Artificial Intelligence
oToBrite to Showcase Cutting-Edge Vision-AI ADAS Solutions at Automotive Engineering Exposition 2024 Nagoya
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HSINCHU, July 11, 2024 /PRNewswire/ — oToBrite is thrilled to announce its participation in the Automotive Engineering Exposition 2024 Nagoya, taking place from July 17 to July 19 at booth 259, Aichi Sky Expo.
Aligning with the global Vision Zero initiative, oToBrite, a leading vision-AI expert and seasoned automotive Tier-1 supplier, demonstrates its commitment to road safety through state-of-the-art vision-AI R&D to deliver comprehensive ADAS solutions.
At the event, oToBrite will showcase its Blind Spot Information System (BSIS) and Moving Off Information System (MOIS), both approved with UN R151 and UN R159 certifications for European heavy commercial vehicles through innovative vision-AI technology. oToBrite will also introduce oToGuard, the world’s first all-in-one ADAS system for heavy commercial vehicles. oToGuard offers 360-degree protection by eliminating blind spots and giving warnings for vulnerable road users and risky driving behaviors. This system integrates multiple ADAS features like Around View Monitoring (AVM), Blind Spot Information System (BSIS), Driver Monitoring System (DMS), Forward Collision Warning (FCW), Lane Departure Warning (LDW), Moving Off Information System (MOIS), and even advanced level 2+ ADAS features, all within a single system. The system has garnered significant interest in Europe and Japan due to stringent UN regulations and a commitment to Vision Zero. This highly integrated design minimizes installation time, space, and costs while meeting multiple UN regulations.
oToBrite’s Vision-AI solutions lead the way for new mobility and Vision Zero. Their products are already in mass production for various vehicles, including passenger cars, heavy commercial vehicles, electric buses, two-wheelers, and last-mile delivery vehicles. The versatile vision-AI perception algorithms developed by oToBrite are already adapted across various SoC platforms, enabling customers to add more vision-AI ADAS features to existing hardware devices, such as empowering existing Around View Monitoring (AVM) system with Automated Parking Assist (APA), Static and Moving Object Detection, Open Door Alert (ODA), Lane Departure Warning (LDW), Rear Cross Traffic Alert (RCTA), and more vision-AI functions.
By attending the Automotive Engineering Exposition 2024 Nagoya, oToBrite aims to demonstrate its technological prowess and commitment to Vision Zero. Visit oToBrite at booth 259 to learn more about their innovative ADAS solutions and vision-AI technologies. For more information, visit oToBrite’s website at https://www.otobrite.com/en.
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Artificial Intelligence
IoT Middleware Market worth $41.7 billion by 2029 – Exclusive Report by MarketsandMarkets™
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CHICAGO, Aug. 26, 2024 /PRNewswire/ — The IoT Middleware Market is expected to reach USD 41.7 billion by 2029 from USD 18.5 billion in 2024, at a CAGR of 17.6 % during 2024–2029, according to a new report by MarketsandMarkets™.
Browse in-depth TOC on “IoT Middleware Market”
174 – Tables 46 – Figures221 – Pages
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Scope of the Report
Report Metrics
Details
Market size available for years
2019–2029
Base year considered
2023
Forecast period
2024–2029
Forecast units
Value (USD Billion)
Segments Covered
By Platform Type, Vertical, and Region
Region covered
North America, Europe, Asia Pacific, Middle East & Africa, and Latin America
Companies covered
The major players in the IoT Middleware Market are Microsoft (US), IBM (US), PTC (US), Cisco (US), AWS (US), SAP (Germany), Google (US), Hitachi (Japan), Oracle (US), HPE (US), Bosch (Germany), Siemens (Germany), GE (US), Schneider Electric (US), Software AG (Germany), Aeris Communication (US), Salesforce (US), Atos (France), ClearBlade (US), Davra Networks (US), Axiros (Germany), Eurotech (Italy), Litmus Automation (US), Ayla Networks (US), SumatoSoft (US), QiO Technologies (UK), Particle Industries (US), and Exosite (US).
loT Middleware market is largely driven by the growth of loT devices in different industries at a relatively higher growth rate. They are being employed in homes, industries, healthcare sector, transport sector, and many more other sectors. This implies that the more connected devices there are, the more difficult it becomes to manage them. loT Middleware can be understood as an intermediate layer that is designed to mediate interactions, data sharing, and device control in areas of various platforms anc devices. In this regard, it assists the organizations in compiling a host of loT devices and ensure they work in a coordinated manner, thus improving performance.
