective for Silicon (Si) by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 17: World Current & Future Analysis for Other Raw
Materials by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 18: World 7-Year Perspective for Other Raw Materials by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 19: World Current & Future Analysis for Optical
Communications by Geographic Region – USA, Canada, Japan,
China, Europe, Asia-Pacific, Latin America, Middle East and
Africa Markets – Independent Analysis of Annual Sales in US$
Million for Years 2020 through 2027
Table 20: World 7-Year Perspective for Optical Communications
by Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
Table 21: World Current & Future Analysis for Optical Signal
Processing by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 22: World 7-Year Perspective for Optical Signal
Processing by Geographic Region – Percentage Breakdown of Value
Sales for USA, Canada, Japan, China, Europe, Asia-Pacific,
Latin America, Middle East and Africa for Years 2020 & 2027
Table 23: World Current & Future Analysis for Other
Applications by Geographic Region – USA, Canada, Japan, China,
Europe, Asia-Pacific, Latin America, Middle East and Africa
Markets – Independent Analysis of Annual Sales in US$ Million
for Years 2020 through 2027
Table 24: World 7-Year Perspective for Other Applications by
Geographic Region – Percentage Breakdown of Value Sales for
USA, Canada, Japan, China, Europe, Asia-Pacific, Latin America,
Middle East and Africa for Years 2020 & 2027
III. MARKET ANALYSIS
GEOGRAPHIC MARKET ANALYSIS
UNITED STATES
The United States: Largest Market for PIC Solutions
Telecom Industry?s Focus on High-Speed Fiber Networks Builds
Momentum
Fiber Optic Deployments Register Steady Growth
Fiber Optics Industry Benefits from Telecom Regulatory Act, 1996
Percentage (%) of Population Covered by Fiber Networks in
Select States
Novel Use Case of Biophotonics in Medical Devices Augurs Well
Mainstream Image of Fiber Optic Sensors to Underpin Market
Expansion
Market Analytics
Table 25: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Technique – Hybrid Integration, Monolithic
Integration and Module Integration – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 26: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 27: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Raw Material – Indium Phosphide (InP),
Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon
(Si) and Other Raw Materials – Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027
Table 28: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 29: USA Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Application – Optical Communications, Optical
Signal Processing and Other Applications – Independent Analysis
of Annual Sales in US$ Million for the Years 2020 through 2027
Table 30: USA 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
CANADA
Uptrend in the Telecom Sector Encourages PIC Market
Growing Use of Fiber Optic Sensors Revs Up PIC Demand
Market Analytics
Table 31: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 32: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 33: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 34: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 35: Canada Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 36: Canada 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
JAPAN
Being a Major Fiber Optics Consumer, Japan Continues to Extend
Opportunities
Market Analytics
Table 37: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 38: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 39: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 40: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 41: Japan Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 42: Japan 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
CHINA
China Emerges as the Fastest Growing Regional Market
Uptrend in Fiber Optic Deployments Enthuses PIC Market in China
Increased Adoption of Fiber Optic Sensors Infuses Market Momentum
Sensors Manufacturing Scenario in China
Market Analytics
Table 43: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 44: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 45: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 46: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 47: China Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 48: China 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
EUROPE
Stable Expansion in Fiber Optic Networks Bodes Well for PIC
Market in Europe
Healthy Home Entertainment Sector Spurs Demand for Fiber Optic
Networks
Household Penetration of FTTH & FTTB (in %) in Select European
Countries: 2019
Market Analytics
Table 49: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region – France,
Germany, Italy, UK, Spain, Russia and Rest of Europe Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 50: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Geographic Region – Percentage Breakdown of
Value Sales for France, Germany, Italy, UK, Spain, Russia and
Rest of Europe Markets for Years 2020 & 2027
Table 51: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 52: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 53: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 54: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 55: Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 56: Europe 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
FRANCE
Table 57: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 58: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 59: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 60: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 61: France Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 62: France 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
GERMANY
Table 63: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 64: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 65: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 66: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 67: Germany Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 68: Germany 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
