Connect with us
MARE BALTICUM Gaming & TECH Summit 2024

Artificial Intelligence

Semiconductor Bonding Market Forecast to 2028 – COVID-19 Impact and Global Analysis – by Type and Technology

Published

on

New York, Nov. 16, 2022 (GLOBE NEWSWIRE) — Reportlinker.com announces the release of the report “Semiconductor Bonding Market Forecast to 2028 – COVID-19 Impact and Global Analysis – by Type and Technology” – https://www.reportlinker.com/p06363003/?utm_source=GNW
However, in 2020, the industrial & automotive electronics industries experienced a decline in the demand for semiconductors due to the onset of the COVID-19 pandemic.

According to the Semiconductor Industry Association (SIA), the global sales of semiconductors increased from US$ 204.4 billion in 2000 to US$ 440.4 billion in 2020, which approximately doubled in the last two decades. Low prices of various chip types, such as memory chips; decreasing demand for smartphones, servers, and PCs; and a trade dispute between the US and China are hampering the market growth. Moreover, the US has imposed several restrictions on Chinese businesses because of national security concerns. For instance, the direct result of US sanctions against Huawei, the Chinese company, has adversely affected the company’s semiconductor business. As a result, China’s share of the semiconductor industry dropped from 6.7% in 2020 to 6.5% in 2021, according to SIA.

Several semiconductor bonding players are adopting various organic and inorganic strategies to gain a competitive advantage. For instance, in April 2021, ASM Pacific Technology introduced three new manufacturing systems with X-Celeprint’s Micro Transfer Printing and ASM AMICRA’s high precision die bonding technology to allow high volume heterogeneous integration of ultra-thin dies.

Impact of COVID-19 Pandemic on North America Semiconductor Bonding Market Growth

Semiconductor companies in North America are adapting to increased costs, lead time, and a shortage of supplies while catering to consumer demand.According to the United States Department of Commerce, the US constitutes ~50% of the global market share of semiconductor production.

The demand for major semiconductor components in North America witnessed a significant decline due to the emergence of the COVID-19 pandemic.For example, in 2020, the global semiconductor industry faced a decline of 5-15% compared to 2019.

The COVID-19 pandemic has had a negative impact on semiconductor companies in the US.In addition, the US semiconductor industry relied heavily on outsourcing raw materials and labor from China before the onset of the pandemic.

Further, In Mexico, growth is observed in telecom & automotive sectors which is also expected to offer lucrative opportunities for semiconductor bonding market players. The shutdown of China’s border led to the shutdown of factories or limited production, an increase in shipping costs, and supplementary capacity constraints. As a result, domestic production increased, which increased overall costs while allowing the US to control the entire supply chain. Further, in August 2020, the US government banned the sale of semiconductor chips to Huawei, the Chinese multinational corporation. These initiatives are expected to boost the US semiconductor industry, which, in turn, is expected to boost the semiconductor bonding market size.

The North America region is segmented into the US, Canada, and Mexico.The US held the largest semiconductor bonding market share in 2021, whereas Canada is projected to grow at the highest CAGR.

Government authorities have taken many initiatives to promote the semiconductor industry, which has increased the number of investments in the industry.North America has a huge demand for 3D semiconductor assembly and packaging solutions.

An increasing number of companies, majorly in the automotive sector, are adopting advanced technologies such as IoT and artificial intelligence. Robert Bosch GmbH; Allegro MicroSystems, Inc.; Texas Instruments Incorporated; Qualcomm Technologies, Inc.; InvenSense; and Honeywell International Inc. are a few of the prominent semiconductor bonding market players. The rising demand for MEMS and sensors in the region has provided many opportunities for market leaders engaged in the manufacturing of die bonders, wafer bonders, and flip-chip bonders.

Semiconductor bonding is used in manufacturing consumer electronic devices, automotive, medical devices, and various other applications, which is significantly increasing its demand, thereby driving the semiconductor bonding market growth in the US.Further, high automotive sales in the US impacted the country’s overall semiconductor bonding market analysis in 2021.

Major automakers announced multibillion-dollar investments in EVs and AVs.GM announced an investment of US$ 35 billion by 2025.

In addition, in September 2022, the US government announced that they would be investing US$ 50 billion in the establishment of the US semiconductor industry; they are also aiming to lower the dependency on China for semiconductors through this investment plan.Moreover, in August 2022, the Arizona government visited Taiwan, focusing on semiconductors for everyday electronic devices.

Thus, the growing government investment in the semiconductor industry will fuel the demand for semiconductor bonding.

A rise in the population in Canada will increase the demand for housing units, from single-family homes to high-rise condominiums.As a result, the demand for household electronic goods is fueling the need for semiconductors in the country.

