Artificial Intelligence
IDTechEx Discusses Co-Packaged Optics (CPO) Packaging Technology Trends and Market Trajectory
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BOSTON, July 24, 2024 /PRNewswire/ — Over the past decade, the capacity of data center Ethernet switches has surged from 0.64 Tbps to 25.6 Tbps, driven by the adoption of 64×400 Gbps or 32×800 Gbps pluggable optical transceiver modules. However, these high-speed modules, within their current form factors, pose significant challenges. Issues include the required densities of electrical and optical connectors, as well as escalating power consumption.
To achieve next-generation optical engines supporting 800 Gbps and beyond per module, the communication rate must double to at least 100 Gbps per lane. This increase introduces substantial signal integrity issues across the switch socket, motherboard, and edge connector, leading to heightened power dissipation at SerDes interfaces. In future Ethernet switching, these signal integrity problems may cause I/O power consumption to exceed that of the switch core. Additionally, the integration density of standard pluggable modules is limited by the QSFP/OSFP form factor, necessitating advanced thermal management solutions not yet widely available.
Co-Packaged Optics (CPO) presents a promising solution to these challenges. Unlike traditional pluggable models, CPO integrates optical modules directly onto the switch ASIC substrate, reducing electrical reach and effectively addressing signal integrity issues. This approach has gained traction among major data centers. However, optimizing the packaging strategy for CPO remains a topic of ongoing industry discussion and development. IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts”, explores these advancements in CPO technology and packaging techniques enabling its adoption.
The importance of advanced semiconductor packaging technologies for Co-Packaged Optics (CPO)
The integration of CPO in data centers aims to boost I/O bandwidth and reduce energy consumption. The way photonic integrated circuits (PICs) are combined with electronic integrated circuits (EICs) and switch ICs, can significantly influence the areal and edge bandwidth density, as well as packaging parasitics. These factors directly affect the transceiver’s I/O bandwidth and energy efficiency, meaning improper integration can negate the advantages of silicon photonics.
For CPO, the integration of photonic and electronic components can be achieved through various methods, each with unique advantages and challenges. The most advanced, and still in the R&D phase, is the 3D monolithic integration. This embeds photonic components within an existing electronic process node with minimal alterations, co-locating active photonics and driving electronics within the same die. This reduces parasitics and simplifies packaging by eliminating the need for interface pads and bumps. However, monolithic integration typically uses older CMOS nodes, resulting in suboptimal photonic performance and higher energy consumption. Despite these limitations, it offers minimal impedance mismatch and simplified packaging.
Conversely, 2D integration places the PIC and EIC side by side on a PCB, connected by wire bonds or flip-chip. This method is straightforward and cost-effective, but introduces significant parasitic inductance, limiting aggregate I/O due to single-edge connections. While 2D integration is easy to package, the reliance on wire bonds constrains the transceiver bandwidth and increases energy consumption, making it less efficient for high-performance applications.
3D hybrid integration offers a more advanced solution by placing the EIC on top of the PIC, via various advanced semiconductor packaging technologies including Through-Si-Via (TSV), high density fan-out, Cu-Cu hybrid bonding, and active photonic interposer, significantly reducing parasitics. The use of advanced semiconductor packaging technologies in 3D integration allows for dense pitch capabilities, enhancing performance. However, thermal dissipation remains a challenge, as the heat generated by the EIC can impact the PIC, necessitating advanced thermal management solutions. Despite these thermal challenges, 3D hybrid integration achieves higher performance due to minimized packaging parasitics.
2.5D integration serves as a compromise, with both the EIC and PIC flip-chipped onto a passive interposer with TSVs. This approach maintains manageable parasitics and dense pitch capabilities similar to 3D integration but adds complexity with the need for interposer traces. While 2.5D integration balances performance, cost, and fabrication turnaround, it incurs higher parasitics than 3D hybrid integration.