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The healthcare vertical is projected to register the highest CAGR during the forecast period.
IoT has continued to increase in health care because of the adoption of implanted sensors, fast cellular networks such as LTEs and 3Gs, and wireless devices. This interconnection of sensors and devices ensures that healthcare organizations can coordinate clinical activities, monitor workflow, and even dispense patient care from the patient’s home or any other location. Consequently, a great emphasis is placed on introducing solid applications and correlated technologies in healthcare. Integrated health technologies, which include using new points of care through IoT middleware solutions, are being embraced, including remote patient monitoring, health care worker and patient workflow management, medication management, and medical asset tracking. Some players are moving in this area, taking advantage of experience in the communications infrastructure essential for M2M communication. M2M has numerous uses in healthcare, such as cell phones with RFID-sensor features that can track medical indices and control medication.
During the forecast period, the device management platform contributed the largest market share in the IoT Middleware Market.
Device Management platforms offer the necessary frameworks to ensure that connected devices are effectively managed and controlled. It allows real-time interaction across the connected devices with the hub application and the processed data transmissions. This often provides services like device onboarding, configuration, & monitoring and firmware update to help businesses to maintain massive IoT deployments. This also ensures that devices are properly functioning well, protected, and updated and thus reduce the incidences of breakages, losses, or delays. In addition, this platform also has extensibility to have new devices added in the future when the IoT network expands. The middleware platform addresses the management challenge for IoT devices making it easier for organizations to keep track of the health of the devices and security of their IoT infrastructure.
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Based on region, Asia Pacific is projected to register the highest CAGR during the forecast period.
The IoT middleware Asia-Pacific market is on the growth slope graph that is expected to reach USD 15.8 billion by 2029, with China, Japan, and India leading the charge. IoT middleware has been seen to register rapid growth in the Asia Pacific region due to government support and Smart city projects, especially in China, which by 2024 will account for over 30% of the region’s Market. Due to the early adoption of new technologies, Asia-Pacific is expected to observe the highest compound annual growth rate during the forecast period. The region’s strategic drive to improve its IT structure allows organizations to adopt innovative information technologies. The Global Mobile Suppliers Association report revealed that Asia-Pacific has the potential to become the world’s biggest IoT services market, with nearly 11 billion connections in the market in the next seven years. It is an emerging market pulling in the big guns, including Litmus Automation, which has moved to Japan to satisfy the growing need for IoT sophistication in industrial processes.
Top Companies in IoT Middleware Market:
The report profiles key players such as Microsoft(US), IBM (US), PTC (US), Cisco (US), AWS (US), SAP (Germany), Google (US), Hitachi (Japan), Oracle (US), HPE (US), Bosch (Germany), Siemens (Germany), GE (US), Schneider Electric (US), Software AG (Germany), Aeris Communication (US), Salesforce (US), Atos (France), ClearBlade(US), Davra Networks (US), Axiros (Germany), Eurotech (Italy), Litmus Automation (US), Ayla Networks (US), SumatoSoft (US), QiO Technologies (UK), Particle Industries (US) and Exosite (US).
Browse Adjacent Markets: Digitalization and Internet of Things (IoT) Market Research Reports & Consulting
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Artificial Intelligence
About Circul VS: A Core Continuous Blood Pressure Measurement Technology System Developed in Partnership with Dr. Ehud Baron
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SHENZHEN, China, Aug. 26, 2024 /PRNewswire/ — UTime Limited (NASDAQ: WTO) (“UTime” or the “Company”) is excited to announce its collaboration on Circul VS, a core continuous blood pressure measurement technology system developed in partnership with strategic partner, Dr. Ehud Baron. Designed to offer patients an accurate and user-friendly continuous blood pressure monitoring solution, Circul VS facilitates early detection and long-term management, helping to reduce the risks associated with cardiovascular and cerebrovascular conditions.
Circul VS features the BPwatch, Ring, and Smart Cradle, integrated into a sophisticated cloud-based network and service system. Unlike other systems on the market, Circul VS focuses on capturing rapid blood pressure fluctuations caused by changes in endothelial function and vascular tone—critical factors often neglected by competitors.
Utilizing state-of-the-art ultrasound sensing technology and intelligent algorithms, Circul VS provides continuous, real-time blood pressure waveform data with exceptional accuracy. This innovative technology is the result of comprehensive market research and extensive clinical studies.