ITALY
Table 69: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 70: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 71: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 72: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 73: Italy Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 74: Italy 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
UNITED KINGDOM
Robust Expansion on the Cards amid Soaring Investments on Fiber
Optic Networks
Market Analytics
Table 75: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Technique – Hybrid Integration, Monolithic
Integration and Module Integration – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 76: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Technique – Percentage Breakdown of Value Sales for
Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 77: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Raw Material – Indium Phosphide (InP),
Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs), Silicon
(Si) and Other Raw Materials – Independent Analysis of Annual
Sales in US$ Million for the Years 2020 through 2027
Table 78: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Raw Material – Percentage Breakdown of Value Sales for
Indium Phosphide (InP), Silicon-on-Insulator (SOI), Gallium
Arsenide (GaAs), Silicon (Si) and Other Raw Materials for the
Years 2020 & 2027
Table 79: UK Current & Future Analysis for Photonic Integrated
Circuit (PIC) by Application – Optical Communications, Optical
Signal Processing and Other Applications – Independent Analysis
of Annual Sales in US$ Million for the Years 2020 through 2027
Table 80: UK 7-Year Perspective for Photonic Integrated Circuit
(PIC) by Application – Percentage Breakdown of Value Sales for
Optical Communications, Optical Signal Processing and Other
Applications for the Years 2020 & 2027
SPAIN
Table 81: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 82: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 83: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 84: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 85: Spain Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 86: Spain 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
RUSSIA
Table 87: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 88: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Technique – Percentage Breakdown of Value
Sales for Hybrid Integration, Monolithic Integration and Module
Integration for the Years 2020 & 2027
Table 89: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 90: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Raw Material – Percentage Breakdown of Value
Sales for Indium Phosphide (InP), Silicon-on-Insulator (SOI),
Gallium Arsenide (GaAs), Silicon (Si) and Other Raw Materials
for the Years 2020 & 2027
Table 91: Russia Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 92: Russia 7-Year Perspective for Photonic Integrated
Circuit (PIC) by Application – Percentage Breakdown of Value
Sales for Optical Communications, Optical Signal Processing and
Other Applications for the Years 2020 & 2027
REST OF EUROPE
Table 93: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 94: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Technique – Percentage Breakdown of
Value Sales for Hybrid Integration, Monolithic Integration and
Module Integration for the Years 2020 & 2027
Table 95: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Raw Material – Indium Phosphide
(InP), Silicon-on-Insulator (SOI), Gallium Arsenide (GaAs),
Silicon (Si) and Other Raw Materials – Independent Analysis of
Annual Sales in US$ Million for the Years 2020 through 2027
Table 96: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Raw Material – Percentage Breakdown
of Value Sales for Indium Phosphide (InP), Silicon-on-Insulator
(SOI), Gallium Arsenide (GaAs), Silicon (Si) and Other Raw
Materials for the Years 2020 & 2027
Table 97: Rest of Europe Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Application – Optical
Communications, Optical Signal Processing and Other
Applications – Independent Analysis of Annual Sales in US$
Million for the Years 2020 through 2027
Table 98: Rest of Europe 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Application – Percentage Breakdown
of Value Sales for Optical Communications, Optical Signal
Processing and Other Applications for the Years 2020 & 2027
ASIA-PACIFIC
Healthy Trajectory in Telecommunications Sector Augurs Well
Pan Asian Continental Terrestrial Fiber Optic Network
A Note on Submarine Cables in Asia
Market Analytics
Table 99: Asia-Pacific Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Geographic Region – Australia,
India, South Korea and Rest of Asia-Pacific Markets –
Independent Analysis of Annual Sales in US$ Million for Years
2020 through 2027
Table 100: Asia-Pacific 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Geographic Region – Percentage
Breakdown of Value Sales for Australia, India, South Korea and
Rest of Asia-Pacific Markets for Years 2020 & 2027
Table 101: Asia-Pacific Current & Future Analysis for Photonic
Integrated Circuit (PIC) by Technique – Hybrid Integration,
Monolithic Integration and Module Integration – Independent
Analysis of Annual Sales in US$ Million for the Years 2020
through 2027
Table 102: Asia-Pacific 7-Year Perspective for Photonic
Integrated Circuit (PIC) by Technique – Percentage Breakdown of
Value Sales for Hybrid Integration, Monolithic Integration and
Module Integration for the Years 2020 & 2027
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Artificial Intelligence
$10 million Artificial Intelligence Mathematical Olympiad Prize appoints further advisory committee members
D. Sculley, Kevin Buzzard, Leo de Moura, Lester Mackey and Peter J. Liu appointed to the advisory committee for the Artificial Intelligence Mathematical Olympiad Prize.