In summary, each integration method presents trade-offs between performance, complexity, and cost, with the choice based on specific application requirements and constraints.
Co-Packaged Optics (CPO) market trajectory
According to IDTechEx, the Co-Packaged Optics (CPO) market is projected to exceed $1.2 billion by 2035, growing at a robust CAGR of 28.9% from 2025 to 2035. CPO network switches are expected to dominate revenue generation, driven by each switch potentially incorporating up to 16 CPO PICs. Optical interconnects for AI systems will constitute approximately 20% of the market, with each AI accelerator typically utilizing one optical interconnect PIC to meet increasing demands for high-speed data processing and communication in advanced computing applications.
IDTechEx’s latest report, “Co-Packaged Optics (CPO) 2025-2035: Technologies, Market, and Forecasts”, offers extensive exploration into the latest advancements within Co-Packaged Optics technology. The report delves deep into key technical innovations and packaging trends, providing a comprehensive analysis of the entire value chain. It thoroughly evaluates the activities of major industry players and delivers detailed market forecasts, projecting how the adoption of CPO will reshape the landscape of future data center architecture.
Central to the report is the recognition of advanced semiconductor packaging as the cornerstone of Co-Packaged Optics technology. IDTechEx places significant emphasis on understanding the potential roles that various semiconductor packaging technologies may play within the realm of CPO.
Key aspects of the report include:
Market Dynamics: Examination of key players such as Nvidia, Broadcom, Cisco, Ranovus, and Intel, and the forces shaping the CPO landscape.Innovations in CPO Design: Exploration of advanced CPO designs and their implications for enhancing data center efficiency and shaping future architecture.Semiconductor Packaging Breakthroughs: Insight into the latest advancements in semiconductor packaging, including 2.5D and 3D technologies, and their role in enabling CPO innovation.Optical Engines: Analysis of the drivers behind CPO’s performance and efficiency advantages.CPO for AI Interconnects: Exploration of how optical I/O can address the limitations of copper connections in AI applications, improving efficiency, latency, and data rates.CPO for Switches: Assessment of the potential 25% efficiency gains in high-performance network switches through CPO integration.Challenges and Solutions: Critical review of obstacles to CPO adoption and strategies to overcome them.Future Analysis: Predictions and insights into the next generation of CPO and its anticipated impact on the industry.The report is based on extensive research and interviews with industry experts and provides valuable insights for anyone interested in gaining a strategic understanding of Co-Packaged Optics’ role in advancing the future of data centers and AI technology.
Market Forecasts:10-year Data Center Population Cumulative Forecast10-year AI Accelerator Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Unit Shipments Forecast10-year CPO Interconnect for AI (Optical I/O) Market Revenue Forecast10-year CPO-enabled Network Switch Unit Shipments Forecast10-year CPO-enabled Network Switch Market Revenue Forecast10-year Total CPO Market RevenueFor more information on this IDTechEx report, including downloadable sample pages, please visit www.IDTechEx.com/CPO.
For the full portfolio of related research available from IDTechEx please see www.IDTechEx.com/Research/Semiconductors.
About IDTechEx
IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact [email protected] or visit www.IDTechEx.com.
Media Contact: Charlotte Martin Subscriptions Marketing Manager [email protected] +44(0)1223 812300
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Artificial Intelligence
HONOR Redefines Mobile AI Solutions with PC powered by Snapdragon, on-device AI Agent and AI Deepfake Detection at IFA 2024
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HONOR, Qualcomm, and Microsoft Redefine Innovations in Mobile AI
BERLIN, Sept. 7, 2024 /PRNewswire/ — Today at IFA 2024, HONOR unveiled three groundbreaking mobile AI Solutions: AI PC powered by Snapdragon® X Elite platforms, AI Agent and AI Deepfake Detection. The launch was accompanied by a thought-provoking panel discussion featuring HONOR CEO George Zhao; Alex Katouzian, Group GM of MCX at Qualcomm Technologies, Inc.; and Mark Linton, VP of Device Partner Sales at Microsoft. Together, they explored the convergence of AI and Snapdragon technology, discussing how these innovations are shaping the future of mobile AI.