As part of this strategic collaboration, UTime has harnessed expertise in biomedical engineering and electronic technology to ensure the Circul VS system is not only precise but also stable and reliable in diverse clinical settings.
Having undergone clinical trials in multiple partner hospitals, Circul VS has garnered positive feedback for its outstanding performance in the non-invasive monitoring space, offering systolic and diastolic pressure readings with accuracy approaching that of invasive techniques.
During its development, Circul VS was tailored to meet the needs of different application scenarios—including hypertension screening for healthy individuals, long-term management for diagnosed hypertension patients, and acute monitoring for hospitalized patients. This adaptability ensures it meets the specific demands of various clinical environments.
The launch of Circul VS marks a pivotal advancement in blood pressure monitoring technology. Together with Dr. Ehud Baron, UTime plans to continue refining this technology, aiming to enhance its intelligence and accuracy for widespread use in ICUs and other medical settings, ultimately improving patient care and quality of life.
About UTime Limited
UTime Ltd., established in 2008, provides cost-effective mobile devices to consumers globally and to helping low-income individuals from established markets, including the United States and emerging markets such as India and other countries in South Asia and Africa have better access to updated mobile technology. Since 2024, UTime has been committed to transforming health and wellness through innovative medical wearable technologies. By leveraging cutting-edge research and strategic partnerships, UTime aims to provide effective solutions for disease prevention and health management on a global scale. For more information, visit the Company’s website at http://www.utimeworld.com/.
Forward-Looking Statements
Statements in this press release about future expectations, plans and prospects, as well as any other statements regarding matters that are not historical facts, may constitute “forward-looking statements” within the meaning of The Private Securities Litigation Reform Act of 1995. These statements include, but are not limited to, statements relating to the ability of the Company to regain compliance with Nasdaq continued listing requirements. The words “anticipate,” “believe,” “continue,” “could,” “estimate,” “expect,” “intend,” “may,” “plan,” “potential,” “predict,” “project,” “should,” “target,” “will,” “would” and similar expressions are intended to identify forward-looking statements, although not all forward-looking statements contain these identifying words. Actual results may differ materially from those indicated by such forward-looking statements as a result of various important factors discussed in the “Risk Factors” section of the Annual Report in Form 20-F filed with the SEC on July 30, 2024. Any forward-looking statements contained in this press release speak only as of the date hereof, and the Company specifically disclaims any obligation to update any forward-looking statement, whether as a result of new information, future events or otherwise.
For more information, please contact:Eaky [email protected]
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Artificial Intelligence
New IBM Processor Innovations To Accelerate AI on Next-Generation IBM Z Mainframe Systems
New IBM Telum II Processor and IBM Spyre Accelerator unlock capabilities for enterprise-scale AI, including large language models and generative AI
Advanced I/O technology enables and simplifies a scalable I/O sub-system designed to reduce energy consumption and data center footprint
PALO ALTO, Calif., Aug. 26, 2024 /PRNewswire/ — IBM (NYSE: IBM) revealed architecture details for the upcoming IBM Telum® II Processor and IBM Spyre™ Accelerator at Hot Chips 2024. The new technologies are designed to significantly scale processing capacity across next generation IBM Z mainframe systems helping accelerate the use of traditional AI models and Large Language AI models in tandem through a new ensemble method of AI.
With many generative AI projects leveraging Large Language Models (LLMs) moving from proof-of-concept to production, the demands for power-efficient, secured and scalable solutions have emerged as key priorities. Morgan Stanley research published in August projects generative AI’s power demands will skyrocket 75% annually over the next several years, putting it on track to consume as much energy in 2026 as Spain did in 2022.1 Many IBM clients indicate architectural decisions to support appropriately sized foundation models and hybrid-by-design approaches for AI workloads are increasingly important.
