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Molded Pulp Packaging Market worth $5.7 billion by 2027 – Exclusive Report by MarketsandMarkets™

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The report Molded Pulp Packaging Market  by Molded Type (Thickwall, Transfer Molded, Thermoformed Fiber and Processed Pulp), Product Type (Trays, Clamshells, Cups, Plates, Bowls), End-Use, Source (Wood Pulp and Non Wood Pulp), and Region – Global Forecast to 2027″, is approximated to be USD 4.6 billion in 2022, and it is projected to reach USD 5.7 billion by 2027, at a CAGR of 4.3%.

Molded fiber pulp packaging solely involves the usage of wood pulp or recycled wastepaper material that can be recycled again after its useful life cycle. It includes products such as end caps, trays, plates, bowls, and clamshell containers. The global molded fiber pulp packaging market has witnessed considerable growth in recent years, mainly driven by features such as recyclability, low weight, and lower cost. Changing lifestyles and increased consumer spending on packaged foods are factors contributing to the growth in demand for molded fiber pulp packaging.

Browse in-depth TOC on “Molded Pulp Packaging Market

213 – Tables 
50 – Figures 
238 – Pages

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By Molded Type, Thermoformed Fiber accounted for the second largest share in 2021

Thermoformed is also known as thin-wall molded fiber packaging which is manufactured using multiple heated molds with product thickness ranging from 3/32 to 5/32 inches, which is 2mm to 4mm. The surfaces of the thermoformed type of pulp packaging are smooth, and forms are well detailed with minimal draft angles. Due to the multiple heated mold process, the walls are comparatively denser. Thermoformed fiber products closely resemble thermoformed plastic materials. This technique is most widely used to make clamshells and food service disposables such as cups, plates, bowls, and cutlery. This type of molded pulp packaging is also used for high-definition applications where appearance is of prime importance.

By Product Type, cups accounted for the third largest share in 2021.

Molded fiber cups are another form of wide-mouth disposable packaging that is produced using non-wood pulp such as sugarcane bagasse & rice straw pulp, and soft & hardwood pulp such as newsprint paper slurry and wood pulp. These cups are widely used in food service packaging and for products such as butter, chocolates, tomato sauce, preserves, dairy products (cheese, milk cream, and yogurt with and without fruit pieces), mayonnaise, jam, honey, and edible oil.

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By Source, Non-Wood Pulp accounted for second the largest share in 2021.

The use of trees for paper production has contributed to the problem of deforestation with a huge negative impact on the environment, thereby causing an imbalance in the ecosystem. An increase in the demand and consumption of paper has also induced the depletion of wood resources for paper production, thus resulting in the limited availability of raw materials. Hence, non-wood pulp is used as an alternative raw material which is accessible and convertible into pulp and paper of the same quality as that obtained from wood.

This pulp is generally in the form of agricultural food crop residues, grasses, and tree leaves that do not have immediate applications. It is processed and used as an excellent alternative for wood pulp, offering the same properties and benefits.

By End Use, Healthcare segment accounted for the third largest share in 2021

Healthcare products, which include pharmaceutical, nutraceutical, and life science products, are required to be protected from external conditions such as light and moisture as well as contamination and physical damage, as these can alter the quality of products. Being temperature-sensitive and fragile, the quality of the packaging plays a very important role in the protection of these products. Delivering these products all around the globe, through variations in temperatures, is a significant challenge for the packaging industry. Molded fiber pulp packaging offers the required protection to products. Trays are the widely used molded pulp packaging products in the healthcare sector.