“When it comes to mobile computing, AI is not just a buzzword, it’s a revolution,” commented George Zhao, CEO of HONOR Device Co., Ltd. “At HONOR, we’re committed to working with our partners to deliver powerful AI capabilities and seamless connectivity, while protecting our users’ privacy. Through open collaboration with industry leaders, we’re creating devices that empower individuals and redefine what’s possible.”
“At Qualcomm Technologies, we believe the NPU is the key to unlocking the true potential of AI in PCs,” added Alex Katouzian, Group GM of MCX, Qualcomm Technologies, Inc. “The Snapdragon X Elite with its industry-leading NPU performance empowers AI PCs like the HONOR MagicBook Art 14 to deliver next-generation AI experiences. Not only will users see a significant boost in capabilities, but the NPU’s efficiency also translates to longer battery life, allowing users to stay productive for extended periods.”
HONOR MagicBook Art 14 Snapdragon: Redefining PC in the Mobile AI EraThe PC landscape is undergoing a radical transformation, driven by advancements in AI and the rise of Snapdragon platforms. Fueled by HONOR’s platform-level AI capabilities and developed in collaboration with top industry leaders, HONOR MagicBook Art 14 Snapdragon heralds a new era of computing.
Featuring a sleek and compact design, the HONOR MagicBook Art 14 Snapdragon is a marvel of lightweight engineering. It incorporates cutting-edge platform-level AI features alongside robust hardware and software solutions, ensuring unmatched productivity and user experience. It translates the lightweight and slim characteristics of smartphones to laptops, delivering the lightest and slimmest AI PC on the market, weighing approximately 1kg with a slimness of 1cm. Delivering an immersive visual journey, the HONOR MagicBook Art 14 Snapdragon features a captivating 14.6-inch HONOR FullView Touch Display boasting a crystal-clear 3.1K resolution. It also includes an outstanding 97% screen-to-body ratio, the largest among 14-inch laptops. The HONOR MagicBook Art 14 Snapdragon is powered by the Qualcomm Snapdragon X Elite, elevating the computing experience to new heights in terms of power, efficiency, and security.
The HONOR MagicBook Art 14 Snapdragon also enables a smooth transition of Windows applications on X86 to the Windows on Snapdragon architecture. Based on years of research on the ecosystem, HONOR created a Hotspot Library that uses platform-level AI to identify frequently used scenarios and trigger translation optimization efficiently. HONOR has improved 16% of the average boot-up time1 with translation optimization across a diverse array of Windows applications. Currently, HONOR has optimized a total of the Top 14 applications across six major categories, including browsers, online meetings, media, office, social software and tools.
The HONOR MagicBook Art 14 Snapdragon will be soon available in German, France and Italy. For preorder, please visit HONOR online store now at www.honor.com.
Seamless AI Experiences Elevated by the Power of MagicRingIn the mobile AI era, seamless cross-OS connectivity will truly empower users to unlock AI everywhere. Unlike the manual point-to-point connections in traditional solutions, the HONOR MagicRing allows multiple devices of the same account to automatically connect with low power consumption.
The MagicRing not only connects devices but also connects services across the devices. The solution also enables users to use the same set of keyboard and mouse for multiple devices, receive calls and notifications on a device other than their smartphones, and control the smartphone’s camera on the PC. With the secure and smooth flow of services and information across devices, MagicRing makes multi-device AI experience easier. For example, as one of the typical scenarios of Windows on Snapdragon experience, Cocreator allows users to produce fantastic artwork with simple draws. Powered by MagicRing, users can seamlessly access Cocreator on their HONOR MagicPad 2, drawing AI masterpieces with their Magic-Pencil. In the Meanwhile, they can also use AI Eraser from HONOR Magic V3 on the HONOR MagicBook Art 14 Snapdragon to experience unparalleled levels of convenient mobile AI.