LONDON, April 26, 2024 /PRNewswire/ — XTX Markets’ newly created Artificial Intelligence Mathematical Olympiad Prize (‘AIMO Prize’) is a $10mn challenge fund designed to spur the creation of a publicly shared AI model capable of winning a gold medal in the International Mathematical Olympiad (IMO).
XTX Markets is delighted to announce the appointment of five further advisory committee members. This group brings great expertise in machine learning, including D. Sculley, the CEO of Kaggle; Lester Mackey, a Principal Researcher at Microsoft Research and a Macarthur Fellow; and Peter J. Liu, a research scientist at Google DeepMind.
Prolific mathematicians Kevin Buzzard, who achieved a perfect score in the International Mathematical Olympiad, and Leo De Moura who is the Chief Architect for Lean, the automated reasoning tool, also join the advisory group.
They join the existing advisory committee members Terence Tao and Timothy Gowers, both winners of the Fields Medal, as well as Dan Roberts, Geoff Smith and Po-Shen Loh.
The AIMO Advisory Committee will support the development of the AIMO Prize, including advising on appropriate protocols and technical aspects, and designing the various competitions and prizes.
Simon Coyle, Head of Philanthropy at XTX Markets, commented:
“We are thrilled to complete the AIMO Advisory Committee with the appointments of D., Kevin, Leo, Lester and Peter. Together, they have enormous experience in machine learning and automated reasoning and are already bringing expertise and wisdom to the AIMO Prize. We look forward to announcing the winners of the AIMO’s first Progress Prize soon, and then publicly sharing the AI models to support the open and collaborative development of AI.”
Further information on the AIMO Prize
There will be a grand prize of $5mn for the first publicly shared AI model to enter an AIMO approved competition and perform at a standard equivalent to a gold medal in the IMO. There will also be a series of progress prizes, totalling up to $5mn, for publicly shared AI models that achieve key milestones towards the grand prize.
The first AIMO approved competition opened to participants in April 2024 on the Kaggle competition platform. The first progress prize focuses on problems pitched at junior and high-school level maths competitions. There is a total prize pot of $1.048m for the first progress prize, of which at least $254k will be awarded in July 2024, There will be a presentation of progress held in Bath, England in July 2024, as part of the 65th IMO.
For more information on the AIMO Prize visit: https://aimoprize.com/ or the competition page on Kaggle: https://www.kaggle.com/competitions/ai-mathematical-olympiad-prize/
Advisory Committee member profiles:
D. Sculley
D. is the CEO at Kaggle. Prior to joining Kaggle, he was a director at Google Brain, leading research teams working on robust, responsible, reliable and efficient ML and AI. In his career in ML, he has worked on nearly every aspect of machine learning, and has led both product and research teams including those on some of the most challenging business problems. Some of his well-known work involves ML technical debt, ML education, ML robustness, production-critical ML, and ML for scientific applications such as protein design.
Kevin Buzzard
Kevin a professor of pure mathematics at Imperial College London, specialising in algebraic number theory. As well as his research and teaching, he has a wide range of interests, including being Deputy Head of Pure Mathematics, Co-Director of a CDT and the department’s outreach champion. He is currently focusing on formal proof verification, including being an active participant in the Lean community. From October 2024, he will be leading a project to formalise a 21st century proof of Fermat’s Last Theorem. Before joining Imperial, some 20 years ago, he was a Junior Research Fellow at the University of Cambridge, where he had previously been named ‘Senior Wrangler’ (the highest scoring undergraduate mathematician). He was also a participant in the International Mathematical Olympiad, winning gold with a perfect score in 1987. He has been a visitor at the IAS in Princeton, a visiting lecturer at Harvard, has won several prizes both for research and teaching, and has given lectures all over the world.
Leo de Moura
Leo is a Senior Principal Applied Scientist in the Automated Reasoning Group at AWS. In his spare time, he dedicates himself to serving as the Chief Architect of the Lean FRO, a non-profit organization that he proudly co-founded alongside Sebastian Ullrich. He is also honoured to hold a position on the Board of Directors at the Lean FRO, where he actively contributes to its growth and development. Before joining AWS in 2023, he was a Senior Principal Researcher in the RiSE group at Microsoft Research, where he worked for 17 years starting in 2006. Prior to that, he worked as a Computer Scientist at SRI International. His research areas are automated reasoning, theorem proving, decision procedures, SAT and SMT. He is the main architect of several automated reasoning tools: Lean, Z3, Yices 1.0 and SAL. Leo’s work in automated reasoning has been acknowledged with a series of prestigious awards, including the CAV, Haifa, and Herbrand awards, as well as the Programming Languages Software Award by the ACM. Leo’s work has also been reported in the New York Times and many popular science magazines such as Wired, Quanta, and Nature News.