In addition, The use of smartphones, tablets, television, personal computers, and other devices is increasing tremendously.The rising demand for consumer electronic devices in Canada is boosting the semiconductor bonding market growth.

Also, the country has provided semiconductor chip manufacturers access to 15 free trade agreements with 51 countries with ~1.5 billion consumers and a combined GDP of US$ 49.3 trillion. Furthermore, the country is home to various semiconductor companies such as TSMC, Samsung Electronics, AMD, Qualcomm, and Intel. Thus, the rising demand for smart electronic devices and the initiative by the Canadian government are propelling the growth of the semiconductor bonding market in the country.

Palomar Technologies; Panasonic Corporation; Toray Industries Inc; Kulicke & Soffa Industries, Inc.; HUTEM; DIAS Automation (HK) Ltd; ASMPT Ltd (formerly ASM Pacific Technology Ltd.); EV Group; Yamaha Motor Corporation (Yamaha Robotics Holdings); and WestBond, Inc. are a few of the prominent players operating in the semiconductor bonding market.

The overall semiconductor bonding market has been derived using both primary and secondary sources.To begin the semiconductor bonding market analysis, exhaustive secondary research has been conducted using internal and external sources to obtain qualitative and quantitative information related to the semiconductor bonding market.

The process also serves the purpose of obtaining an overview and market forecast of the market growth with respect to all market segments.Also, multiple primary interviews with industry participants and commentators have been conducted to validate the data and gain more analytical insights about the topic.

Participants of this process include industry experts such as VPs, business development managers, market intelligence managers, national sales managers, and external consultants—such as valuation experts, research analysts, and key opinion leaders—specializing in the semiconductor bonding market.
Read the full report: https://www.reportlinker.com/p06363003/?utm_source=GNW

About Reportlinker
ReportLinker is an award-winning market research solution. Reportlinker finds and organizes the latest industry data so you get all the market research you need – instantly, in one place.

__________________________


GlobeNewswire is one of the world's largest newswire distribution networks, specializing in the delivery of corporate press releases financial disclosures and multimedia content to the media, investment community, individual investors and the general public.

Artificial Intelligence

Elevate Your Virtual Reality Experience with KIWI design RGB Vertical Stand, Now Available on Meta’s Website

Published

on

elevate-your-virtual-reality-experience-with-kiwi-design-rgb-vertical-stand,-now-available-on-meta’s-website

LOS ANGELES, May 11, 2024 /PRNewswire/ — Top-tier VR accessories provider KIWI design has launched its latest product, the RGB Vertical Stand. This Meta-authorized accessory, designed to deepen users’ immersion in the metaverse, is now available on the official Meta website.

“KIWI design’s commitment to pushing the boundaries of virtual reality accessories takes another leap forward with the introduction of our new products,” said Ray,the CEO of KIWI design. “We are always dedicated to bringing innovative upgrades to VR device accessories, with the goal of enriching users’ virtual reality experiences.”
The newly launched RGB Vertical Stand features a user-friendly modular design with push-in assembly, making it easy to set up and use. It is compatible with Meta Quest 3, Quest 2, and Quest Pro, ensuring widespread usability. With a magnetic USB Type-C connector, it provides an effortless way to charge and display your headset. Users can also customize their display with 16 pre-set ambient multicolor RGB light options.
With VR technology constantly evolving, users are seeking more immersive experiences. As a leading manufacturer of VR accessories, KIWI design is committed to enhancing the user experience, through unique product designs. Since its establishment in 2015, KIWI design has acquired over 100 patents and has a diverse product lineup, including head straps, facial interfaces, VR stands, charging accessories, and controller grip covers.
KIWI design has also actively participated in the Made for Meta program, which is provided by Meta to strengthen its partnerships with leading brands to deliver accessories that enhance Meta products with more choice and a richer experience for everyone. KIWI design’s participation in this program validates its high-quality design standards.
The RGB Vertical Stand for Meta Quest 3, Quest 2, and Quest Pro and another specially designed authorized charging dock for the Meta  Oculus Quest 2 are now available for purchase on both KIWI design’s website and Amazon. For more information about our brand and products, please visit our website and follow KIWI design on Facebook, Instagram, X, YouTube and TikTok.
https://www.kiwidesign.com/
https://www.facebook.com/KIWIdesignOfficial
https://www.instagram.com/kiwidesignins/

https://www.youtube.com/channel/UCOzFWarIschBuBfNz01Oucw
TikTok – Make Your Day
Photo – https://mma.prnewswire.com/media/2410344/image.jpg

View original content:https://www.prnewswire.co.uk/news-releases/elevate-your-virtual-reality-experience-with-kiwi-design-rgb-vertical-stand-now-available-on-metas-website-302142936.html