HONOR AI Agent: The First On-device AI Agent for the Open Ecosystem The HONOR AI Agent is a revolutionary always-on personal assistant designed to enhance and simplify users’ daily lives. By intuitively understanding users’ requests and intentions through language analysis and UI awareness technology, the AI Agent that learns from their habits and device environment can intelligently make decisions across various apps and services. This capability allows it to automate complex tasks. HONOR demonstrated how to find and cancel unwanted app subscriptions across different apps with just a few simple voice commands on their smartphones.
As we look to the future, the HONOR AI Agent is poised to become the cornerstone of mobile AI, and it is anticipated to arrive with the HONOR Magic7 Series later this year in China. This innovation not only signifies a leap in technology but also heralds a new era where AI seamlessly integrates into our daily routines, enhancing everyday productivity and efficiency.
The World’s First On-device AI Deepfake Detection TechnologyAs the technology behind deepfakes becomes more sophisticated, the potential for misuse, including identity theft and the spread of disinformation, grows significantly. HONOR’s on-device AI Deepfake Detection represents a groundbreaking solution designed to protect users from the increasingly prevalent threat of deepfakes. This innovative detection system employs advanced algorithms to meticulously analyze various elements, including pixel-level synthetic imperfections, border compositing artifacts, inter-frame continuity, consistency in face-to-ear hairstyle, and the positioning of synthetic traces. By examining these characteristics, the technology can accurately identify manipulated content, distinguishing between genuine media and deceptive alterations.
About HONOR HONOR is a leading global provider of smart devices. It is dedicated to becoming a global iconic technology brand and creating a new intelligent world for everyone through its powerful products and services. With an unwavering focus on R&D, it is committed to developing technology that empowers people around the globe to go beyond, giving them the freedom to achieve and do more. Offering a range of high-quality smartphones, tablets, laptops and wearables to suit every budget, HONOR’s portfolio of innovative, premium and reliable products enable people to become a better version of themselves.
For more information, please visit HONOR online at www.honor.com or email [email protected]
https://community.honor.com/ https://www.facebook.com/honorglobal/ https://twitter.com/Honorglobal https://www.instagram.com/honorglobal/ https://www.youtube.com/c/HonorOfficial
1Data comes from HONOR labs.
View original content:https://www.prnewswire.co.uk/news-releases/honor-redefines-mobile-ai-solutions-with-pc-powered-by-snapdragon-on-device-ai-agent-and-ai-deepfake-detection-at-ifa-2024-302241211.html
Artificial Intelligence
TECNO Pocket Go Wins Global Product Technology Innovation Award 2024 at IFA 2024
![tecno-pocket-go-wins-global-product-technology-innovation-award-2024-at-ifa-2024](https://roboticulized.com/wp-content/uploads/2024/09/153023-tecno-pocket-go-wins-global-product-technology-innovation-award-2024-at-ifa-2024.jpg)
BERLIN, Sept. 7, 2024 /PRNewswire/ — One of the largest consumer electronics exhibitions in the world, the 2024 IFA Berlin International Consumer Electronics Show, officially kicks off today in Berlin. During the event, the highly anticipated Global Product Technical Innovation Award 2024 was announced, with TECNO Pocket Go winning the prestigious AR Immersive PC Gaming Experience Innovation Gold Award. This recognition highlights the brilliance of Chinese brand on the global stage.
TECNO is dedicated to innovation from the user’s perspective, continuously developing products and applications that enhance user experience. Since 2019, TECNO has expanded its AIoT ecosystem, leveraging its mobile technology to introduce innovative smart wearables, business laptops, and other groundbreaking products, all aimed at providing users with a more intelligent TECNO ecosystem experience.