Lester Mackey
Lester Mackey is a Principal Researcher at Microsoft Research, where he develops machine learning methods, models, and theory for large-scale learning tasks driven by applications from climate forecasting, healthcare, and the social good. Lester moved to Microsoft from Stanford University, where he was an assistant professor of Statistics and, by courtesy, of Computer Science. He earned his PhD in Computer Science and MA in Statistics from UC Berkeley and his BSE in Computer Science from Princeton University. He co-organized the second place team in the Netflix Prize competition for collaborative filtering; won the Prize4Life ALS disease progression prediction challenge; won prizes for temperature and precipitation forecasting in the yearlong real-time Subseasonal Climate Forecast Rodeo; and received best paper, outstanding paper, and best student paper awards from the ACM Conference on Programming Language Design and Implementation, the Conference on Neural Information Processing Systems, and the International Conference on Machine Learning. He is a 2023 MacArthur Fellow, a Fellow of the Institute of Mathematical Statistics, an elected member of the COPSS Leadership Academy, and the recipient of the 2023 Ethel Newbold Prize.
Peter J. Liu
Peter J. Liu is a Research Scientist at Google DeepMind in the San Francisco Bay area, doing machine learning research with a specialisation in language models since 2015 starting in the Google Brain team. He has published and served as area chair in top machine learning and NLP conferences such as ICLR, ICML, NEURIPS, ACL and EMNLP. He also has extensive production experience, including launching the first deep learning model for Gmail Anti-Spam, and using neural network models to detect financial fraud for top banks. He has degrees in Mathematics and Computer Science from the University of Toronto.
About XTX Markets:
XTX Markets is a leading financial technology firm which partners with counterparties, exchanges and e-trading venues globally to provide liquidity in the Equity, FX, Fixed Income and Commodity markets. XTX has over 200 employees based in London, Paris, New York, Mumbai, Yerevan and Singapore. XTX is consistently a top 5 liquidity provider globally in FX (Euromoney 2018-present) and is also the largest European equities (systematic internaliser) liquidity provider (Rosenblatt FY: 2020-2023).
The company’s corporate philanthropy focuses on STEM education and maximum impact giving (alongside an employee matching programme). Since 2017, XTX has donated over £100mn to charities and good causes, establishing it as a major donor in the UK and globally.
In a changing world XTX Markets is at the forefront of making financial markets fairer and more efficient for all.
View original content:https://www.prnewswire.co.uk/news-releases/10-million-artificial-intelligence-mathematical-olympiad-prize-appoints-further-advisory-committee-members-302128542.html
Artificial Intelligence
Hikvision redefines urban mobility with AIoT-powered solutions at Intertraffic 2024
HANGZHOU, China, April 26, 2024 /PRNewswire/ — Hikvision made a significant appearance at Intertraffic Amsterdam, the leading global trade fair for mobility and traffic technology. At the trade event, Hikvision unveiled a suite of traffic, transport, and parking management solutions and products powered by Artificial Intelligence of Things (AIoT) technology, which promised to improve urban mobility, road safety, and operational efficacy.
Elevating urban traffic intelligence with AIoT
One highlight of the Hikvision stand was its intelligent urban traffic solution, which leveraged the power of AIoT to deliver comprehensive real-time monitoring, incident detection, and traffic control. This solution intelligently reshapes traffic dynamics, offering a more responsive and data-driven approach to enhance situational awareness and traffic management. Key innovations in the solution included:
Hikvision’s radar-video fusion camerasThese combine the range perception of radar with the visual perception of video. The 4 MP Radar and Video Vehicle Detector, for example, helps to enhance road safety by providing early warning of potential hazards in challenging situations such as blind spots at intersections and obstacles outside the visual range.Hikvision’s All-In-One Traffic SpotterThis stands out with its multifaceted design incorporating video, radar, and lighting technologies for heightened traffic violation detection. Its streamlined column design facilitates effortless installation.Hikvision’s Radar-Linked PTZ Camera This ensures consistent performance in adverse weather and lightening conditions, and minimizes false alarms with advanced deep-learning algorithms.Innovating parking management
Hikvision also introduced its parking management solutions. These combine extremely precise license plate recognition and intelligent barrier controls incorporating highly accurate radar sensors. This comprehensive approach enhances security, reduces the need for manual intervention, and streamlines traffic flow across parking areas. The Global Shutter CMOS* (GMOS) ANPR camera was a new addition to the lineup. Designed to seamlessly blend in the environment, it is tailored for the task of discreetly capturing license plates at parking facilities that prioritize subtlety.