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Europe is accounted for the third largest share of the Molded pulp packaging market in 2021

As compared to the North American region, the molded fiber pulp packaging market in Europe is more regulated. The European Association of Plastics Recycling and Recovery Organizations (EPRO) is responsible for promoting and organizing recycling and recovery of plastics throughout Europe. Organizations such as the European Organization for Packaging and the Environment (EUROPEN) and the UK-based Industry Council for Packaging and the Environment (INCPEN) are focusing on implementing effective practices that make use of recyclable and reusable materials to manufacture sustainable packaging products. The European Union (EU) is among the top four egg-producing regions globally. These factors are expected to fuel the demand for molded pulp packaging in the region. Factors such as the increasing presence of urbanized population and growing healthcare and personal care sectors in this region also have contributed to the demand for sustainable packaging solutions such as molded fiber pulp packaging.

Market Players

Molded pulp packaging market comprises major players such as players Huhtamaki Oyj (Finland), Bordrene Hartmann A/S (Denmark), Genpack LLC(US), James Cropper 3D products Ltd., PrimWare-by Prim Link Solutions (US), Sonoco Products Co. (US) and UFP Technologies (US), Sabert Corporation (US), Fabri-Kal(US), Pro-Pac Packaging(Australia), and others are covered in the molded fiber pulp packaging market. Expansions, acquisitions, joint ventures, and new product developments are some of the major strategies adopted by these key players to enhance their positions in the Molded pulp packaging Market.

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Elevate Your Virtual Reality Experience with KIWI design RGB Vertical Stand, Now Available on Meta’s Website

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LOS ANGELES, May 11, 2024 /PRNewswire/ — Top-tier VR accessories provider KIWI design has launched its latest product, the RGB Vertical Stand. This Meta-authorized accessory, designed to deepen users’ immersion in the metaverse, is now available on the official Meta website.

“KIWI design’s commitment to pushing the boundaries of virtual reality accessories takes another leap forward with the introduction of our new products,” said Ray,the CEO of KIWI design. “We are always dedicated to bringing innovative upgrades to VR device accessories, with the goal of enriching users’ virtual reality experiences.”
The newly launched RGB Vertical Stand features a user-friendly modular design with push-in assembly, making it easy to set up and use. It is compatible with Meta Quest 3, Quest 2, and Quest Pro, ensuring widespread usability. With a magnetic USB Type-C connector, it provides an effortless way to charge and display your headset. Users can also customize their display with 16 pre-set ambient multicolor RGB light options.
With VR technology constantly evolving, users are seeking more immersive experiences. As a leading manufacturer of VR accessories, KIWI design is committed to enhancing the user experience, through unique product designs. Since its establishment in 2015, KIWI design has acquired over 100 patents and has a diverse product lineup, including head straps, facial interfaces, VR stands, charging accessories, and controller grip covers.
KIWI design has also actively participated in the Made for Meta program, which is provided by Meta to strengthen its partnerships with leading brands to deliver accessories that enhance Meta products with more choice and a richer experience for everyone. KIWI design’s participation in this program validates its high-quality design standards.
The RGB Vertical Stand for Meta Quest 3, Quest 2, and Quest Pro and another specially designed authorized charging dock for the Meta  Oculus Quest 2 are now available for purchase on both KIWI design’s website and Amazon. For more information about our brand and products, please visit our website and follow KIWI design on Facebook, Instagram, X, YouTube and TikTok.
https://www.kiwidesign.com/
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WIO Taps Gracenote to Revolutionize Television Broadcast Reporting

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LOS ANGELES, May 11, 2024 /PRNewswire/ — WIO LLC, parent company of the global TV broadcast airings platform, WIOpro™, has announced a new strategic agreement with Gracenote, the global content data business unit of Nielsen, to address the longstanding challenge of accurately tracking and collecting music royalties generated by broadcast television and digital programming, With this agreement, WIO will integrate Gracenote TV program metadata and show airings into its WIOpro™ (“When’s It On – Professional”) platform enabling performance rights organizations, copyright management organizations and other entities to better monitor broadcast schedules and identify when royalties have been earned.