As a global innovative technology brand with operations in over 70 markets, TECNO has been committed to revolutionizing the digital experience in global emerging markets, relentlessly pushing for the perfect integration of contemporary, aesthetic design with the latest technologies. TECNO offers a wide range of AIoT products covering smart wearables, laptops, tablets and smart home products.
Guided by its brand essence of “Stop At Nothing”, TECNO is committed to unlocking the best and newest technologies for forward-looking individuals, inspiring them to never stop pursuing their best selves and their best futures.
The “Global Product Technology Innovation Award” is a grand international selection of global consumer electronics brands. Launched globally every year, it is also one of the most professional and authoritative international exchange, display and cooperation platforms in IFA in the same year to conduct comprehensive review and evaluation of the global consumer electronics industry for the whole year.
TECNO Pocket Go, redefines gaming on the go
TECNO Pocket Go creates a “new gaming paradise” in handheld PC form in AR industry. By seamlessly integrating with the Windows gaming ecosystem and utilizing advanced head tracking technology, it brings an unparalleled 6D immersive experience to users. Featuring a top-tier AMD® Ryzen™ 7 8840HS gaming processor and a laptop level cooling system by rebuilt the structure to compact size with 50% smaller size and 30% lighter weight. Just easy to carry as a smartphone.
Smaller in your palm, Master in your vision
The AR Pocket Vision features a 0.71-inch Micro-OLED screen that delivers the equivalent of a 215-inch TV experience from 6 meters away, surpassing industry standards. Gamers will enjoy a cinematic-level viewing experience, with customizable adjustments for up to 600° diopters to ensure eye comfort. It also safeguards your privacy, enabling you to play anywhere.
Dominant Flagship Gaming CPU, lead Performance Ahead
Powered by the AMD® Ryzen™ 7 8840HS gaming processor, the Pocket Go handheld offers exceptional speed and seamless multitasking with 8 cores, 16 threads, and turbo speeds up to 5.1 GHz. Its PC-level cooling system, featuring a large fan and three copper pipes, ensures optimal performance at 35W. Combined with a 50Wh replaceable battery, it guarantees long-lasting gaming sessions without interruptions.
“VisionTrack” experiences, games come alive
The Pocket Go combo delivers an immersive experience for your eyes and hands. The AR Pocket Vision features a six-axis gyroscope and AI algorithms for precise head tracking, enhancing real-time data collection during gameplay. With N’BASS® acoustic materials and a proprietary vibration algorithm, it translates in-game sounds into nuanced vibrations via handheld while the Hall Effect Joysticks and Triggers provide precise control, elevating your gaming experience with rich visual and tactile sensations.
With TECNO Pocket Go, users can enjoy a futuristic gaming experience, and seamlessly connecting to TECNO’s products in a new forms of AR experiences.
View original content:https://www.prnewswire.co.uk/news-releases/tecno-pocket-go-wins-global-product-technology-innovation-award-2024-at-ifa-2024-302241146.html
Artificial Intelligence
Experience the Future of Smart Living with Hisense at IFA 2024
![experience-the-future-of-smart-living-with-hisense-at-ifa-2024](https://roboticulized.com/wp-content/uploads/2024/09/153019-experience-the-future-of-smart-living-with-hisense-at-ifa-2024.jpg)
QINGDAO, China, Sept. 7, 2024 /PRNewswire/ — Hisense, a global leader in home appliances and consumer electronics, unveiled its innovative smart home solutions at IFA 2024. Based on the theme “The Scenario-driven Future of Tech,” Hisense showcased its latest smart home appliances and the ConnectLife app, designed to seamlessly connect appliances and real-life scenarios to redefine how users interact with their homes.
Focused on enhancing the user experience, Hisense’s booth at IFA 2024 brings to life three smart scenarios and products that aim to make the future of smart living more intuitive and accessible: Smart Laundry, Smart Kitchen and Smart Air Care.