Continue Reading

Artificial Intelligence

WIO Taps Gracenote to Revolutionize Television Broadcast Reporting

Published

on

wio-taps-gracenote-to-revolutionize-television-broadcast-reporting

LOS ANGELES, May 11, 2024 /PRNewswire/ — WIO LLC, parent company of the global TV broadcast airings platform, WIOpro™, has announced a new strategic agreement with Gracenote, the global content data business unit of Nielsen, to address the longstanding challenge of accurately tracking and collecting music royalties generated by broadcast television and digital programming, With this agreement, WIO will integrate Gracenote TV program metadata and show airings into its WIOpro™ (“When’s It On – Professional”) platform enabling performance rights organizations, copyright management organizations and other entities to better monitor broadcast schedules and identify when royalties have been earned.

By integrating Gracenote historical program data into WIOpro’s new LookBack™ feature, WIO is enhancing its reporting capabilities and empowering Collection Societies, Rights Management Companies and the royalty-earning community to more easily monitor and export broadcast airings and better understand collections opportunities.
“At WIO, we are committed to empowering collection societies and copyright holders around the world with our platform tools and unprecedented access to the best and most accurate television broadcast and streaming data available,” said Shawn Pierce, Co-Founder and CEO of WIO LLC. “We have enjoyed an incredible relationship with Gracenote for 10 years. With the solidification of this agreement, we are able to deliver an unrivaled dataset to the royalty and residual community in a way that has not been offered before.” said Adam Shafron, Co-Founder and CTO of WIO LLC.
“WIO’s platform developed to solve the difficult matter of royalty tracking only becomes more powerful based on the integration of accurate, timely and comprehensive Gracenote metadata,” said Scott Monahan, Director, Strategic Partnerships, Gracenote. “We look forward to the combination of WIOpro’s technology and Gracenote’s program metadata delivering on the promise of transforming music royalty collection so that rights holders can be fairly compensated for use of their work.”
WIO and Gracenote will be at the MusicBiz 2024 conference in Nashville, TN May 13 – 16. Contact Dave Pelman, COO of WIO LLC at [email protected] for media queries or to book an appointment for a product demonstration.
About WIO:WIO is a technology company dedicated to providing broadcast television and digital programming data tailored specifically for the royalty and residual collection industry. Through its platform WIOpro (wiopro.com), users obtain access to real-time broadcast insights, reporting and curated data delivery.
About Gracenote:Gracenote is the content data business unit of Nielsen providing entertainment metadata, connected IDs and related offerings to the world’s leading creators, distributors and platforms. Gracenote enables advanced content navigation and discovery capabilities helping individuals easily connect to the TV shows, movies, music, podcasts and sports they love while delivering powerful content analytics making complex business decisions simpler.
Logo – https://mma.prnewswire.com/media/2410159/wio_gracenote.jpg
Logo – https://mma.prnewswire.com/media/2410160/powered_by_gracenote_logo.jpg

View original content:https://www.prnewswire.co.uk/news-releases/wio-taps-gracenote-to-revolutionize-television-broadcast-reporting-302142826.html

Continue Reading

Artificial Intelligence

IDTechEx Explores Printed Electronics in Electrified and Autonomous Mobility

Published

on

idtechex-explores-printed-electronics-in-electrified-and-autonomous-mobility

BOSTON, May 10, 2024 /PRNewswire/ — Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.