By integrating Gracenote historical program data into WIOpro’s new LookBack™ feature, WIO is enhancing its reporting capabilities and empowering Collection Societies, Rights Management Companies and the royalty-earning community to more easily monitor and export broadcast airings and better understand collections opportunities.
“At WIO, we are committed to empowering collection societies and copyright holders around the world with our platform tools and unprecedented access to the best and most accurate television broadcast and streaming data available,” said Shawn Pierce, Co-Founder and CEO of WIO LLC. “We have enjoyed an incredible relationship with Gracenote for 10 years. With the solidification of this agreement, we are able to deliver an unrivaled dataset to the royalty and residual community in a way that has not been offered before.” said Adam Shafron, Co-Founder and CTO of WIO LLC.
“WIO’s platform developed to solve the difficult matter of royalty tracking only becomes more powerful based on the integration of accurate, timely and comprehensive Gracenote metadata,” said Scott Monahan, Director, Strategic Partnerships, Gracenote. “We look forward to the combination of WIOpro’s technology and Gracenote’s program metadata delivering on the promise of transforming music royalty collection so that rights holders can be fairly compensated for use of their work.”
WIO and Gracenote will be at the MusicBiz 2024 conference in Nashville, TN May 13 – 16. Contact Dave Pelman, COO of WIO LLC at [email protected] for media queries or to book an appointment for a product demonstration.
About WIO:WIO is a technology company dedicated to providing broadcast television and digital programming data tailored specifically for the royalty and residual collection industry. Through its platform WIOpro (wiopro.com), users obtain access to real-time broadcast insights, reporting and curated data delivery.
About Gracenote:Gracenote is the content data business unit of Nielsen providing entertainment metadata, connected IDs and related offerings to the world’s leading creators, distributors and platforms. Gracenote enables advanced content navigation and discovery capabilities helping individuals easily connect to the TV shows, movies, music, podcasts and sports they love while delivering powerful content analytics making complex business decisions simpler.
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IDTechEx Explores Printed Electronics in Electrified and Autonomous Mobility

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BOSTON, May 10, 2024 /PRNewswire/ — Electrification, autonomy, and vehicle ownership saturation are causing a technological revolution in the automotive sector. These automotive meta-trends are driving drastic changes in electronic component requirements and present a high-volume opportunity for printed electronics to capitalize on.