Advancing public transportation safety and efficiency
Attendees also had the opportunity to explore Hikvision’s latest public transport solutions, integrating AI-driven analytics with advanced video security, on-site voice broadcasting, and centralized management for enhanced onboard security, improved passenger experience, and operational efficiency for buses and taxis. This included the Four-way monitoring system and the Panoramic Auxiliary System, both designed to reduce blind spots and provide high-definition imaging to improve driving safety.
“As ever, we are continually expanding our suite of technologies to enhance traffic safety and efficiency,” said Nick Wu, Project Product Director at Hikvision Europe. “Our commitment lies in minimizing the need for extensive roadside installations by incorporating comprehensive perception and robust AI within unified device frameworks. These innovations automate and streamline every aspect of traffic management, from violation detection to traffic flow monitoring, driving safety, and parking management.”
To find out more about Hikvision’s urban mobility products and solutions, please explore its official website.
Note: CMOS stands for Complementary Metal-Oxide-Semiconductor.
Photo – https://mma.prnewswire.com/media/2398456/Hikvision_redefines_urban_mobility_AIoT_powered_solutions_Intertraffic_2024.jpgPhoto – https://mma.prnewswire.com/media/2398459/Hikvision_redefines_urban_mobility_AIoT_powered_solutions_Intertraffic_2024.jpg
View original content:https://www.prnewswire.co.uk/news-releases/hikvision-redefines-urban-mobility-with-aiot-powered-solutions-at-intertraffic-2024-302128527.html
Artificial Intelligence
London Blockchain Conference Launches the No Future Campaign
LONDON, April 26, 2024 /PRNewswire/ — The London Blockchain Conference is excited to announce the launch of its ground-breaking, ‘No Future Campaign’. This initiative aims to create a strong narrative surrounding blockchain technology by challenging perceptions and sparking conversations. By creating this platform, the campaign aims to instil a fear of missing out (FOMO) sensation among the audience, positioning the London Blockchain Conference as a gateway to securing a stake in the future and unlocking the potential of blockchain technology.
With a bold and evocative narrative theme, the campaign will initially confront the audience with a jarring reality check of “NO FUTURE” and then resolve the statement “WITHOUT BLOCKCHAIN” to spark curiosity and engagement with the optimistic revelation that blockchain holds the key to a prosperous future.
The ‘No Future Campaign’ started on 17 April 2024 with the London Blockchain Conference creating and executing content on/with media platforms and partnerships:
Wharf Life inserts (17/04/2024) – Print and a digital advert/editorial-sponsored pieces.Animations being released on paid and organic channels in a 3-week campaign.Alex Stein, Conference Director said, “The No Future Campaign is a call for individuals, enterprises, and governments to recognise the importance and role of blockchain in shaping the future. Through the London Blockchain Conference, we aim to educate and inspire attendees to understand and harness the potential of blockchain technology.”
The three-day London Blockchain Conference at the ExCel will bring together politicians, business leaders, and innovators. The conference will be running from 21 – 23 May 2024 and will focus on disruptive and real-world applications of blockchain technology and the impact it is having on politics, emerging technologies, and enterprises.
For more information about the ‘No Future campaign’, visit the London Blockchain Conference website.
About the London Blockchain Conference
NETWORK. LEARN. ENGAGE.
At the London Blockchain Conference, we show how Blockchain will change the world and help people see another way to manage data, build scalable on-chain solutions and achieve great things. We do this by creating valuable, insightful, and engaging events that educate and inform, allowing you to connect and network to build strong business relationships. Our conference is the best avenue to see blockchain innovations, ecosystem announcements, product launches, technology updates, keynote speeches, panels, and fireside chats from blockchain leaders. Join us and experience it for yourself.
View original content:https://www.prnewswire.co.uk/news-releases/london-blockchain-conference-launches-the-no-future-campaign-302128526.html
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