The key innovations unveiled today include:
IBM Telum II Processor: Designed to power next-generation IBM Z systems, the new IBM chip features increased frequency, memory capacity, a 40 percent growth in cache and integrated AI accelerator core as well as a coherently attached Data Processing Unit (DPU) versus the first generation Telum chip. The new processor is expected to support enterprise compute solutions for LLMs, servicing the industry’s complex transaction needs.IO acceleration unit: A completely new Data Processing Unit (DPU) on the Telum II processor chip is engineered to accelerate complex IO protocols for networking and storage on the mainframe. The DPU simplifies system operations and can improve key component performance.IBM Spyre Accelerator: Provides additional AI compute capability to complement the Telum II processor. Working together, the Telum II and Spyre chips form a scalable architecture to support ensemble methods of AI modeling – the practice of combining multiple machine learning or deep learning AI models with encoder LLMs. By leveraging the strengths of each model architecture, ensemble AI may provide more accurate and robust results compared to individual models. The IBM Spyre Accelerator chip, previewed at the Hot Chips 2024 conference, will be delivered as an add on option. Each accelerator chip is attached via a 75-watt PCIe adapter and is based on technology developed in collaboration with the IBM Research. As with other PCIe cards, the Spyre Accelerator is scalable to fit client needs.”Our robust, multi-generation roadmap positions us to remain ahead of the curve on technology trends, including escalating demands of AI,” said Tina Tarquinio, VP, Product Management, IBM Z and LinuxONE. “The Telum II Processor and Spyre Accelerator are designed to deliver high-performance, secured, and more power efficient enterprise computing solutions. After years in development, these innovations will be introduced in our next generation IBM Z platform so clients can leverage LLMs and generative AI at scale.”
The Telum II processor and the IBM Spyre Accelerator will be manufactured by IBM’s long-standing fabrication partner, Samsung Foundry, and built on its high performance, power efficient 5nm process node. Working in concert, they will support a range of advanced AI-driven use cases designed to unlock business value and create new competitive advantages. With ensemble methods of AI, clients can achieve faster, more accurate results on their predictions. The combined processing power announced today will provide an on ramp for the application of generative AI use cases. Some examples could include:
Insurance Claims Fraud Detection: Enhanced fraud detection in home insurance claims through ensemble AI, which combine LLMs with traditional neural networks geared for improved performance and accuracy.Advanced Anti-Money Laundering: Advanced detection for suspicious financial activities, supporting compliance with regulatory requirements and mitigating the risk of financial crimes.AI Assistants: Driving the acceleration of application lifecycle, transfer of knowledge and expertise, code explanation as well as transformation, and more.Specifications and Performance Metrics:
Telum II processor: Featuring eight high-performance cores running at 5.5GHz, with 36MB L2 cache per core and a 40% increase in on-chip cache capacity for a total of 360MB. The virtual level-4 cache of 2.88GB per processor drawer provides a 40% increase over the previous generation. The integrated AI accelerator allows for low-latency, high-throughput in-transaction AI inferencing, for example enhancing fraud detection during financial transactions, and provides a fourfold increase in compute capacity per chip over the previous generation.
The new I/O Acceleration Unit DPU is integrated into the Telum II chip. It is designed to improve data handling with a 50% increased I/O density. This advancement enhances the overall efficiency and scalability of IBM Z, making it well suited to handle the large-scale AI workloads and data-intensive applications of today’s businesses.
Spyre Accelerator: A purpose-built enterprise-grade accelerator offering scalable capabilities for complex AI models and generative AI use cases is being showcased. It features up to 1TB of memory, built to work in tandem across the eight cards of a regular IO drawer, to support AI model workloads across the mainframe while designed to consume no more than 75W per card. Each chip will have 32 compute cores supporting int4, int8, fp8, and fp16 datatypes for both low-latency and high-throughput AI applications.
Availability
The Telum II processor will be the central processor powering IBM’s next-generation IBM Z and IBM LinuxONE platforms. It is expected to be available to IBM Z and LinuxONE clients in 2025. The IBM Spyre Accelerator, currently in tech preview, is also expected to be available in 2025.
Statements regarding IBM’s future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
About IBM
IBM is a leading provider of global hybrid cloud and AI, and consulting expertise. We help clients in more than 175 countries capitalize on insights from their data, streamline business processes, reduce costs and gain the competitive edge in their industries. Thousands of government and corporate entities in critical infrastructure areas such as financial services, telecommunications and healthcare rely on IBM’s hybrid cloud platform and Red Hat OpenShift to affect their digital transformations quickly, efficiently and securely. IBM’s breakthrough innovations in AI, quantum computing, industry-specific cloud solutions and consulting deliver open and flexible options to our clients. All of this is backed by IBM’s long-standing commitment to trust, transparency, responsibility, inclusivity and service.
Additional Sources
Read more about the IBM Telum II Processor.Read more about the IBM Spyre Accelerator.Read more about the IO AcceleratorMedia Contact:
Chase SkinnerIBM [email protected]
Aishwerya PaulIBM [email protected]
1 Source: Morgan Stanley Research, August 2024.
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