Historically, printed electronics technologies have nurtured a close relationship with the automotive sector, with printed force sensors pioneering passenger safety through seat occupancy and seatbelt detection. As such, the automotive sector continues to represent the lion’s share of the global printed and flexible sensor market, which IDTechEx’s report on the topic evaluates as worth US$421M in 2024. However, if the automotive sector is to continue to be a reliable revenue stream, printed electronics technology providers must adapt to address the emerging technical challenges facing future mobility.
Augmenting autonomous vehicles with printed electronics
As vehicle autonomy levels advance, the increasing number and distribution of spatial mapping sensors required will need continuous performance improvements to ensure passenger safety. Emerging printed electronics technologies can augment these sensors, extending detection bandwidth and maximizing reliability during operation.
Transparent conductive films (TCFs) are being developed to heat and defog LiDAR sensor panels, ensuring the function is unperturbed by external environmental conditions. Properties such as high transparency and low haze are important for defogging. These properties can be easily tuned using the wide variety of material options available for TCFs, including carbon nanotubes and silver nanowires.
IDTechEx identifies printed heating as a leading application of transparent conductive films. This is attributed to diminishing growth prospects in capacitive touch sensing applications. Innovations in thin film coating techniques have enabled indium tin oxide (ITO) to dominate touch sensing applications, all but displacing TCFs completely.
Looking towards the future, printed electronics technologies could play a more active role in advanced autonomous driving. Emerging semiconductive materials, such as quantum dots, printed directly onto conventional silicon image sensor arrays can extend detection range and sensitivity deeper into the infrared region. Augmenting existing image sensor technology with enhanced spectral range could facilitate the competition of hybrid silicon sensors with established InGaAs detectors.
Printed sensors promise granularized battery health monitoring
Vehicle electrification is driving the sustained development and evolution of electronic management systems, particularly in the battery and electric drivetrain. A strong market pull exists for technologies that increase vehicle efficiency, range, and lifetime while reducing recharge times.
Printed pressure and temperature sensors measure battery cell swelling and thermal profiles, providing granularized physical data that can be used to optimize battery deployment and recharging. Moreover, hybrid printed sensors that combine integrated printed heating elements promise a solution to actively address battery temperature. IDTechEx estimates that printed sensor-enabled battery deployment and charging optimizations could be worth up to US$3000 in savings per vehicle.
There remains uncertainty about whether electrification trends will correspond to increased demand for physical sensors in electric vehicle batteries, owing to the utility of existing electronic readouts for managing deployment. Virtual sensors also pose a threat, where AI-enabled software models interpret data to predict and emulate physical sensor functions without the need for discreet components. However, emerging regulations regarding safety and sensor redundancy will likely favor measurable metrics and see automotive makers continue to adopt physical sensors. IDTechEx predicts that virtual sensors are unlikely to displace their physical counterparts – so long as low-cost sensors remain widely available.
Embedding printed electronics in the car of the future
IDTechEx predicts that global car sales will saturate over the next decade, with automakers increasingly looking for premium features and technical innovations to differentiate themselves from the competition. In-cabin technologies will be highly desirable – as the location where passengers reside and interact with the vehicle the most.
Lighting elements are emerging as a prominent differentiator, described as “the new chrome” by Volkswagen’s chief designer. The use of in-mold structural electronics (IMSE) enables the integration of embedded lighting elements using existing manufacturing processes. 3D electronics technologies are intrinsically attractive for automotive integration, as functional layers are conformable and lightweight while easily embedded within existing aesthetic elements.
Despite strong tailwinds, the adoption of in-mold electronics within automotive interiors has been sluggish. This is attributed to the challenges of meeting automotive qualification requirements, as well as stiff competition with less sophisticated alternatives such as applying functional films to thermoformed parts. Nevertheless, momentum is building, with technology providers like Tactotek partnering with Mercedes-Benz and Stallantis to progress the automotive validation of IMSE to TRL5.
Outlook for printed electronics in automotive applications
Just as printed force sensors heralded early passenger safety systems, printed electronics technology is poised to underpin next-generation innovations for the car of the future. But this time, the competition will be stiff. Critical cost requirements must be met, while desirable new functionality must address existing challenges faced by manufacturers. Printed electronics can play a role in supporting emerging electrified and autonomous mobility, such as augmenting LiDAR sensors or optimizing electric battery deployment. Demand for technologies that enhance passenger experience and vehicle aesthetics will continue to grow, and printed electronics can supply low-power, lightweight lighting solutions for these.
Sustained engagement from tier suppliers and manufacturers continues to make the automotive sector key to printed sensor market growth opportunities – a total market IDTechEx predicts will reach US$960M by 2034. Strong partnerships between material providers and printed electronics technology providers are complementary to those of the highly vertically integrated automotive value chains between tier suppliers and OEMs. Leveraging printing techniques to provide solutions that slot into existing manufacturing processes and designs will be crucial. In the medium term, the printed electronics technologies most likely to realize revenue potential are those that can adapt to service emerging challenges already known to the automotive industry.
For more information on IDTechEx’s research on this topic, please see their report, “Printed and Flexible Sensors 2024-2034: Technologies, Players, Markets”. Downloadable sample pages are available for this report.
For the full portfolio of printed and flexible electronics market research from IDTechEx, please visit www.IDTechEx.com/Research/PE.
About IDTechEx:
IDTechEx provides trusted independent research on emerging technologies and their markets. Since 1999, we have been helping our clients to understand new technologies, their supply chains, market requirements, opportunities and forecasts. For more information, contact [email protected] or visit www.IDTechEx.com. 
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