Each experience is developed through Hisense’s scenario-driven research and development approach that prioritizes real user needs:
Smart Laundry simplifies garment care with automated adjusting and remote monitoring.Smart Kitchen streamlines cooking with connected appliances that personalize meal prep.Smart Air Care ensures a healthier living environment by intelligently adjusting air quality.To bring the smart living scenarios to life, Hisense has introduced a range of innovative products that integrate seamlessly with the ConnectLife app.
The Hisense Refrigerator PureFlat Smart Series exemplifies the premium smart kitchen experience enabled by ConnectLife. Equipped with a 21-inch TFT touchscreen, this refrigerator offers a wealth of features. The AI Recipe feature leverages food inventory tracking to suggest personalized recipes based on available ingredients and their expiration dates. Serving as a home appliance control center, the ConnectLife Hub refrigerator allows you to adjust temperature settings remotely through the ConnectLife app. Additionally, its AI Eco feature enables you to activate energy-saving mode on your device with a simple touch. With dual-tech cooling system, a My Fresh Choice compartment, and an on-door ice and water dispenser, this refrigerator delivers efficient temperature control, flexible storage options, and convenient access to cold beverages.
The Hisense Series 7i washing machines offer a superior laundry experience with a suite of smart features. The iPlay™ Intelligent Display provides a user-friendly interface, while the iJet™ three-channel spray system ensures a thorough wash. The compact iFit™ feature allows for easy integration into cabinets, optimizing space. AI-powered capabilities enhance performance with AI Super Wash, which intelligently adjusts washing parameters based on load weight, material type, water level, hardness, and turbidity. The AI Super Dry program in the Series 7i tumble dryer delivers precise drying with 3D Humidity Sensor for accurate moisture detection.
The Hisense’s Hi8 Series Oven offers a range of cooking functions, including air-frying, fast preheating, and pizza mode. Its large capacity and cool-touch doors make it easy to cook with and also clean. The VisonPlus Screen provides a user-friendly interface for exploring cooking programs and settings. Cleaning is made simple with features including Steam Clean Pro, Pyrolytic Self Clean, and Removable Door&Glass. The Hisense Hi 9 Series Oven is a premium model that offers advanced features such as AI-powered InCamera Technology for intelligent baking, Auto Door Opening & Auto Lock. Its larger TFT screen provides a user-friendly interface for exploring over 140 pre-programmed recipes and cooking settings. With ConnectLife integration, the Hi 9 delivers a convenient and efficient cooking experience.
Hisense Energy Pro X air conditioners offer efficient cooling and heating with advanced, energy-saving features. The AI Smart Airflow adjusts airflow direction based on your position and needs, ensuring optimal comfort. HI-NANO technology enhances air quality by releasing high-concentration ions to eliminate 92.6% of H1N1, 88.54% of E. coli, and 60.07% of PM2.5 in two hours. The TMS Control System intelligently adjusts temperature and humidity by analyzing various indoor conditions, providing a tailored and comfortable environment.
Beyond residential air conditioning, Hisense Hi-Therma ATW heat pump is another popular option for room heating, especially in Europe. Renowned for their outstanding performance and eco-friendly features, Hisense Hi-Therma II R290 ATW boasts an A+++ energy efficiency rating, stable operation at temperatures as low as -25°C, and maximum water outlet temperature of 65°C, with the flexibility to control up to 7 independent rooms. Moreover, the first-generation Hi-Therma Split (R32) finished the rigorous winter test conducted by Germany’s VDE and obtained the No. 001 certification in the extremely cold city of Mohe, China.
About Hisense
Hisense is a leading global home appliance and consumer electronics brand and official partner of the UEFA EURO 2024™. According to Omdia, Hisense ranked No. 2 globally for TV shipments and No. 1 in 100″ TVs in both 2023 and Q1 2024. The company has expanded quickly to operate in more than 160 countries and specializes in multi-media goods, home appliances, and intelligent IT information.
View original content:https://www.prnewswire.co.uk/news-releases/experience-the-future-of-smart-living-with-hisense-at-ifa-2024-302241143.html
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