Historically, printed electronics technologies have nurtured a close relationship with the automotive sector, with printed force sensors pioneering passenger safety through seat occupancy and seatbelt detection. As such, the automotive sector continues to represent the lion’s share of the global printed and flexible sensor market, which IDTechEx’s report on the topic evaluates as worth US$421M in 2024. However, if the automotive sector is to continue to be a reliable revenue stream, printed electronics technology providers must adapt to address the emerging technical challenges facing future mobility.
Augmenting autonomous vehicles with printed electronics
As vehicle autonomy levels advance, the increasing number and distribution of spatial mapping sensors required will need continuous performance improvements to ensure passenger safety. Emerging printed electronics technologies can augment these sensors, extending detection bandwidth and maximizing reliability during operation.
Transparent conductive films (TCFs) are being developed to heat and defog LiDAR sensor panels, ensuring the function is unperturbed by external environmental conditions. Properties such as high transparency and low haze are important for defogging. These properties can be easily tuned using the wide variety of material options available for TCFs, including carbon nanotubes and silver nanowires.
IDTechEx identifies printed heating as a leading application of transparent conductive films. This is attributed to diminishing growth prospects in capacitive touch sensing applications. Innovations in thin film coating techniques have enabled indium tin oxide (ITO) to dominate touch sensing applications, all but displacing TCFs completely.
Looking towards the future, printed electronics technologies could play a more active role in advanced autonomous driving. Emerging semiconductive materials, such as quantum dots, printed directly onto conventional silicon image sensor arrays can extend detection range and sensitivity deeper into the infrared region. Augmenting existing image sensor technology with enhanced spectral range could facilitate the competition of hybrid silicon sensors with established InGaAs detectors.
Printed sensors promise granularized battery health monitoring
Vehicle electrification is driving the sustained development and evolution of electronic management systems, particularly in the battery and electric drivetrain. A strong market pull exists for technologies that increase vehicle efficiency, range, and lifetime while reducing recharge times.
Printed pressure and temperature sensors measure battery cell swelling and thermal profiles, providing granularized physical data that can be used to optimize battery deployment and recharging. Moreover, hybrid printed sensors that combine integrated printed heating elements promise a solution to actively address battery temperature. IDTechEx estimates that printed sensor-enabled battery deployment and charging optimizations could be worth up to US$3000 in savings per vehicle.
There remains uncertainty about whether electrification trends will correspond to increased demand for physical sensors in electric vehicle batteries, owing to the utility of existing electronic readouts for managing deployment. Virtual sensors also pose a threat, where AI-enabled software models interpret data to predict and emulate physical sensor functions without the need for discreet components. However, emerging regulations regarding safety and sensor redundancy will likely favor measurable metrics and see automotive makers continue to adopt physical sensors. IDTechEx predicts that virtual sensors are unlikely to displace their physical counterparts – so long as low-cost sensors remain widely available.
Embedding printed electronics in the car of the future
IDTechEx predicts that global car sales will saturate over the next decade, with automakers increasingly looking for premium features and technical innovations to differentiate themselves from the competition. In-cabin technologies will be highly desirable – as the location where passengers reside and interact with the vehicle the most.
Lighting elements are emerging as a prominent differentiator, described as “the new chrome” by Volkswagen’s chief designer. The use of in-mold structural electronics (IMSE) enables the integration of embedded lighting elements using existing manufacturing processes. 3D electronics technologies are intrinsically attractive for automotive integration, as functional layers are conformable and lightweight while easily embedded within existing aesthetic elements.
Despite strong tailwinds, the adoption of in-mold electronics within automotive interiors has been sluggish. This is attributed to the challenges of meeting automotive qualification requirements, as well as stiff competition with less sophisticated alternatives such as applying functional films to thermoformed parts. Nevertheless, momentum is building, with technology providers like Tactotek partnering with Mercedes-Benz and Stallantis to progress the automotive validation of IMSE to TRL5.
Outlook for printed electronics in automotive applications
Just as printed force sensors heralded early passenger safety systems, printed electronics technology is poised to underpin next-generation innovations for the car of the future. But this time, the competition will be stiff. Critical cost requirements must be met, while desirable new functionality must address existing challenges faced by manufacturers. Printed electronics can play a role in supporting emerging electrified and autonomous mobility, such as augmenting LiDAR sensors or optimizing electric battery deployment. Demand for technologies that enhance passenger experience and vehicle aesthetics will continue to grow, and printed electronics can supply low-power, lightweight lighting solutions for these.
Sustained engagement from tier suppliers and manufacturers continues to make the automotive sector key to printed sensor market growth opportunities – a total market IDTechEx predicts will reach US$960M by 2034. Strong partnerships between material providers and printed electronics technology providers are complementary to those of the highly vertically integrated automotive value chains between tier suppliers and OEMs. Leveraging printing techniques to provide solutions that slot into existing manufacturing processes and designs will be crucial. In the medium term, the printed electronics technologies most likely to realize revenue potential are those that can adapt to service emerging challenges already known to the automotive industry.
For more information on IDTechEx’s research on this topic, please see their report, “Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets”. Downloadable sample pages are available for this report.
For the full portfolio of printed and flexible electronics market research from IDTechEx, please visit www.IDTechEx.com/Research/PE.
About IDTechEx:
IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact [email protected] or visit www.IDTechEx.com. 
Image download:
https://www.dropbox.com/scl/fo/26ylbecu6ztl4larjuycj/AFbRjqvsovp8yj-f9JOQLEg?rlkey=4e2lb1pqbl9rsfzp73bunm57j&st=t60swtdx&dl=0 
Media Contact:
Lucy RogersSales and Marketing [email protected] +44(0)1223 812300
Social Media Links:
Twitter: www.twitter.com/IDTechExLinkedIn: www.linkedin.com/company/IDTechEx
Photo – https://mma.prnewswire.com/media/2408851/IDTechEx_applications.jpg

View original content:https://www.prnewswire.co.uk/news-releases/idtechex-explores-printed-electronics-in-electrified-and-autonomous-mobility-302141570.html

Continue Reading

Trending